JP6550196B2 - 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 - Google Patents

表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 Download PDF

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Publication number
JP6550196B2
JP6550196B2 JP2018557430A JP2018557430A JP6550196B2 JP 6550196 B2 JP6550196 B2 JP 6550196B2 JP 2018557430 A JP2018557430 A JP 2018557430A JP 2018557430 A JP2018557430 A JP 2018557430A JP 6550196 B2 JP6550196 B2 JP 6550196B2
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JP
Japan
Prior art keywords
copper foil
particles
roughened
longitudinal dimension
treated copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2018557430A
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English (en)
Japanese (ja)
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JPWO2019021895A1 (ja
Inventor
貴広 齋藤
貴広 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Application granted granted Critical
Publication of JP6550196B2 publication Critical patent/JP6550196B2/ja
Publication of JPWO2019021895A1 publication Critical patent/JPWO2019021895A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2018557430A 2017-07-24 2018-07-18 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 Active JP6550196B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017142385 2017-07-24
JP2017142385 2017-07-24
PCT/JP2018/026793 WO2019021895A1 (ja) 2017-07-24 2018-07-18 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板

Publications (2)

Publication Number Publication Date
JP6550196B2 true JP6550196B2 (ja) 2019-07-24
JPWO2019021895A1 JPWO2019021895A1 (ja) 2019-08-08

Family

ID=65039735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018557430A Active JP6550196B2 (ja) 2017-07-24 2018-07-18 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板

Country Status (5)

Country Link
JP (1) JP6550196B2 (ko)
KR (1) KR102353143B1 (ko)
CN (1) CN111194362B (ko)
TW (1) TWI751359B (ko)
WO (1) WO2019021895A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6816193B2 (ja) * 2019-03-26 2021-01-20 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
WO2023162965A1 (ja) * 2022-02-28 2023-08-31 京セラ株式会社 配線基板
CN114603944B (zh) * 2022-05-12 2022-09-06 广州方邦电子股份有限公司 金属箔、覆铜层叠板、线路板、半导体、负极材料和电池

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY138622A (en) * 1990-12-19 2009-07-31 Nikko Gould Foil Kk Method of producing electrolytic copper foil
JPH10341066A (ja) 1997-06-10 1998-12-22 Furukawa Electric Co Ltd:The 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板
TW200424359A (en) * 2003-02-04 2004-11-16 Furukawa Circuit Foil Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
EP1531656A3 (en) * 2003-11-11 2007-10-03 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP4833692B2 (ja) * 2006-03-06 2011-12-07 古河電気工業株式会社 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP5781525B2 (ja) * 2010-09-27 2015-09-24 Jx日鉱日石金属株式会社 プリント配線板用銅箔、その製造方法、プリント配線板用樹脂基板及びプリント配線板
JP5698585B2 (ja) * 2011-03-31 2015-04-08 新日鉄住金化学株式会社 金属張積層板
KR102059280B1 (ko) * 2011-09-30 2019-12-24 제이엑스금속주식회사 수지와의 밀착성이 우수한 동박 및 그 제조 방법 그리고 그 전해 동박을 사용한 프린트 배선판 또는 전지용 부극재
KR20140088911A (ko) * 2012-01-18 2014-07-11 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 표면 처리 구리박 및 그것을 사용한 구리 피복 적층판
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP6591893B2 (ja) * 2013-06-04 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法
JP6273106B2 (ja) 2013-07-24 2018-01-31 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法及びプリント配線板の製造方法
JP5885790B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5826322B2 (ja) * 2014-03-25 2015-12-02 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
JP5972486B1 (ja) 2014-09-05 2016-08-17 古河電気工業株式会社 銅箔、銅張積層板、および基板
JP6522974B2 (ja) 2015-02-07 2019-05-29 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、及び、プリント配線板の製造方法
CN107113971B (zh) * 2015-08-12 2019-04-26 古河电气工业株式会社 高频电路用铜箔、覆铜层压板、印刷布线基板

Also Published As

Publication number Publication date
KR20200033852A (ko) 2020-03-30
TW201920776A (zh) 2019-06-01
TWI751359B (zh) 2022-01-01
KR102353143B1 (ko) 2022-01-18
WO2019021895A1 (ja) 2019-01-31
CN111194362A (zh) 2020-05-22
CN111194362B (zh) 2022-03-11
JPWO2019021895A1 (ja) 2019-08-08

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