HK1206867A1 - Downholder for holding down the substrate places of a substrate - Google Patents

Downholder for holding down the substrate places of a substrate

Info

Publication number
HK1206867A1
HK1206867A1 HK15107362.8A HK15107362A HK1206867A1 HK 1206867 A1 HK1206867 A1 HK 1206867A1 HK 15107362 A HK15107362 A HK 15107362A HK 1206867 A1 HK1206867 A1 HK 1206867A1
Authority
HK
Hong Kong
Prior art keywords
substrate
downholder
holding down
places
substrate places
Prior art date
Application number
HK15107362.8A
Other languages
Chinese (zh)
Inventor
Guido Suter
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of HK1206867A1 publication Critical patent/HK1206867A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Actuator (AREA)
  • Die Bonding (AREA)
  • Road Paving Machines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
HK15107362.8A 2013-12-09 2015-07-31 Downholder for holding down the substrate places of a substrate HK1206867A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH02035/13A CH708932B1 (en) 2013-12-09 2013-12-09 Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.

Publications (1)

Publication Number Publication Date
HK1206867A1 true HK1206867A1 (en) 2016-01-15

Family

ID=53185405

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107362.8A HK1206867A1 (en) 2013-12-09 2015-07-31 Downholder for holding down the substrate places of a substrate

Country Status (7)

Country Link
JP (1) JP6627143B2 (en)
KR (1) KR20150067019A (en)
CN (1) CN104701220B (en)
CH (1) CH708932B1 (en)
DE (1) DE102014116939A1 (en)
HK (1) HK1206867A1 (en)
SG (1) SG10201407399PA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023110438A1 (en) 2023-04-24 2024-10-24 Besi Switzerland Ag Device with an improved hold-down device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120834A (en) * 1987-11-04 1989-05-12 Nec Corp Die bonding device for semiconductor element
JPH0538884U (en) * 1991-10-28 1993-05-25 関西日本電気株式会社 Lead bonder
JPH06252210A (en) * 1993-02-25 1994-09-09 Nec Kansai Ltd Inner lead bonder
US5556808A (en) * 1994-06-30 1996-09-17 Motorola Inc. Method for aligning a semiconductor device
JP2000021930A (en) * 1998-07-01 2000-01-21 Nippon Avionics Co Ltd Thermocompression bonding device
DE10058145B4 (en) * 1999-11-26 2006-12-28 Smc K.K. cylinder device
JP3850351B2 (en) * 2002-04-25 2006-11-29 京セラ株式会社 Electronic component element mounting method
US7048174B2 (en) * 2003-08-25 2006-05-23 The Boeing Company Adaptable spring force clamping apparatus and methods
JP4241683B2 (en) * 2005-07-06 2009-03-18 パナソニック株式会社 Parts pressing device
FR2905883B1 (en) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison METHOD FOR WELDING AN ORGAN ON A SUPPORT BY DELIVERING MATERIAL AND DEVICE FOR ARRANGING TWO ELEMENTS ON ONE ANOTHER
JP4839407B2 (en) * 2007-11-08 2011-12-21 株式会社アルバック Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
JP5359009B2 (en) * 2008-04-18 2013-12-04 株式会社ニコン Semiconductor substrate bonding equipment
CN201262949Y (en) * 2008-09-04 2009-06-24 浙江华越芯装电子股份有限公司 Improved bonding clamper for integrated circuit heat pressing ultrasound ball welder
WO2011036900A1 (en) * 2009-09-28 2011-03-31 株式会社ニコン Pressure applying module, pressure applying apparatus, and substrate bonding apparatus
JP5580163B2 (en) * 2010-10-13 2014-08-27 東レエンジニアリング株式会社 Parallelism adjusting method and parallelism adjusting device for mounting apparatus
TWI564106B (en) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 Bonding apparatus and bonding method
JP2013143542A (en) * 2012-01-12 2013-07-22 Tokyo Electron Ltd Semiconductor device manufacturing system and semiconductor device manufacturing method
SG11201405431TA (en) * 2012-03-07 2014-10-30 Toray Industries Method and apparatus for manufacturing semiconductor device

Also Published As

Publication number Publication date
SG10201407399PA (en) 2015-07-30
CH708932B1 (en) 2017-04-13
CN104701220B (en) 2019-07-23
KR20150067019A (en) 2015-06-17
CN104701220A (en) 2015-06-10
CH708932A1 (en) 2015-06-15
JP6627143B2 (en) 2020-01-08
DE102014116939A1 (en) 2015-06-11
JP2015115606A (en) 2015-06-22

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20231207