JP6525080B1 - ウェーハの処理装置及び処理方法 - Google Patents
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Abstract
Description
まず、本発明のウェーハの処理装置について説明する。図1は、本発明におけるウェーハの処理装置の一例を示す概略図である。
そこで、例えば図3(D)に示したように、保持ピン6の形状をウェーハ側面だけでなくベベル部分も接触できるものとし、かつ、ウェーハ中心へ向けて力を加えてウェーハWを保持することでウェーハWを上凸に反らすことができる。
続いて、本発明のウェーハの処理方法を、上記本発明のウェーハの処理装置1を用いる場合を例に説明する。
直径300mmのウェーハ各4枚に対して、図1に示されるような本発明のウェーハの処理装置を用いて、表1中に示す条件で、ウェーハを上凸形状に変形させて洗浄及び乾燥処理を行った。この時用いた保持ピン形状は、図7に示したようなものである。なお、洗浄方法は一般的なフッ酸とオゾン水を交互に繰り返す洗浄を行い、使用薬液としては、純水、濃度が0.5質量%のフッ酸、濃度が20ppmのオゾン水を用いた。このとき、実施例1〜2におけるウェーハの形状及び乾燥方向は、図8に示したものとなった。
ウェーハを上凸形状に変形させなかったこと以外は、実施例1〜2と同様の手順でウェーハの洗浄及び乾燥処理を行い、評価を行った。このとき、比較例1〜2におけるウェーハの形状及び乾燥方向は、従来と同様に、図12に示したものとなった。
5…ノズル部、 6…保持ピン、 7…テーブル、 8…カップ部
W…ウェーハ。
Claims (11)
- チャンバー内に回転可能なテーブルと、該テーブル上に配置された複数の保持ピンとを具備し、該複数の保持ピンでウェーハの周縁部を保持して、該ウェーハを回転させながら洗浄及び/又は乾燥処理するウェーハの処理装置であって、
前記複数の保持ピンのうち1本以上は駆動可能で、前記保持したウェーハに掛かる合成力がウェーハを上凸に反らす方向になるように前記ウェーハを押しつけて保持するものであることを特徴とするウェーハの処理装置。 - 前記回転可能なテーブルの上面と前記保持されたウェーハの下面との、静止した状態における間隔が20mm以上のものであることを特徴とする請求項1に記載のウェーハの処理装置。
- 前記駆動可能な保持ピンが、前記ウェーハの半径よりも内側へ駆動可能なものであることを特徴とする請求項1又は請求項2に記載のウェーハの処理装置。
- 前記駆動可能な保持ピンが、回転移動方式又は水平移動方式により駆動するものであることを特徴とする請求項1から請求項3のいずれか一項に記載のウェーハの処理装置。
- 前記複数の保持ピンの先端形状が、前記ウェーハの面取り部を押す傾斜部と前記ウェーハの側面を水平方向へ押す垂直部とを有するものであることを特徴とする請求項1から請求項4のいずれか一項に記載のウェーハの処理装置。
- 前記複数の保持ピンのうち2本以上は固定されたものであることを特徴とする請求項1から請求項5のいずれか一項に記載のウェーハの処理装置。
- 前記複数の保持ピンが5.0N以上30.0N以下の圧力で前記ウェーハを押しつけて保持するものであることを特徴とする請求項1から請求項6のいずれか一項に記載のウェーハの処理装置。
- チャンバー内において、回転可能なテーブル上に配置された複数の保持ピンでウェーハの周縁部を保持して、該ウェーハを回転させながら洗浄及び/又は乾燥処理するウェーハの処理方法であって、
前記ウェーハに掛かる合成力がウェーハを上凸に反らす方向になるように、前記複数の保持ピンのうち1本以上を駆動させることで前記ウェーハを押しつけて保持し、
前記保持したウェーハを、前記回転可能なテーブルを回転させることで回転させながら、上凸形状に変形させて洗浄及び/又は乾燥処理することを特徴とするウェーハの処理方法。 - 前記回転可能なテーブルの上面と前記ウェーハの下面との静止した状態における間隔が20mm以上となるように、前記ウェーハを配置して保持することを特徴とする請求項8に記載のウェーハの処理方法。
- 前記ウェーハを、前記複数の保持ピンのうち1本以上を回転移動方式又は水平移動方式により駆動させることで押しつけて保持することを特徴とする請求項8又は請求項9に記載のウェーハの処理方法。
- 前記ウェーハを、5.0N以上30.0N以下の圧力を加えることで押しつけて保持することを特徴とする請求項8から請求項10のいずれか一項に記載のウェーハの処理方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
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JP2018046043A JP6525080B1 (ja) | 2018-03-13 | 2018-03-13 | ウェーハの処理装置及び処理方法 |
PCT/JP2019/007375 WO2019176531A1 (ja) | 2018-03-13 | 2019-02-26 | ウェーハの処理装置及び処理方法 |
CN201980012334.1A CN111684572A (zh) | 2018-03-13 | 2019-02-26 | 晶圆的处理装置及处理方法 |
EP19767046.6A EP3767665A4 (en) | 2018-03-13 | 2019-02-26 | SLICE TREATMENT DEVICE AND TREATMENT PROCESS |
US16/969,586 US20210013031A1 (en) | 2018-03-13 | 2019-02-26 | Wafer treatment apparatus and method for treating wafer |
SG11202007033WA SG11202007033WA (en) | 2018-03-13 | 2019-02-26 | Wafer treatment apparatus and method for treating wafer |
KR1020207023824A KR102639128B1 (ko) | 2018-03-13 | 2019-02-26 | 웨이퍼의 처리장치 및 처리방법 |
TW108107769A TWI801515B (zh) | 2018-03-13 | 2019-03-08 | 晶圓的處理裝置及處理方法 |
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KR20240110885A (ko) * | 2021-12-28 | 2024-07-16 | 교세라 가부시키가이샤 | 클램프용 지그 및 세정 장치 |
CN114378031A (zh) * | 2021-12-31 | 2022-04-22 | 江苏启微半导体设备有限公司 | 一种单片式晶圆清洗装置 |
CN116344407B (zh) * | 2023-04-16 | 2023-09-29 | 苏州冠礼科技有限公司 | 一种晶圆蚀刻清洗后干燥设备 |
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JP2862754B2 (ja) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | 処理装置及び回転部材 |
JPH08124844A (ja) * | 1994-10-27 | 1996-05-17 | Sony Corp | ウエハステージ |
JP2000332085A (ja) * | 1999-05-19 | 2000-11-30 | Sony Corp | ウェーハクランプ装置 |
EP1204139A4 (en) * | 2000-04-27 | 2010-04-28 | Ebara Corp | SUPPORT AND ROTATION DEVICE AND SEMICONDUCTOR SUBSTRATE PROCESSING DEVICE |
JP3846697B2 (ja) * | 2001-08-14 | 2006-11-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4025030B2 (ja) * | 2001-04-17 | 2007-12-19 | 東京エレクトロン株式会社 | 基板の処理装置及び搬送アーム |
JP2003092278A (ja) * | 2001-09-18 | 2003-03-28 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
JP2004014602A (ja) * | 2002-06-04 | 2004-01-15 | Sharp Corp | 回転塗布装置 |
JP2004037234A (ja) * | 2002-07-03 | 2004-02-05 | Fuji Photo Film Co Ltd | 基板保持装置 |
JP2004071680A (ja) * | 2002-08-02 | 2004-03-04 | Dainippon Printing Co Ltd | 回転式載置台 |
JP2007307533A (ja) * | 2006-05-22 | 2007-11-29 | Sharp Corp | 洗浄装置 |
KR100831988B1 (ko) * | 2006-06-02 | 2008-05-23 | 세메스 주식회사 | 스핀헤드 및 이를 이용하여 웨이퍼를 홀딩/언홀딩하는 방법 |
KR20070121485A (ko) * | 2006-06-21 | 2007-12-27 | 주식회사 에스앤에스텍 | 기판 세정장치 및 기판 세정방법 |
JP2008060107A (ja) | 2006-08-29 | 2008-03-13 | Toshiba Matsushita Display Technology Co Ltd | スピン洗浄装置 |
JP2015170639A (ja) * | 2014-03-05 | 2015-09-28 | 株式会社Screenホールディングス | 基板乾燥装置および基板乾燥方法 |
JP6482402B2 (ja) * | 2015-06-19 | 2019-03-13 | 信越半導体株式会社 | 枚葉式ウェーハ洗浄処理装置及びウェーハ洗浄方法 |
JP6459801B2 (ja) * | 2015-06-26 | 2019-01-30 | 株式会社Sumco | エピタキシャルシリコンウェーハの製造方法 |
KR102102320B1 (ko) * | 2016-06-28 | 2020-04-22 | 주식회사 원익아이피에스 | 기판 처리 장치 및 그것을 이용한 박막 증착 방법 |
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2018
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- 2019-02-26 KR KR1020207023824A patent/KR102639128B1/ko active IP Right Grant
- 2019-02-26 CN CN201980012334.1A patent/CN111684572A/zh active Pending
- 2019-02-26 EP EP19767046.6A patent/EP3767665A4/en not_active Withdrawn
- 2019-02-26 WO PCT/JP2019/007375 patent/WO2019176531A1/ja unknown
- 2019-02-26 US US16/969,586 patent/US20210013031A1/en not_active Abandoned
- 2019-03-08 TW TW108107769A patent/TWI801515B/zh active
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EP3767665A4 (en) | 2021-11-17 |
WO2019176531A1 (ja) | 2019-09-19 |
JP2019161022A (ja) | 2019-09-19 |
KR20200130251A (ko) | 2020-11-18 |
KR102639128B1 (ko) | 2024-02-22 |
US20210013031A1 (en) | 2021-01-14 |
TW201938280A (zh) | 2019-10-01 |
TWI801515B (zh) | 2023-05-11 |
CN111684572A (zh) | 2020-09-18 |
EP3767665A1 (en) | 2021-01-20 |
SG11202007033WA (en) | 2020-08-28 |
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