JP6584982B2 - 成膜装置 - Google Patents
成膜装置 Download PDFInfo
- Publication number
- JP6584982B2 JP6584982B2 JP2016046649A JP2016046649A JP6584982B2 JP 6584982 B2 JP6584982 B2 JP 6584982B2 JP 2016046649 A JP2016046649 A JP 2016046649A JP 2016046649 A JP2016046649 A JP 2016046649A JP 6584982 B2 JP6584982 B2 JP 6584982B2
- Authority
- JP
- Japan
- Prior art keywords
- film forming
- film
- film formation
- vacuum chamber
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020187003080A KR102565020B1 (ko) | 2015-07-21 | 2016-07-21 | 성막장치 |
PCT/JP2016/071438 WO2017014278A1 (fr) | 2015-07-21 | 2016-07-21 | Appareil de formation de film |
KR1020237029223A KR20230129601A (ko) | 2015-07-21 | 2016-07-21 | 음이온생성장치 |
CN201680045499.5A CN107849690B (zh) | 2015-07-21 | 2016-07-21 | 成膜装置 |
CN202010216059.XA CN111364008B (zh) | 2015-07-21 | 2016-07-21 | 负离子生成装置 |
KR1020207008153A KR102573358B1 (ko) | 2015-07-21 | 2016-07-21 | 음이온생성장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015143798 | 2015-07-21 | ||
JP2015143798 | 2015-07-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017025407A JP2017025407A (ja) | 2017-02-02 |
JP2017025407A5 JP2017025407A5 (fr) | 2018-07-05 |
JP6584982B2 true JP6584982B2 (ja) | 2019-10-02 |
Family
ID=57945589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016046649A Active JP6584982B2 (ja) | 2015-07-21 | 2016-03-10 | 成膜装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6584982B2 (fr) |
KR (1) | KR102565020B1 (fr) |
CN (1) | CN107849690B (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7185487B2 (ja) * | 2018-03-14 | 2022-12-07 | 住友重機械工業株式会社 | 負イオン生成装置 |
US20210305016A1 (en) | 2018-06-14 | 2021-09-30 | National University Corporation Kyoto Institute Of Technology | Specific type ion source and plasma film forming apparatus |
JP7120540B2 (ja) * | 2018-06-26 | 2022-08-17 | 住友重機械工業株式会社 | イオン照射装置、イオン照射方法、成膜装置、及び成膜方法 |
JP7246628B2 (ja) * | 2018-06-26 | 2023-03-28 | 住友重機械工業株式会社 | 成膜・イオン照射システム、及び成膜・イオン照射方法 |
JP7316770B2 (ja) * | 2018-09-03 | 2023-07-28 | 住友重機械工業株式会社 | 成膜装置、及び膜構造体の製造装置 |
JP7336863B2 (ja) * | 2019-03-28 | 2023-09-01 | 住友重機械工業株式会社 | 負イオン生成装置 |
JP7209572B2 (ja) * | 2019-03-28 | 2023-01-20 | 住友重機械工業株式会社 | 負イオン生成装置 |
JP7313929B2 (ja) * | 2019-06-26 | 2023-07-25 | 住友重機械工業株式会社 | 負イオン照射装置 |
KR20210006108A (ko) | 2019-07-08 | 2021-01-18 | 스미도모쥬기가이고교 가부시키가이샤 | 부이온생성장치 |
TWI700967B (zh) * | 2019-07-09 | 2020-08-01 | 日商住友重機械工業股份有限公司 | 負離子生成裝置 |
TWI756742B (zh) * | 2019-07-09 | 2022-03-01 | 日商住友重機械工業股份有限公司 | 負離子生成裝置 |
CN112226734A (zh) * | 2019-07-15 | 2021-01-15 | 住友重机械工业株式会社 | 负离子生成装置 |
KR102180979B1 (ko) * | 2019-08-19 | 2020-11-19 | 참엔지니어링(주) | 처리 장치 및 방법 |
JP7349910B2 (ja) | 2019-12-27 | 2023-09-25 | 住友重機械工業株式会社 | 負イオン生成装置、及び負イオン生成方法 |
JP7404119B2 (ja) * | 2020-03-19 | 2023-12-25 | 住友重機械工業株式会社 | 負イオン生成装置 |
US11915910B2 (en) | 2021-03-25 | 2024-02-27 | Tokyo Electron Limited | Fast neutral generation for plasma processing |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS571586B2 (fr) * | 1974-05-22 | 1982-01-12 | ||
JPH0674767B2 (ja) * | 1984-07-18 | 1994-09-21 | 富士重工業株式会社 | エンジンのアイドル回転数制御方法 |
JPH0417669A (ja) * | 1990-05-08 | 1992-01-22 | Jeol Ltd | プラズマを用いた成膜方法およびrfイオンプレーティング装置 |
JPH06128732A (ja) * | 1992-10-15 | 1994-05-10 | Ricoh Co Ltd | 薄膜形成装置および薄膜形成方法 |
JPH0980200A (ja) * | 1995-09-08 | 1997-03-28 | Nissin Electric Co Ltd | イオン発生装置 |
JP2823834B2 (ja) * | 1996-03-28 | 1998-11-11 | 中外炉工業株式会社 | 蒸着装置におけるるつぼ部機構 |
JPH11273894A (ja) * | 1998-03-23 | 1999-10-08 | Jeol Ltd | 薄膜形成装置 |
JP2000282226A (ja) | 1999-04-01 | 2000-10-10 | Nippon Sheet Glass Co Ltd | 真空成膜装置及び方法 |
JP3765990B2 (ja) * | 2001-03-16 | 2006-04-12 | 住友重機械工業株式会社 | 導体の形成方法及び装置 |
JP4339562B2 (ja) * | 2002-09-06 | 2009-10-07 | 住友重機械工業株式会社 | イオンプレーティング方法およびその装置 |
CN100564587C (zh) * | 2003-01-31 | 2009-12-02 | 东京毅力科创株式会社 | 形成Ti膜的成膜方法 |
JP4613050B2 (ja) * | 2004-11-04 | 2011-01-12 | 大日本印刷株式会社 | 圧力勾配型イオンプレーティング式成膜装置 |
CN203049026U (zh) * | 2013-01-23 | 2013-07-10 | 中国科学院金属研究所 | 一种低温低损伤多功能复合镀膜的装置 |
JP5951542B2 (ja) * | 2013-03-28 | 2016-07-13 | 住友重機械工業株式会社 | 成膜装置 |
-
2016
- 2016-03-10 JP JP2016046649A patent/JP6584982B2/ja active Active
- 2016-07-21 CN CN201680045499.5A patent/CN107849690B/zh active Active
- 2016-07-21 KR KR1020187003080A patent/KR102565020B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102565020B1 (ko) | 2023-08-07 |
CN107849690B (zh) | 2020-02-18 |
JP2017025407A (ja) | 2017-02-02 |
CN107849690A (zh) | 2018-03-27 |
KR20180034463A (ko) | 2018-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6584982B2 (ja) | 成膜装置 | |
WO2017014278A1 (fr) | Appareil de formation de film | |
KR100239818B1 (ko) | 기초재의 반응코팅을 위한 방법과 장치 | |
US7164571B2 (en) | Wafer stage with a magnet | |
JP2023120247A (ja) | 負イオン照射装置 | |
JP7313929B2 (ja) | 負イオン照射装置 | |
TWI823563B (zh) | 負離子照射裝置及負離子照射裝置的控制方法 | |
JP7185487B2 (ja) | 負イオン生成装置 | |
JP7120540B2 (ja) | イオン照射装置、イオン照射方法、成膜装置、及び成膜方法 | |
TW202103200A (zh) | 負離子生成裝置 | |
JP7209572B2 (ja) | 負イオン生成装置 | |
JP2001295031A (ja) | 成膜装置及び方法 | |
JP2022025333A (ja) | プラズマガン、成膜装置、及び負イオン生成装置 | |
KR20190056521A (ko) | 전자석을 구비한 스퍼터링 장치 | |
JP2012172261A (ja) | 成膜装置 | |
TWI700967B (zh) | 負離子生成裝置 | |
JP7316770B2 (ja) | 成膜装置、及び膜構造体の製造装置 | |
JP2020190028A (ja) | 成膜装置 | |
JP2010150595A (ja) | イオンプレーティング装置 | |
JP2010126749A (ja) | イオンプレーティング装置 | |
JP2020068290A (ja) | 基板処理装置及び基板処理方法 | |
JP2007056353A (ja) | プラズマ生成モジュール及びプラズマ生成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180525 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180612 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190604 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190805 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190903 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190904 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6584982 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |