JP6611727B2 - 熱電デバイス及びシステム - Google Patents
熱電デバイス及びシステム Download PDFInfo
- Publication number
- JP6611727B2 JP6611727B2 JP2016558675A JP2016558675A JP6611727B2 JP 6611727 B2 JP6611727 B2 JP 6611727B2 JP 2016558675 A JP2016558675 A JP 2016558675A JP 2016558675 A JP2016558675 A JP 2016558675A JP 6611727 B2 JP6611727 B2 JP 6611727B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric
- semiconductor substrate
- holes
- etching
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461970322P | 2014-03-25 | 2014-03-25 | |
| US61/970,322 | 2014-03-25 | ||
| US201462013468P | 2014-06-17 | 2014-06-17 | |
| US62/013,468 | 2014-06-17 | ||
| PCT/US2015/022312 WO2015148554A1 (en) | 2014-03-25 | 2015-03-24 | Thermoelectric devices and systems |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017510992A JP2017510992A (ja) | 2017-04-13 |
| JP2017510992A5 JP2017510992A5 (enExample) | 2018-05-10 |
| JP6611727B2 true JP6611727B2 (ja) | 2019-11-27 |
Family
ID=54191580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016558675A Expired - Fee Related JP6611727B2 (ja) | 2014-03-25 | 2015-03-24 | 熱電デバイス及びシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9263662B2 (enExample) |
| EP (1) | EP3123532B1 (enExample) |
| JP (1) | JP6611727B2 (enExample) |
| KR (1) | KR20170026323A (enExample) |
| CN (1) | CN106537621B (enExample) |
| WO (1) | WO2015148554A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12352503B2 (en) | 2019-06-19 | 2025-07-08 | Pascal Lalanne | Thermoelectric device for storage or conversion of energy |
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| US9362015B2 (en) | 2010-12-16 | 2016-06-07 | The Regents Of The University Of Michigan | Silicon-based solar cell with eutectic composition |
| US20130019918A1 (en) | 2011-07-18 | 2013-01-24 | The Regents Of The University Of Michigan | Thermoelectric devices, systems and methods |
| US9595653B2 (en) | 2011-10-20 | 2017-03-14 | California Institute Of Technology | Phononic structures and related devices and methods |
| WO2013109729A1 (en) | 2012-01-17 | 2013-07-25 | Silicium Energy, Inc. | Systems and methods for forming thermoelectric devices |
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| KR101728937B1 (ko) * | 2014-09-05 | 2017-04-21 | 고려대학교 산학협력단 | 나노파이버 열전 발전 모듈, 그 제조방법 및 이를 위한 나노파이버 제조 전기 방사 장치 |
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| US20210249579A1 (en) * | 2015-05-14 | 2021-08-12 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs |
| US20210249580A1 (en) * | 2015-05-14 | 2021-08-12 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs |
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| US20170213951A1 (en) * | 2016-01-27 | 2017-07-27 | Korea Research Institute Of Standards And Science | Flexible thin multi-layered thermoelectric energy generating module, voltage boosting module using super capacitor, and portable thermoelectric charging apparatus using the same |
| TW201809931A (zh) | 2016-05-03 | 2018-03-16 | 麥崔克斯工業股份有限公司 | 熱電裝置及系統 |
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| US10473093B2 (en) * | 2016-08-26 | 2019-11-12 | Daegu Gyeongbuk Institute Of Science And Technology | Soft actuator using thermoelectric effect |
| US10347497B2 (en) | 2016-09-23 | 2019-07-09 | The Board Of Trustees Of The University Of Illinois | Catalyst-assisted chemical etching with a vapor-phase etchant |
| US10748781B2 (en) | 2016-09-23 | 2020-08-18 | The Board Of Trustees Of The University Of Illinois | Catalyst-assisted chemical etching with a vapor-phase etchant |
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| TW202118096A (zh) * | 2019-10-16 | 2021-05-01 | 日商科理克股份有限公司 | 熱電模組、及熱電模組用柱之製造方法 |
| WO2021079733A1 (ja) * | 2019-10-25 | 2021-04-29 | パナソニックIpマネジメント株式会社 | 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び/又は加熱する方法及び電子デバイス |
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| US12010916B2 (en) * | 2019-12-04 | 2024-06-11 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada | Compliant three-dimensional thermoelectrics |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12352503B2 (en) | 2019-06-19 | 2025-07-08 | Pascal Lalanne | Thermoelectric device for storage or conversion of energy |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180240957A1 (en) | 2018-08-23 |
| WO2015148554A1 (en) | 2015-10-01 |
| JP2017510992A (ja) | 2017-04-13 |
| CN106537621B (zh) | 2018-12-07 |
| US9263662B2 (en) | 2016-02-16 |
| US10644216B2 (en) | 2020-05-05 |
| US20150280099A1 (en) | 2015-10-01 |
| EP3123532A4 (en) | 2017-11-08 |
| EP3123532A1 (en) | 2017-02-01 |
| US20160197259A1 (en) | 2016-07-07 |
| CN106537621A (zh) | 2017-03-22 |
| KR20170026323A (ko) | 2017-03-08 |
| EP3123532B1 (en) | 2018-11-21 |
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