SG11202007033WA - Wafer treatment apparatus and method for treating wafer - Google Patents
Wafer treatment apparatus and method for treating waferInfo
- Publication number
- SG11202007033WA SG11202007033WA SG11202007033WA SG11202007033WA SG11202007033WA SG 11202007033W A SG11202007033W A SG 11202007033WA SG 11202007033W A SG11202007033W A SG 11202007033WA SG 11202007033W A SG11202007033W A SG 11202007033WA SG 11202007033W A SG11202007033W A SG 11202007033WA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- treatment apparatus
- treating
- wafer treatment
- treating wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02098—Cleaning only involving lasers, e.g. laser ablation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/18—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact
- F26B3/22—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact the heat source and the materials or objects to be dried being in relative motion, e.g. of vibration
- F26B3/24—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact the heat source and the materials or objects to be dried being in relative motion, e.g. of vibration the movement being rotation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018046043A JP6525080B1 (en) | 2018-03-13 | 2018-03-13 | Wafer processing apparatus and processing method |
PCT/JP2019/007375 WO2019176531A1 (en) | 2018-03-13 | 2019-02-26 | Wafer treatment device and treatment method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007033WA true SG11202007033WA (en) | 2020-08-28 |
Family
ID=66730601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007033WA SG11202007033WA (en) | 2018-03-13 | 2019-02-26 | Wafer treatment apparatus and method for treating wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US20210013031A1 (en) |
EP (1) | EP3767665A4 (en) |
JP (1) | JP6525080B1 (en) |
KR (1) | KR102639128B1 (en) |
CN (1) | CN111684572A (en) |
SG (1) | SG11202007033WA (en) |
TW (1) | TWI801515B (en) |
WO (1) | WO2019176531A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023045820A (en) * | 2021-09-22 | 2023-04-03 | 株式会社Screenホールディングス | Substrate processing device and substrate processing method |
WO2023127796A1 (en) * | 2021-12-28 | 2023-07-06 | 京セラ株式会社 | Clamping jig and cleaning device |
CN114378031A (en) * | 2021-12-31 | 2022-04-22 | 江苏启微半导体设备有限公司 | Single wafer type wafer cleaning device |
CN116344407B (en) * | 2023-04-16 | 2023-09-29 | 苏州冠礼科技有限公司 | Drying equipment after wafer etching and cleaning |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2862754B2 (en) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | Processing device and rotating member |
JPH08124844A (en) * | 1994-10-27 | 1996-05-17 | Sony Corp | Wafer stage |
JP2000332085A (en) * | 1999-05-19 | 2000-11-30 | Sony Corp | Wafer-clamping apparatus |
WO2001084621A1 (en) * | 2000-04-27 | 2001-11-08 | Ebara Corporation | Rotation holding device and semiconductor substrate processing device |
JP3846697B2 (en) * | 2001-08-14 | 2006-11-15 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP4025030B2 (en) * | 2001-04-17 | 2007-12-19 | 東京エレクトロン株式会社 | Substrate processing apparatus and transfer arm |
JP2003092278A (en) * | 2001-09-18 | 2003-03-28 | Shibaura Mechatronics Corp | Apparatus and method for treatment of substrate |
JP2004014602A (en) * | 2002-06-04 | 2004-01-15 | Sharp Corp | Rotating application apparatus |
JP2004037234A (en) * | 2002-07-03 | 2004-02-05 | Fuji Photo Film Co Ltd | Substrate holding-device |
JP2004071680A (en) * | 2002-08-02 | 2004-03-04 | Dainippon Printing Co Ltd | Rotary placement table |
JP2007307533A (en) * | 2006-05-22 | 2007-11-29 | Sharp Corp | Washing device |
KR100831988B1 (en) * | 2006-06-02 | 2008-05-23 | 세메스 주식회사 | Spin head and method for holding/unholding wafer using the spin head |
KR20070121485A (en) * | 2006-06-21 | 2007-12-27 | 주식회사 에스앤에스텍 | Plate cleaning apparatus and method of cleaning plate |
JP2008060107A (en) | 2006-08-29 | 2008-03-13 | Toshiba Matsushita Display Technology Co Ltd | Spin cleaner |
JP2015170639A (en) * | 2014-03-05 | 2015-09-28 | 株式会社Screenホールディングス | Substrate drying apparatus and substrate drying method |
JP6482402B2 (en) * | 2015-06-19 | 2019-03-13 | 信越半導体株式会社 | Single wafer cleaning apparatus and wafer cleaning method |
JP6459801B2 (en) * | 2015-06-26 | 2019-01-30 | 株式会社Sumco | Epitaxial silicon wafer manufacturing method |
KR102102320B1 (en) * | 2016-06-28 | 2020-04-22 | 주식회사 원익아이피에스 | Wafer Processing Apparatus And Method of depositing Thin film Using The Same |
-
2018
- 2018-03-13 JP JP2018046043A patent/JP6525080B1/en active Active
-
2019
- 2019-02-26 SG SG11202007033WA patent/SG11202007033WA/en unknown
- 2019-02-26 EP EP19767046.6A patent/EP3767665A4/en not_active Withdrawn
- 2019-02-26 WO PCT/JP2019/007375 patent/WO2019176531A1/en unknown
- 2019-02-26 US US16/969,586 patent/US20210013031A1/en not_active Abandoned
- 2019-02-26 KR KR1020207023824A patent/KR102639128B1/en active IP Right Grant
- 2019-02-26 CN CN201980012334.1A patent/CN111684572A/en active Pending
- 2019-03-08 TW TW108107769A patent/TWI801515B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2019161022A (en) | 2019-09-19 |
CN111684572A (en) | 2020-09-18 |
JP6525080B1 (en) | 2019-06-05 |
TW201938280A (en) | 2019-10-01 |
TWI801515B (en) | 2023-05-11 |
WO2019176531A1 (en) | 2019-09-19 |
KR102639128B1 (en) | 2024-02-22 |
KR20200130251A (en) | 2020-11-18 |
EP3767665A1 (en) | 2021-01-20 |
EP3767665A4 (en) | 2021-11-17 |
US20210013031A1 (en) | 2021-01-14 |
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