JP6576038B2 - マイクロ表面実装デバイスパッケージング - Google Patents

マイクロ表面実装デバイスパッケージング Download PDF

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JP6576038B2
JP6576038B2 JP2014543559A JP2014543559A JP6576038B2 JP 6576038 B2 JP6576038 B2 JP 6576038B2 JP 2014543559 A JP2014543559 A JP 2014543559A JP 2014543559 A JP2014543559 A JP 2014543559A JP 6576038 B2 JP6576038 B2 JP 6576038B2
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carrier
encapsulant
die
grinding
packaging
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Japanese (ja)
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JP2015504608A5 (enExample
JP2015504608A (ja
Inventor
ポダー アニンディヤ
ポダー アニンディヤ
フェン タオ
フェン タオ
ケイ ウォン ウィル
ケイ ウォン ウィル
Original Assignee
日本テキサス・インスツルメンツ合同会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
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    • H10W70/09—
    • H10W70/614—
    • H10W70/68—
    • H10W70/695—
    • H10W74/014—
    • H10W74/019—
    • H10W44/248—
    • H10W70/099—
    • H10W70/682—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/241—
    • H10W72/874—
    • H10W72/9413—
    • H10W74/129—
    • H10W90/701—
    • H10W90/734—

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
JP2014543559A 2011-11-22 2012-11-21 マイクロ表面実装デバイスパッケージング Active JP6576038B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/303,053 US8450151B1 (en) 2011-11-22 2011-11-22 Micro surface mount device packaging
US13/303,053 2011-11-22
PCT/US2012/066272 WO2013078323A1 (en) 2011-11-22 2012-11-21 Micro surface mount device packaging

Publications (3)

Publication Number Publication Date
JP2015504608A JP2015504608A (ja) 2015-02-12
JP2015504608A5 JP2015504608A5 (enExample) 2016-01-14
JP6576038B2 true JP6576038B2 (ja) 2019-09-18

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JP2014543559A Active JP6576038B2 (ja) 2011-11-22 2012-11-21 マイクロ表面実装デバイスパッケージング

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US (1) US8450151B1 (enExample)
JP (1) JP6576038B2 (enExample)
CN (1) CN103918074B (enExample)
WO (1) WO2013078323A1 (enExample)

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US9269675B2 (en) * 2013-10-18 2016-02-23 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
US9390993B2 (en) * 2014-08-15 2016-07-12 Broadcom Corporation Semiconductor border protection sealant
US10079156B2 (en) 2014-11-07 2018-09-18 Advanced Semiconductor Engineering, Inc. Semiconductor package including dielectric layers defining via holes extending to component pads
US9721799B2 (en) * 2014-11-07 2017-08-01 Advanced Semiconductor Engineering, Inc. Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof
CN106601628A (zh) * 2016-12-30 2017-04-26 通富微电子股份有限公司 一种芯片的封装方法及芯片封装结构
WO2018135705A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지의 제조 방법
KR101901987B1 (ko) * 2017-01-17 2018-09-27 주식회사 네패스 반도체 패키지의 제조 방법
WO2018135706A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지의 제조 방법
WO2018135707A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지 제조용 트레이
WO2018135708A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지의 제조 방법
EP3389085B1 (en) * 2017-04-12 2019-11-06 Nxp B.V. Method of making a plurality of packaged semiconductor devices
WO2020170002A1 (en) * 2019-02-23 2020-08-27 Chengdu Eswin Sip Technology Co., Ltd. Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same
US11488931B2 (en) 2018-02-23 2022-11-01 Chengdu Eswin Sip Technology Co., Ltd. Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same
US12230539B2 (en) 2018-08-01 2025-02-18 Texas Instruments Incorporated Wafer chip scale packaging with ball attach before repassivation
US10541220B1 (en) 2018-08-02 2020-01-21 Texas Instruments Incorporated Printed repassivation for wafer chip scale packaging
US11183460B2 (en) 2018-09-17 2021-11-23 Texas Instruments Incorporated Embedded die packaging with integrated ceramic substrate
US10650957B1 (en) 2018-10-31 2020-05-12 Texas Instruments Incorporated Additive deposition low temperature curable magnetic interconnecting layer for power components integration
US11031332B2 (en) 2019-01-31 2021-06-08 Texas Instruments Incorporated Package panel processing with integrated ceramic isolation
US10879155B2 (en) 2019-05-09 2020-12-29 Texas Instruments Incorporated Electronic device with double-sided cooling
CN114514605A (zh) * 2019-11-22 2022-05-17 华为技术有限公司 芯片封装、电子设备及芯片封装制备方法
KR102635853B1 (ko) * 2020-04-29 2024-02-13 주식회사 네패스라웨 반도체 패키지 및 이의 제조방법
KR102684002B1 (ko) * 2020-12-14 2024-07-11 주식회사 네패스 반도체 패키지 제조방법 및 이에 이용되는 가이드 프레임
CN113064333A (zh) * 2021-03-19 2021-07-02 北京智创芯源科技有限公司 一种微小晶片的光刻方法、晶片载片及光刻工装

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JP2010219489A (ja) * 2009-02-20 2010-09-30 Toshiba Corp 半導体装置およびその製造方法
CN101924039B (zh) * 2009-06-15 2016-05-18 日月光半导体制造股份有限公司 半导体封装件及其制造方法

Also Published As

Publication number Publication date
CN103918074A (zh) 2014-07-09
US8450151B1 (en) 2013-05-28
WO2013078323A1 (en) 2013-05-30
US20130127043A1 (en) 2013-05-23
CN103918074B (zh) 2017-06-09
JP2015504608A (ja) 2015-02-12

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