CN114514605A - 芯片封装、电子设备及芯片封装制备方法 - Google Patents

芯片封装、电子设备及芯片封装制备方法 Download PDF

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CN114514605A
CN114514605A CN201980100967.8A CN201980100967A CN114514605A CN 114514605 A CN114514605 A CN 114514605A CN 201980100967 A CN201980100967 A CN 201980100967A CN 114514605 A CN114514605 A CN 114514605A
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die
beam structure
chip package
substrate
chip
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赵南
蔡崇宣
蒋尚轩
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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Abstract

一种芯片封装、电子设备及芯片封装制备方法，该芯片封装包括基板、第一裸片、第二裸片和横梁结构，上述第一裸片与第二裸片并排设置于基板的一侧，且与基板电连接。上述横梁结构设置于第一裸片和第二裸片之间，该横梁结构的第一端与第一裸片的一部分堆叠且固定连接，第二端与第二裸片的一部分堆叠且固定连接，该横梁结构与上述第一裸片和第二裸片绝缘连接。上述横梁结构的热膨胀系数小于基板的热膨胀系数，从而当基板由于热膨胀等原因发生机械变形时，横梁结构产生的机械变形程度较小，可以减少第一裸片与第二裸片之间的间隙发生的变化。

Description

PCT国内申请，说明书已公开。

Claims (17)

  1. PCT国内申请，权利要求书已公开。
CN201980100967.8A 2019-11-22 2019-11-22 芯片封装、电子设备及芯片封装制备方法 Pending CN114514605A (zh)

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CN115600542A (zh) * 2022-11-28 2023-01-13 飞腾信息技术有限公司（Cn） 一种芯片封装结构及其设计方法和相关设备

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US20220157777A1 (en) * 2020-11-13 2022-05-19 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device package having dummy dies and method of forming the same

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KR102133448B1 (ko) * 2014-03-26 2020-07-13 에스케이하이닉스 주식회사 반도체 패키지
KR20150123420A (ko) * 2014-04-24 2015-11-04 에스케이하이닉스 주식회사 반도체 패키지 및 그 제조 방법
US10043769B2 (en) * 2015-06-03 2018-08-07 Micron Technology, Inc. Semiconductor devices including dummy chips
KR102404058B1 (ko) * 2017-12-28 2022-05-31 삼성전자주식회사 반도체 패키지
CN107993994B (zh) * 2017-12-29 2023-07-25 长鑫存储技术有限公司 半导体封装结构及其制造方法

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CN115600542A (zh) * 2022-11-28 2023-01-13 飞腾信息技术有限公司（Cn） 一种芯片封装结构及其设计方法和相关设备

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