JP6598811B2 - 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法 - Google Patents
半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法 Download PDFInfo
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- JP6598811B2 JP6598811B2 JP2017057479A JP2017057479A JP6598811B2 JP 6598811 B2 JP6598811 B2 JP 6598811B2 JP 2017057479 A JP2017057479 A JP 2017057479A JP 2017057479 A JP2017057479 A JP 2017057479A JP 6598811 B2 JP6598811 B2 JP 6598811B2
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- 239000004065 semiconductor Substances 0.000 title claims description 158
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- 238000003384 imaging method Methods 0.000 claims description 116
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- 238000007789 sealing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017057479A JP6598811B2 (ja) | 2017-03-23 | 2017-03-23 | 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法 |
KR1020180024116A KR102158028B1 (ko) | 2017-03-23 | 2018-02-28 | 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 |
CN201810227519.1A CN108630552B (zh) | 2017-03-23 | 2018-03-19 | 半导体封装体配置装置、制造装置、配置方法及其应用 |
TW107109755A TWI674640B (zh) | 2017-03-23 | 2018-03-22 | 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017057479A JP6598811B2 (ja) | 2017-03-23 | 2017-03-23 | 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018160583A JP2018160583A (ja) | 2018-10-11 |
JP2018160583A5 JP2018160583A5 (zh) | 2019-02-14 |
JP6598811B2 true JP6598811B2 (ja) | 2019-10-30 |
Family
ID=63706344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017057479A Active JP6598811B2 (ja) | 2017-03-23 | 2017-03-23 | 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6598811B2 (zh) |
KR (1) | KR102158028B1 (zh) |
CN (1) | CN108630552B (zh) |
TW (1) | TWI674640B (zh) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2770817B2 (ja) * | 1996-06-19 | 1998-07-02 | 日本電気株式会社 | チップマウント装置及び方法 |
US6428641B1 (en) * | 1998-08-31 | 2002-08-06 | Amkor Technology, Inc. | Method for laminating circuit pattern tape on semiconductor wafer |
JP3986196B2 (ja) | 1999-02-17 | 2007-10-03 | 株式会社ルネサステクノロジ | 光半導体装置の製造方法 |
JP2003303854A (ja) * | 2002-02-05 | 2003-10-24 | Toray Eng Co Ltd | チップ実装方法およびそれを用いた装置 |
JP2004335604A (ja) * | 2003-05-02 | 2004-11-25 | Seiko Epson Corp | 半導体装置の製造方法および電子デバイスの製造方法 |
JP4538843B2 (ja) * | 2004-03-05 | 2010-09-08 | 澁谷工業株式会社 | ダイボンド用粘着テープの貼付方法 |
JP2006100762A (ja) * | 2004-09-06 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法 |
JP2009218397A (ja) * | 2008-03-11 | 2009-09-24 | Towa Corp | 基板の切断方法及び装置 |
JP2010135574A (ja) * | 2008-12-05 | 2010-06-17 | Alpha- Design Kk | 移載装置 |
JP2012013802A (ja) * | 2010-06-29 | 2012-01-19 | Hitachi High-Technologies Corp | Fpdモジュールの位置決めマーク認識装置及びfpdモジュールの組立装置 |
JP6149277B2 (ja) * | 2011-03-30 | 2017-06-21 | ボンドテック株式会社 | 電子部品実装方法、電子部品実装システムおよび基板 |
JP5836223B2 (ja) * | 2011-12-02 | 2015-12-24 | 株式会社神戸製鋼所 | 貼合基板の回転ズレ量計測装置、貼合基板の回転ズレ量計測方法、及び貼合基板の製造方法 |
JP6017382B2 (ja) * | 2013-07-29 | 2016-11-02 | Towa株式会社 | 個片化された電子部品の搬送装置及び搬送方法 |
JP6218511B2 (ja) * | 2013-09-02 | 2017-10-25 | Towa株式会社 | 切断装置及び切断方法 |
JP6128337B2 (ja) * | 2014-10-23 | 2017-05-17 | パナソニックIpマネジメント株式会社 | 半導体装置の製造方法及び製造装置 |
JP6444717B2 (ja) * | 2014-12-12 | 2018-12-26 | Towa株式会社 | 切断装置及び切断方法 |
KR101590593B1 (ko) * | 2015-12-03 | 2016-02-02 | 제너셈(주) | 반도체패키지의 스퍼터링 방법 |
-
2017
- 2017-03-23 JP JP2017057479A patent/JP6598811B2/ja active Active
-
2018
- 2018-02-28 KR KR1020180024116A patent/KR102158028B1/ko active IP Right Grant
- 2018-03-19 CN CN201810227519.1A patent/CN108630552B/zh active Active
- 2018-03-22 TW TW107109755A patent/TWI674640B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI674640B (zh) | 2019-10-11 |
CN108630552B (zh) | 2021-08-03 |
KR102158028B1 (ko) | 2020-09-21 |
JP2018160583A (ja) | 2018-10-11 |
KR20180108434A (ko) | 2018-10-04 |
TW201901836A (zh) | 2019-01-01 |
CN108630552A (zh) | 2018-10-09 |
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