JP6598890B2 - ファン−アウト半導体パッケージモジュール - Google Patents

ファン−アウト半導体パッケージモジュール Download PDF

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Publication number
JP6598890B2
JP6598890B2 JP2018017867A JP2018017867A JP6598890B2 JP 6598890 B2 JP6598890 B2 JP 6598890B2 JP 2018017867 A JP2018017867 A JP 2018017867A JP 2018017867 A JP2018017867 A JP 2018017867A JP 6598890 B2 JP6598890 B2 JP 6598890B2
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Prior art keywords
fan
semiconductor package
package module
hole
disposed
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Japanese (ja)
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JP2019016770A (ja
Inventor
ホ ベク、ヨン
ファン ジュン、ジュ
シク フル、ヤン
チュル ゴン、ジュン
キム、ハン
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/37—Effects of the manufacturing process
    • H01L2924/37001—Yield

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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TWI766164B (zh) * 2019-05-28 2022-06-01 力成科技股份有限公司 封裝結構
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US11948891B2 (en) 2020-04-03 2024-04-02 Nepes Co., Ltd. Semiconductor package and manufacturing method thereof
WO2022064704A1 (ja) * 2020-09-28 2022-03-31 昭和電工マテリアルズ株式会社 表面実装型モジュール、及び、回路基板の製造方法
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US8890628B2 (en) * 2012-08-31 2014-11-18 Intel Corporation Ultra slim RF package for ultrabooks and smart phones
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US10199337B2 (en) * 2015-05-11 2019-02-05 Samsung Electro-Mechanics Co., Ltd. Electronic component package and method of manufacturing the same
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