JP6619294B2 - 配線基板及びその製造方法と電子部品装置 - Google Patents

配線基板及びその製造方法と電子部品装置 Download PDF

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Publication number
JP6619294B2
JP6619294B2 JP2016103017A JP2016103017A JP6619294B2 JP 6619294 B2 JP6619294 B2 JP 6619294B2 JP 2016103017 A JP2016103017 A JP 2016103017A JP 2016103017 A JP2016103017 A JP 2016103017A JP 6619294 B2 JP6619294 B2 JP 6619294B2
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Japan
Prior art keywords
connection pad
insulating layer
wiring
wiring board
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016103017A
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English (en)
Japanese (ja)
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JP2017212271A5 (enExample
JP2017212271A (ja
Inventor
章司 渡辺
章司 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2016103017A priority Critical patent/JP6619294B2/ja
Priority to US15/601,225 priority patent/US10129980B2/en
Publication of JP2017212271A publication Critical patent/JP2017212271A/ja
Publication of JP2017212271A5 publication Critical patent/JP2017212271A5/ja
Application granted granted Critical
Publication of JP6619294B2 publication Critical patent/JP6619294B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
JP2016103017A 2016-05-24 2016-05-24 配線基板及びその製造方法と電子部品装置 Active JP6619294B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016103017A JP6619294B2 (ja) 2016-05-24 2016-05-24 配線基板及びその製造方法と電子部品装置
US15/601,225 US10129980B2 (en) 2016-05-24 2017-05-22 Circuit board and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016103017A JP6619294B2 (ja) 2016-05-24 2016-05-24 配線基板及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2017212271A JP2017212271A (ja) 2017-11-30
JP2017212271A5 JP2017212271A5 (enExample) 2019-01-31
JP6619294B2 true JP6619294B2 (ja) 2019-12-11

Family

ID=60420799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016103017A Active JP6619294B2 (ja) 2016-05-24 2016-05-24 配線基板及びその製造方法と電子部品装置

Country Status (2)

Country Link
US (1) US10129980B2 (enExample)
JP (1) JP6619294B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7032148B2 (ja) * 2018-01-17 2022-03-08 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP7001530B2 (ja) * 2018-04-16 2022-01-19 ルネサスエレクトロニクス株式会社 半導体装置
JP7183582B2 (ja) * 2018-06-19 2022-12-06 凸版印刷株式会社 ガラス配線基板
US11688706B2 (en) * 2020-09-15 2023-06-27 Micron Technology, Inc. Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems
JP2023043862A (ja) * 2021-09-16 2023-03-29 方略電子股▲ふん▼有限公司 電子装置
US20250293136A1 (en) * 2024-03-15 2025-09-18 Qualcomm Incorporated Buried bump structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195764A (ja) * 1998-01-05 1999-07-21 Nec Corp 半導体装置
JP3903249B2 (ja) * 2002-02-20 2007-04-11 富士通株式会社 半導体集積回路装置
JP4330367B2 (ja) * 2003-04-03 2009-09-16 新光電気工業株式会社 インターポーザー及びその製造方法ならびに電子装置
JP4480431B2 (ja) * 2004-03-18 2010-06-16 京セラ株式会社 多層配線基板
JP2005268672A (ja) * 2004-03-22 2005-09-29 Mitsubishi Electric Corp 基板
JP4844391B2 (ja) * 2004-05-21 2011-12-28 日本電気株式会社 半導体装置並びに配線基板及びその製造方法
JP4769056B2 (ja) 2005-10-07 2011-09-07 日本特殊陶業株式会社 配線基板及びその製法方法
JP2011044527A (ja) * 2009-08-20 2011-03-03 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
JP5675443B2 (ja) * 2011-03-04 2015-02-25 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP5886617B2 (ja) 2011-12-02 2016-03-16 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
JP2013247201A (ja) * 2012-05-24 2013-12-09 Shinko Electric Ind Co Ltd 配線基板、実装構造、及び配線基板の製造方法
JP6182309B2 (ja) * 2012-11-28 2017-08-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

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US10129980B2 (en) 2018-11-13
US20170347455A1 (en) 2017-11-30
JP2017212271A (ja) 2017-11-30

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