HK1206867A1 - Downholder for holding down the substrate places of a substrate - Google Patents

Downholder for holding down the substrate places of a substrate

Info

Publication number
HK1206867A1
HK1206867A1 HK15107362.8A HK15107362A HK1206867A1 HK 1206867 A1 HK1206867 A1 HK 1206867A1 HK 15107362 A HK15107362 A HK 15107362A HK 1206867 A1 HK1206867 A1 HK 1206867A1
Authority
HK
Hong Kong
Prior art keywords
substrate
downholder
holding down
places
substrate places
Prior art date
Application number
HK15107362.8A
Other languages
English (en)
Chinese (zh)
Inventor
Guido Suter
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of HK1206867A1 publication Critical patent/HK1206867A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Actuator (AREA)
  • Die Bonding (AREA)
  • Road Paving Machines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
HK15107362.8A 2013-12-09 2015-07-31 Downholder for holding down the substrate places of a substrate HK1206867A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH02035/13A CH708932B1 (en) 2013-12-09 2013-12-09 Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.

Publications (1)

Publication Number Publication Date
HK1206867A1 true HK1206867A1 (en) 2016-01-15

Family

ID=53185405

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107362.8A HK1206867A1 (en) 2013-12-09 2015-07-31 Downholder for holding down the substrate places of a substrate

Country Status (7)

Country Link
JP (1) JP6627143B2 (xx)
KR (1) KR20150067019A (xx)
CN (1) CN104701220B (xx)
CH (1) CH708932B1 (xx)
DE (1) DE102014116939A1 (xx)
HK (1) HK1206867A1 (xx)
SG (1) SG10201407399PA (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023110438A1 (de) 2023-04-24 2024-10-24 Besi Switzerland Ag Vorrichtung mit einer verbesserten Niederhaltevorrichtung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120834A (ja) * 1987-11-04 1989-05-12 Nec Corp 半導体素子のダイボンディング装置
JPH0538884U (ja) * 1991-10-28 1993-05-25 関西日本電気株式会社 リードボンダ
JPH06252210A (ja) * 1993-02-25 1994-09-09 Nec Kansai Ltd インナーリードボンダ
US5556808A (en) * 1994-06-30 1996-09-17 Motorola Inc. Method for aligning a semiconductor device
JP2000021930A (ja) * 1998-07-01 2000-01-21 Nippon Avionics Co Ltd 熱圧着装置
DE10058145B4 (de) * 1999-11-26 2006-12-28 Smc K.K. Zylindervorrichtung
JP3850351B2 (ja) * 2002-04-25 2006-11-29 京セラ株式会社 電子部品素子の実装方法
US7048174B2 (en) * 2003-08-25 2006-05-23 The Boeing Company Adaptable spring force clamping apparatus and methods
JP4241683B2 (ja) * 2005-07-06 2009-03-18 パナソニック株式会社 部品押圧装置
FR2905883B1 (fr) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
JP4839407B2 (ja) * 2007-11-08 2011-12-21 株式会社アルバック 貼合せ基板製造装置および貼合せ基板製造方法
JP5359009B2 (ja) * 2008-04-18 2013-12-04 株式会社ニコン 半導体基板の貼り合わせ装置
CN201262949Y (zh) * 2008-09-04 2009-06-24 浙江华越芯装电子股份有限公司 集成电路热压超声球焊机改进型压焊夹具
WO2011036900A1 (ja) * 2009-09-28 2011-03-31 株式会社ニコン 加圧モジュール、加圧装置及び基板貼り合せ装置
JP5580163B2 (ja) * 2010-10-13 2014-08-27 東レエンジニアリング株式会社 実装装置の平行度調整方法および平行度調整装置
TWI564106B (zh) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 接合裝置以及接合方法
JP2013143542A (ja) * 2012-01-12 2013-07-22 Tokyo Electron Ltd 半導体デバイス製造システム及び半導体デバイス製造方法
SG11201405431TA (en) * 2012-03-07 2014-10-30 Toray Industries Method and apparatus for manufacturing semiconductor device

Also Published As

Publication number Publication date
SG10201407399PA (en) 2015-07-30
CH708932B1 (en) 2017-04-13
CN104701220B (zh) 2019-07-23
KR20150067019A (ko) 2015-06-17
CN104701220A (zh) 2015-06-10
CH708932A1 (de) 2015-06-15
JP6627143B2 (ja) 2020-01-08
DE102014116939A1 (de) 2015-06-11
JP2015115606A (ja) 2015-06-22

Similar Documents

Publication Publication Date Title
HK1219439A1 (zh) 用於表面的塗層
GB2521727B (en) Array substrate
SG10201408517YA (en) Microstructures for improved wafer handling
EP2978018A4 (en) METHOD FOR PRODUCING A CURRENT MODULE SUBSTRATE
EP2946410A4 (en) TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES
HK1222950A1 (zh) 使用公共基板的測距相機
HK1211427A1 (en) A surface coating
SG10201803039XA (en) Towers for substrate carriers
EP2966679A4 (en) METHOD FOR PRODUCING A CURRENT MODULE SUBSTRATE
EP2979767A4 (en) plasma spraying
SG11201601609RA (en) Glass substrate
GB2511418B (en) Substrate carrier
SG10201401558XA (en) Substrate cleaning apparatus
EP3043630A4 (en) WORKING DEVICE FOR A SUBSTRATE
SG10201404675XA (en) Deposition apparatus
GB2579491B (en) Protective coating for a substrate
EP2974869A4 (en) DEVICE FOR DISCHARGING DROPLETS
EP2963676A4 (en) SUSCEPTOR
SG11201508998PA (en) Methods of forming a substrate opening
HK1218396A1 (zh) 用於基材的塗層
AU352839S (en) A carrier
SG11201510638XA (en) Process for locating devices
HUE037092T2 (hu) Hordozómûveleti eszköz
HK1206867A1 (en) Downholder for holding down the substrate places of a substrate
SG11201509066UA (en) Deposition apparatus

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20231207