GB2511418B - Substrate carrier - Google Patents

Substrate carrier

Info

Publication number
GB2511418B
GB2511418B GB1401015.1A GB201401015A GB2511418B GB 2511418 B GB2511418 B GB 2511418B GB 201401015 A GB201401015 A GB 201401015A GB 2511418 B GB2511418 B GB 2511418B
Authority
GB
United Kingdom
Prior art keywords
substrate carrier
carrier
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1401015.1A
Other versions
GB201401015D0 (en
GB2511418A (en
Inventor
Newton Andrew
Piekarniak Piotr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxford Instruments Nanotechnology Tools Ltd
Original Assignee
Oxford Instruments Nanotechnology Tools Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxford Instruments Nanotechnology Tools Ltd filed Critical Oxford Instruments Nanotechnology Tools Ltd
Publication of GB201401015D0 publication Critical patent/GB201401015D0/en
Publication of GB2511418A publication Critical patent/GB2511418A/en
Application granted granted Critical
Publication of GB2511418B publication Critical patent/GB2511418B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
GB1401015.1A 2013-01-22 2014-01-21 Substrate carrier Active GB2511418B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1301124.2A GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier

Publications (3)

Publication Number Publication Date
GB201401015D0 GB201401015D0 (en) 2014-03-05
GB2511418A GB2511418A (en) 2014-09-03
GB2511418B true GB2511418B (en) 2018-04-04

Family

ID=47843717

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB1301124.2A Ceased GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier
GB1401015.1A Active GB2511418B (en) 2013-01-22 2014-01-21 Substrate carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB1301124.2A Ceased GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier

Country Status (3)

Country Link
GB (2) GB201301124D0 (en)
TW (1) TW201438137A (en)
WO (1) WO2014114927A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101692251B1 (en) * 2014-08-06 2017-01-03 (주)얼라이드 테크 파인더즈 Plasma device
WO2018013421A1 (en) * 2016-07-09 2018-01-18 Applied Materials, Inc. Substrate carrier
GB201709446D0 (en) * 2017-06-14 2017-07-26 Semblant Ltd Plasma processing apparatus
CN111613506B (en) * 2020-05-22 2023-10-13 北京北方华创微电子装备有限公司 Semiconductor chamber's fixed subassembly and semiconductor chamber
CN112885738B (en) * 2020-09-03 2024-02-23 天虹科技股份有限公司 Wafer fixing mechanism and wafer pre-cleaning machine using same
TWI799120B (en) * 2020-11-13 2023-04-11 天虹科技股份有限公司 Wafer pre-cleaning apparatus
TWI747611B (en) * 2020-11-13 2021-11-21 天虹科技股份有限公司 Wafer pre-cleaning apparatus
TWI761270B (en) * 2020-11-13 2022-04-11 天虹科技股份有限公司 Wafer pre-cleaning apparatus
CN112563164B (en) * 2020-11-25 2022-07-12 鑫天虹(厦门)科技有限公司 Wafer pre-cleaning machine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US5262029A (en) * 1988-05-23 1993-11-16 Lam Research Method and system for clamping semiconductor wafers
EP0692815A2 (en) * 1994-07-11 1996-01-17 Applied Materials, Inc. Method and apparatus for etching film layers on large substrates
US20120040097A1 (en) * 2010-08-13 2012-02-16 Veeco Instruments Inc. Enhanced wafer carrier
US20120075460A1 (en) * 2010-09-28 2012-03-29 Tokyo Electron Limited Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US5262029A (en) * 1988-05-23 1993-11-16 Lam Research Method and system for clamping semiconductor wafers
EP0692815A2 (en) * 1994-07-11 1996-01-17 Applied Materials, Inc. Method and apparatus for etching film layers on large substrates
US20120040097A1 (en) * 2010-08-13 2012-02-16 Veeco Instruments Inc. Enhanced wafer carrier
US20120075460A1 (en) * 2010-09-28 2012-03-29 Tokyo Electron Limited Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method

Also Published As

Publication number Publication date
GB201401015D0 (en) 2014-03-05
WO2014114927A1 (en) 2014-07-31
GB201301124D0 (en) 2013-03-06
GB2511418A (en) 2014-09-03
TW201438137A (en) 2014-10-01

Similar Documents

Publication Publication Date Title
GB2521727B (en) Array substrate
SG11201509970WA (en) Improved wafer carrier having thermal uniformity-enhancing features
EP2967231A4 (en) Child carrier
SG11201602916VA (en) Towers for substrate carriers
GB2511418B (en) Substrate carrier
GB201318238D0 (en) Child carrier
IL245928A0 (en) Free-flowing carrier elements
SG11201601609RA (en) Glass substrate
AU354078S (en) Carrier
HK1215506A1 (en) Carrier allocation
GB201416836D0 (en) Drinks carrier
HK1193500A1 (en) Substrate with built-in component
EP2963676A4 (en) Susceptor
HK1218396A1 (en) Coating for substrate
EP3054596A4 (en) Switching substrate
AU352839S (en) A carrier
AP00445S1 (en) Substrate
HK1220545A1 (en) Substrate for mounting led led
GB2512593B (en) A carrier
EP3033057A4 (en) A substrate
PL2969843T3 (en) Container carrier
GB201313921D0 (en) Bicycle carrier
GB201304735D0 (en) A carrier
ZA201407253B (en) Carrier arrangement
ZA201304544B (en) Carrier