JP6595336B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP6595336B2
JP6595336B2 JP2015523973A JP2015523973A JP6595336B2 JP 6595336 B2 JP6595336 B2 JP 6595336B2 JP 2015523973 A JP2015523973 A JP 2015523973A JP 2015523973 A JP2015523973 A JP 2015523973A JP 6595336 B2 JP6595336 B2 JP 6595336B2
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JP
Japan
Prior art keywords
curing agent
resin composition
mass
resin
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015523973A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2014208352A1 (ja
Inventor
茂雄 中村
嘉生 西村
達也 本間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of JPWO2014208352A1 publication Critical patent/JPWO2014208352A1/ja
Application granted granted Critical
Publication of JP6595336B2 publication Critical patent/JP6595336B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
JP2015523973A 2013-06-25 2014-06-12 樹脂組成物 Active JP6595336B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013132867 2013-06-25
JP2013132867 2013-06-25
PCT/JP2014/065635 WO2014208352A1 (ja) 2013-06-25 2014-06-12 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2014208352A1 JPWO2014208352A1 (ja) 2017-02-23
JP6595336B2 true JP6595336B2 (ja) 2019-10-23

Family

ID=52141696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015523973A Active JP6595336B2 (ja) 2013-06-25 2014-06-12 樹脂組成物

Country Status (5)

Country Link
JP (1) JP6595336B2 (zh)
KR (1) KR102288571B1 (zh)
CN (1) CN105308121B (zh)
TW (1) TWI699399B (zh)
WO (1) WO2014208352A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6623632B2 (ja) * 2015-09-11 2019-12-25 日立化成株式会社 絶縁樹脂フィルム及び多層プリント配線板
WO2018037913A1 (ja) * 2016-08-22 2018-03-01 富士フイルム株式会社 遮光性組成物、遮光膜、固体撮像素子、カラーフィルタ、及び、液晶表示装置
JP7082496B2 (ja) * 2017-02-27 2022-06-08 株式会社Adeka 繊維強化プラスチック用樹脂組成物、その硬化物、及び該硬化物を含有する繊維強化プラスチック
JP2018150446A (ja) * 2017-03-13 2018-09-27 株式会社日立製作所 電気絶縁樹脂材料
JP6787210B2 (ja) * 2017-03-23 2020-11-18 味の素株式会社 樹脂組成物
TW201904929A (zh) * 2017-06-28 2019-02-01 日商迪愛生股份有限公司 活性酯組成物及半導體密封材料
EP3865543A4 (en) * 2018-10-11 2021-11-17 Mitsubishi Chemical Corporation RESIN COMPOSITION, CURED RESIN PRODUCT AND COMPOSITE SHAPED BODY
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7297109B2 (ja) * 2020-02-06 2023-06-23 富士フイルム株式会社 組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
CN111763403A (zh) * 2020-07-15 2020-10-13 深圳先进电子材料国际创新研究院 一种液体环氧树脂组合物及其制备方法和应用
WO2023032537A1 (ja) * 2021-09-03 2023-03-09 株式会社Adeka 組成物及び硬化物
CN117795002A (zh) * 2021-11-16 2024-03-29 纳美仕有限公司 环氧树脂组合物、液状压缩模制材料、顶部包封材料以及半导体装置
CN116867174A (zh) * 2023-07-06 2023-10-10 宁波科浩达电子有限公司 一种pcb印制线路板的制作方法及pcb印制线路板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195160A (ja) * 1984-03-16 1985-10-03 Tokuyama Soda Co Ltd 複合シ−ト
JPS6438420A (en) * 1987-08-03 1989-02-08 Matsushita Electric Works Ltd Epoxy resin molding material
JPH03157447A (ja) * 1989-11-14 1991-07-05 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及びエポキシ樹脂硬化物
JPH03287654A (ja) * 1990-04-05 1991-12-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH0496929A (ja) * 1990-08-14 1992-03-30 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP3175073B2 (ja) * 1994-07-11 2001-06-11 信越化学工業株式会社 窒化アルミニウム粉末
JP3157447B2 (ja) 1996-01-24 2001-04-16 三洋電機株式会社 空気調和装置
JP2789088B2 (ja) * 1996-12-16 1998-08-20 東洋アルミニウム株式会社 粒子状無機質複合体の製造方法
JPH10292093A (ja) * 1997-04-21 1998-11-04 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP4170570B2 (ja) * 2000-08-09 2008-10-22 電気化学工業株式会社 高熱伝導性フィラー及びその用途
TWI259200B (en) * 2001-07-12 2006-08-01 Univ Nat Cheng Kung Surface treating method of aluminum nitride powder
JP5396805B2 (ja) * 2008-10-07 2014-01-22 味の素株式会社 エポキシ樹脂組成物
JP2010229227A (ja) * 2009-03-26 2010-10-14 Sekisui Chem Co Ltd エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体及び積層板
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5630241B2 (ja) * 2010-02-15 2014-11-26 日立化成株式会社 絶縁樹脂、配線板及び配線板の製造方法
JP2012140570A (ja) * 2011-01-06 2012-07-26 Sekisui Chem Co Ltd エポキシ樹脂材料及び多層基板
JP5871428B2 (ja) 2011-03-16 2016-03-01 古河電気工業株式会社 高熱伝導性フィルム状接着剤用組成物、高熱伝導性フィルム状接着剤、並びに、それを用いた半導体パッケージとその製造方法
KR101298368B1 (ko) * 2011-03-31 2013-08-20 세키스이가가쿠 고교가부시키가이샤 예비 경화물, 조화 예비 경화물 및 적층체

Also Published As

Publication number Publication date
TW201518389A (zh) 2015-05-16
KR20160023679A (ko) 2016-03-03
CN105308121A (zh) 2016-02-03
WO2014208352A1 (ja) 2014-12-31
CN105308121B (zh) 2018-09-18
TWI699399B (zh) 2020-07-21
JPWO2014208352A1 (ja) 2017-02-23
KR102288571B1 (ko) 2021-08-12

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