JP6611555B2 - プリント回路板及び電子機器 - Google Patents
プリント回路板及び電子機器 Download PDFInfo
- Publication number
- JP6611555B2 JP6611555B2 JP2015204852A JP2015204852A JP6611555B2 JP 6611555 B2 JP6611555 B2 JP 6611555B2 JP 2015204852 A JP2015204852 A JP 2015204852A JP 2015204852 A JP2015204852 A JP 2015204852A JP 6611555 B2 JP6611555 B2 JP 6611555B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- ground
- pattern
- semiconductor device
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015204852A JP6611555B2 (ja) | 2015-10-16 | 2015-10-16 | プリント回路板及び電子機器 |
US14/944,540 US9894751B2 (en) | 2014-11-20 | 2015-11-18 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015204852A JP6611555B2 (ja) | 2015-10-16 | 2015-10-16 | プリント回路板及び電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017076754A JP2017076754A (ja) | 2017-04-20 |
JP2017076754A5 JP2017076754A5 (fr) | 2018-11-22 |
JP6611555B2 true JP6611555B2 (ja) | 2019-11-27 |
Family
ID=58551560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015204852A Expired - Fee Related JP6611555B2 (ja) | 2014-11-20 | 2015-10-16 | プリント回路板及び電子機器 |
Country Status (1)
Country | Link |
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JP (1) | JP6611555B2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7014486B2 (ja) * | 2018-01-25 | 2022-02-01 | 株式会社デンソーテン | 配線パターン構造及び電子機器 |
KR102262073B1 (ko) * | 2018-07-26 | 2021-06-08 | 교세라 가부시키가이샤 | 배선 기판 |
JP7017995B2 (ja) * | 2018-07-26 | 2022-02-09 | 京セラ株式会社 | 配線基板 |
JP6671551B1 (ja) * | 2019-02-12 | 2020-03-25 | 三菱電機株式会社 | 多層プリント基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6387845U (fr) * | 1986-11-26 | 1988-06-08 | ||
JP4657640B2 (ja) * | 2004-07-21 | 2011-03-23 | 株式会社日立製作所 | 半導体装置 |
JP2006186286A (ja) * | 2004-12-28 | 2006-07-13 | Nec Toppan Circuit Solutions Inc | 電子装置及び印刷配線板 |
JP6385074B2 (ja) * | 2014-03-03 | 2018-09-05 | キヤノン株式会社 | プリント回路板及び電子機器 |
-
2015
- 2015-10-16 JP JP2015204852A patent/JP6611555B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2017076754A (ja) | 2017-04-20 |
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