SG10201803039XA - Towers for substrate carriers - Google Patents
Towers for substrate carriersInfo
- Publication number
- SG10201803039XA SG10201803039XA SG10201803039XA SG10201803039XA SG10201803039XA SG 10201803039X A SG10201803039X A SG 10201803039XA SG 10201803039X A SG10201803039X A SG 10201803039XA SG 10201803039X A SG10201803039X A SG 10201803039XA SG 10201803039X A SG10201803039X A SG 10201803039XA
- Authority
- SG
- Singapore
- Prior art keywords
- towers
- substrate carriers
- carriers
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361890611P | 2013-10-14 | 2013-10-14 | |
| US201461940744P | 2014-02-17 | 2014-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201803039XA true SG10201803039XA (en) | 2018-05-30 |
Family
ID=52828621
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201803039XA SG10201803039XA (en) | 2013-10-14 | 2014-10-14 | Towers for substrate carriers |
| SG11201602916VA SG11201602916VA (en) | 2013-10-14 | 2014-10-14 | Towers for substrate carriers |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201602916VA SG11201602916VA (en) | 2013-10-14 | 2014-10-14 | Towers for substrate carriers |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10347517B2 (en) |
| EP (2) | EP3058585B1 (en) |
| JP (1) | JP6334716B2 (en) |
| KR (1) | KR102093200B1 (en) |
| CN (1) | CN105900217B (en) |
| SG (2) | SG10201803039XA (en) |
| TW (1) | TWI606534B (en) |
| WO (1) | WO2015057739A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9841671B2 (en) * | 2013-07-03 | 2017-12-12 | Murata Machinery, Ltd. | Storage container |
| JP6562078B2 (en) * | 2015-08-31 | 2019-08-21 | 村田機械株式会社 | Purge apparatus, purge stocker, and purge method |
| KR102090046B1 (en) * | 2015-09-04 | 2020-03-17 | 엔테그리스, 아이엔씨. | Internal purge diffuser with offset manifold |
| TWI709441B (en) * | 2016-09-05 | 2020-11-11 | 美商恩特葛瑞斯股份有限公司 | Substrate container and purge tower assembly for the substrate container |
| KR102373746B1 (en) * | 2016-09-06 | 2022-03-15 | 신에츠 폴리머 가부시키가이샤 | Substrate storage container and gas replacement unit |
| WO2018135222A1 (en) * | 2017-01-18 | 2018-07-26 | 信越ポリマー株式会社 | Substrate storage container and gas substitution unit |
| DE112018001612T5 (en) * | 2017-03-27 | 2020-01-16 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
| WO2018203384A1 (en) | 2017-05-02 | 2018-11-08 | ミライアル株式会社 | Substrate storage container |
| CN112074944B (en) | 2018-04-25 | 2024-07-05 | 未来儿股份有限公司 | Substrate container |
| KR20230134612A (en) * | 2018-08-28 | 2023-09-21 | 엔테그리스, 아이엔씨. | Membrane diffuser for a substrate container |
| WO2020121448A1 (en) * | 2018-12-12 | 2020-06-18 | ミライアル株式会社 | Substrate accommodating container |
| JP2020150245A (en) * | 2019-03-13 | 2020-09-17 | 國立臺北科技大學 | Gas diffusing device and substrate carrier thereof |
| KR102662971B1 (en) * | 2019-04-26 | 2024-05-03 | 엔테그리스, 아이엔씨. | Purge connections and modules for substrate containers |
| US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
| US20230054753A1 (en) * | 2021-08-17 | 2023-02-23 | Gudeng Precision Industrial Co., Ltd. | Gas diffusion device, and wafer container including the same |
| WO2023183517A1 (en) * | 2022-03-25 | 2023-09-28 | Entegris, Inc. | Wafer container purge port assembly |
| US20230411192A1 (en) * | 2022-05-27 | 2023-12-21 | Entegris, Inc. | Filter module |
| US20240222172A1 (en) * | 2022-12-30 | 2024-07-04 | Entegris, Inc. | Substrate container with purge gas diffuser |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5364007A (en) * | 1993-10-12 | 1994-11-15 | Air Products And Chemicals, Inc. | Inert gas delivery for reflow solder furnaces |
| US5879458A (en) | 1996-09-13 | 1999-03-09 | Semifab Incorporated | Molecular contamination control system |
| JP2002170876A (en) * | 2000-12-04 | 2002-06-14 | Ebara Corp | Substrate transport container |
| JP4374133B2 (en) | 2000-12-05 | 2009-12-02 | 株式会社日立国際電気 | Substrate processing apparatus and substrate processing method |
| US20030035713A1 (en) * | 2001-08-20 | 2003-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Moisture-controlled wafer storage container and method of using |
| JP4204302B2 (en) | 2002-10-25 | 2009-01-07 | 信越ポリマー株式会社 | Storage container |
| US7201276B2 (en) | 2003-11-07 | 2007-04-10 | Entegris, Inc. | Front opening substrate container with bottom plate |
| CN101072620B (en) | 2004-06-07 | 2011-02-23 | 安格斯公司 | System and method for removing contaminants |
| KR100706250B1 (en) * | 2005-07-07 | 2007-04-12 | 삼성전자주식회사 | Apparatus and method for manufacturing semiconductor devices |
| JP2008066635A (en) * | 2006-09-11 | 2008-03-21 | Canon Inc | Apparatus for purging inside of container with purge gas |
| US7758338B2 (en) | 2007-05-29 | 2010-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier, port apparatus and facility interface and apparatus including same |
| KR101687836B1 (en) * | 2008-03-13 | 2016-12-19 | 엔테그리스, 아이엔씨. | Wafer container with tubular environmental control components |
| JP5241607B2 (en) * | 2009-05-21 | 2013-07-17 | 信越ポリマー株式会社 | Substrate storage container |
| US9054144B2 (en) * | 2009-12-10 | 2015-06-09 | Entegris, Inc. | Porous barrier for evenly distributed purge gas in a microenvironment |
| JP6087161B2 (en) | 2012-02-03 | 2017-03-01 | 東京エレクトロン株式会社 | Method for purging substrate container |
-
2014
- 2014-10-14 CN CN201480064391.1A patent/CN105900217B/en active Active
- 2014-10-14 SG SG10201803039XA patent/SG10201803039XA/en unknown
- 2014-10-14 WO PCT/US2014/060533 patent/WO2015057739A1/en active Application Filing
- 2014-10-14 TW TW103135504A patent/TWI606534B/en active
- 2014-10-14 JP JP2016548004A patent/JP6334716B2/en active Active
- 2014-10-14 KR KR1020167012401A patent/KR102093200B1/en active IP Right Grant
- 2014-10-14 SG SG11201602916VA patent/SG11201602916VA/en unknown
- 2014-10-14 US US15/029,605 patent/US10347517B2/en active Active
- 2014-10-14 EP EP14854237.6A patent/EP3058585B1/en active Active
- 2014-10-14 EP EP23171032.8A patent/EP4235759A3/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3058585A4 (en) | 2017-05-24 |
| EP4235759A3 (en) | 2023-10-04 |
| JP2016538732A (en) | 2016-12-08 |
| US10347517B2 (en) | 2019-07-09 |
| TWI606534B (en) | 2017-11-21 |
| TW201530679A (en) | 2015-08-01 |
| CN105900217A (en) | 2016-08-24 |
| JP6334716B2 (en) | 2018-05-30 |
| KR20160068937A (en) | 2016-06-15 |
| EP3058585B1 (en) | 2023-06-07 |
| EP4235759A2 (en) | 2023-08-30 |
| WO2015057739A1 (en) | 2015-04-23 |
| US20160276190A1 (en) | 2016-09-22 |
| SG11201602916VA (en) | 2016-05-30 |
| CN105900217B (en) | 2020-07-31 |
| KR102093200B1 (en) | 2020-03-25 |
| EP3058585A1 (en) | 2016-08-24 |
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