CN116344407B - Drying equipment after wafer etching and cleaning - Google Patents
Drying equipment after wafer etching and cleaning Download PDFInfo
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- CN116344407B CN116344407B CN202310401524.0A CN202310401524A CN116344407B CN 116344407 B CN116344407 B CN 116344407B CN 202310401524 A CN202310401524 A CN 202310401524A CN 116344407 B CN116344407 B CN 116344407B
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- fixedly arranged
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- 238000001035 drying Methods 0.000 title claims abstract description 39
- 238000005530 etching Methods 0.000 title claims description 12
- 238000004140 cleaning Methods 0.000 title claims description 10
- 239000007921 spray Substances 0.000 claims abstract description 32
- 230000007246 mechanism Effects 0.000 claims description 52
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 37
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 239000012535 impurity Substances 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 129
- 239000007789 gas Substances 0.000 description 15
- 230000009471 action Effects 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000005484 gravity Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012797 qualification Methods 0.000 description 4
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of wafer drying, and discloses a wafer drying device which comprises a base, wherein a shaft groove is formed in the left side of the middle of the upper surface of the base, a guide groove is formed in the right side of the middle of the upper surface of the base, a first driving part is fixedly arranged on the left side of the front of the base, a first driving wheel is fixedly arranged at the top end of an output shaft of the first driving part, a rotating seat is movably sleeved in the middle of the shaft groove, an outer gear ring meshed with the first driving wheel is fixedly arranged in the middle of the side surface of the rotating seat, a main board is fixedly arranged on the left side of the upper surface of the rotating seat, an air groove is formed in the middle of the upper surface of the rotating seat, and annular grooves are symmetrically formed in the front side and the rear side of the upper surface of the rotating seat. Therefore, the problem that moisture and impurities can be remained at the contact edge of the existing wafer drying equipment clamp and a wafer is solved, the problem that water drops on the processing surface of the wafer are not easy to separate is solved, and the problems that nitrogen used for drying at two ends of the linear spray head is not in contact with the processing surface of the wafer and is insufficient in contact are also solved.
Description
Technical Field
The invention belongs to the technical field of wafer drying, and particularly relates to drying equipment for wafer etching and cleaning.
Background
In the production of integrated circuit chips at present, the last step after etching and cleaning all wafers is wafer drying, and the purpose is to remove liquid and impurities on the surfaces of the wafers in a centrifugal and nitrogen air-drying mode, so that the surfaces of the wafers are clean and dry, the product qualification rate is improved, and a good foundation is laid for the subsequent process.
The existing wafer drying equipment has the following defects in the actual use process: 1. when the clamp of the existing wafer drying equipment is used for centrifugally drying the edge of the clamped wafer, part of water and impurities on the wafer processing surface remain at the edges of the clamp and the wafer, so that the water and impurities on the wafer processing surface are not thoroughly treated, the wafer qualification rate is reduced, and the wafer processing surface of the wafer drying equipment is placed upwards, so that water drops attached to the wafer processing surface diffuse outwards along the wafer processing surface under the action of self gravity, the contact area between the root of the water drops and the wafer is overlarge, the water drops are more easily attached to the processing surface of the wafer, the water drops are not easily separated, and the wafer drying speed and efficiency are reduced; 2. the existing shower nozzle that is used for drying adopts sharp shower nozzle, when sharp shower nozzle removes to both sides from circular wafer center, with the projected area of circular wafer reduce gradually, causes the nitrogen gas that straight line shower nozzle both ends are used for drying not with the wafer processing face contact, causes the wasting of resources, and the nitrogen gas that current wafer drying equipment sprayed to the wafer processing face takes place to rebound by the reaction force of wafer, causes the gas that is used for drying can not fully contact with the wafer for wafer drying efficiency and nitrogen gas's utilization efficiency reduce.
Disclosure of Invention
The present invention is directed to a post-wafer etching and cleaning drying apparatus, which solves the above-mentioned problems in the prior art.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a wafer etching washs back drying equipment, includes the base, the axle groove has been seted up in the left side at base upper surface middle part, the guide way has been seted up on the right side at base upper surface middle part, the preceding left side fixed mounting of base has first driving piece, the top fixed mounting of first driving piece output shaft has first action wheel, the middle part activity in axle groove has cup jointed the swivel mount, the middle part fixed mounting of swivel mount curved surface has the outer ring gear with first action wheel meshing, the left side fixed mounting of swivel mount upper surface has the mainboard, the air groove has been seted up at the middle part of swivel mount upper surface, the ring channel has been seted up to the front and back bilateral symmetry of swivel mount upper surface, two the middle part of ring channel has all been slided and has been cup jointed the curb plate, the right flank fixed mounting at mainboard upper portion has the deflector, the right flank fixed mounting at mainboard middle part has the carrier mechanism, carrier mechanism and curb plate slidely cup joint, the middle part of air groove is equipped with air inlet mechanism, the right flank fixed mounting of mainboard bottom has the pushing mechanism, the middle part of guide way is equipped with transport mechanism.
Preferably, the object carrying mechanism comprises a mounting ring, the left side fixed mounting of the ring curved surface is at the middle part of mainboard right flank, the slip ring has been cup jointed in the front and back bilateral symmetry slip of mounting ring curved surface, the inner curved surface fixed mounting of mounting ring has the ring shell, the bottom fixed mounting of ring shell inner curved surface has the ring seat, the middle part of ring seat is equipped with the wafer, the right side sliding sleeve at deflector middle part has the slide, the preceding and back symmetry fixed mounting of slide has the sloping block, the upper portion fixed mounting of slide inner chamber has the outlet duct, the activity of slide inner chamber has cup jointed the tube axle, the bottom circumference equidistance fixed mounting of tube axle has the multiunit curved tube, the upper surface circumference equidistance of ring shell is fixed with the multiunit pipe box, the one end slip cup joint of curved tube keeping away from the slide is at the middle part of adjacent pipe box, the bottom fixed mounting of tube axle has the top cap, the upper portion fixed mounting of top cap outer curved surface has the spacing collar.
Preferably, the air inlet mechanism comprises a jacking block, the right side of jacking block fixed mounting at the swivel mount upper surface, the left side fixed mounting of jacking block has first telescopic link, the left end fixed mounting of first telescopic link has the gas shell that cup joints with the gas tank slip, the middle part fixed mounting of swivel mount has the intake pipe, the top fixed mounting of gas shell has the connecting pipe, connecting pipe top fixed mounting has the valve casing, the upper end fixed mounting of valve casing has the sleeve pipe, the sleeve pipe is the middle part and has cup jointed the shower nozzle in a sliding way, the upper portion fixed mounting of shower nozzle has the swivel plate, the rear fixed mounting of swivel plate has the link plate, the rear side fixed mounting of link plate lower surface has the swash plate, the bottom sliding of swash plate cup joints the piston that cup joints with the valve casing medial surface slip.
Preferably, the pushing mechanism comprises a pushing sleeve, the left end of the pushing sleeve is fixedly arranged on the right side surface of the bottom of the main board, an elastic piece is fixedly arranged on the left side of an inner cavity of the pushing sleeve, a pushing plug which is in sliding sleeve connection with the inner side surface of the pushing sleeve is fixedly arranged on the right end of the elastic piece, a middle plate is fixedly arranged on the right end of the pushing plug, pushing blocks are fixedly arranged on the front side and the rear side of the right side surface of the middle plate, and the right end surface of each pushing block is in sliding contact with the side plate.
Preferably, the handling mechanism comprises a third telescopic rod, the right end of the third telescopic rod is fixedly arranged on the right side face of the guide groove, the left end of the third telescopic rod is fixedly provided with a sliding block which is in sliding sleeve joint with the guide groove, the top end of the sliding block is fixedly provided with a main shaft, the bottom of the main shaft is fixedly provided with a push rod, the middle part of the main shaft is fixedly provided with a driving seat, the front side of the upper surface of the driving seat is fixedly provided with a second driving piece, the top end of an output shaft of the second driving piece is fixedly provided with a second driving wheel, the upper part of the main shaft is movably sleeved with a collar, the lower surface of the collar is fixedly provided with a driven toothed ring which is meshed with the second driving wheel, the side face of the collar is fixedly provided with a clamp, and the top of the main shaft is fixedly provided with a lifting plate.
Preferably, the inner cavity of the spray head is conical, and a plurality of groups of through grooves are formed in the circumference of the bottom of the spray head at equal intervals.
Preferably, the depth of the top cover inner cavity is two thirds of the height of the sliding seat, the depth of the side surface of the upper part of the ring seat is one third of the height of the sliding seat, and the vertical distance between the top surface of the ring seat and the top surface of the top cover is one third to two thirds of the height of the sliding seat.
The beneficial effects of the invention are as follows:
1. according to the invention, the processing surface of the wafer is firstly placed downwards at the upper part of the inner cavity of the ring seat, then the air inlet mechanism is started, the nitrogen sprayed by the air inlet mechanism pushes the wafer to move upwards along the curved surfaces of the inner cavity of the ring seat and the top cover, so that the upper surface of the wafer is attached to the top surface of the inner cavity of the top cover, and the bottom surface of the wafer is positioned between the top surface of the ring seat and the bottom surface of the top cover, thereby avoiding that part of water and impurities on the processing surface of the wafer remain at the edges of the clamping device and the processing surface of the wafer when the clamping device of the existing wafer drying device is used for centrifugal drying, so that the moisture and impurities on the processing surface of the wafer are not thoroughly processed, the qualification rate of the wafer is reduced, and in addition, the processing surface of the wafer is placed downwards, the water drops attached to the processing surface of the wafer can generate a downward dropping trend under the action of self gravity, so that the contact area of the water drops at the root of the water drops is reduced, and the processing surface of the wafer is more easily separated from the processing surface of the wafer, and the drying speed and efficiency of the wafer are improved.
2. According to the invention, the piston is driven to move to the rear side by the second telescopic rod through the rotating plate, the connecting plate and the inclined plate, so that the valve shell is opened, at the moment, dry nitrogen sequentially passes through the air inlet pipe, the air shell, the connecting pipe, the valve shell and the sleeve pipe and finally is sprayed to the processing surface of the bottom of the wafer from the opening of the nozzle, in addition, the distance between the top end of the nozzle and the processing surface of the bottom of the wafer is gradually increased along with the continuous downward movement of the second telescopic rod, the gas sprayed from the nozzle is gradually expanded from the center of the wafer to the outer side of the wafer, in addition, the second telescopic rod drives the piston to gradually move to the rear side through the rotating plate, the connecting plate and the inclined plate, so that the valve port of the valve shell is gradually increased, the nitrogen flowing out of the nozzle is increased, and further, when the nozzle moves downwards, the nitrogen sprayed to the processing surface of the bottom of the wafer is kept uniform, in addition, the first telescopic rod is started to push the air shell to move left and right, the connecting pipe, the valve shell, the sleeve pipe and the nozzle are driven to move left and right, so that the non-processed parts of the center of the processing surface of the wafer are compensated, and the existing linear nozzle for drying spraying is gradually expanded from the center of the wafer to the outer side of the wafer, and the wafer is not wasted when the wafer is sprayed, and the area of the wafer is gradually reduced from the two sides of the wafer is projected to the wafer when the wafer is sprayed.
3. According to the invention, nitrogen is sprayed on the processing surface of the wafer through the spray head, and then is sucked through the air outlet pipe, so that the nitrogen sprayed on the processing surface at the bottom of the wafer is adhered to the processing surface of the wafer, flows into the annular shell, and flows out through the pipe sleeve, the curved pipe, the pipe shaft and the air outlet pipe, thereby solving the problem that the existing nitrogen sprayed on the processing surface of the wafer is bounced by the reaction force of the wafer, so that the gas for drying cannot be fully contacted with the wafer, and improving the drying efficiency and the utilization efficiency of the nitrogen.
Drawings
FIG. 1 is a schematic view of the overall appearance of the structure of the present invention;
FIG. 2 is a schematic view of a structural handling mechanism according to the present invention;
FIG. 3 is a schematic view of an air intake mechanism of the present invention;
FIG. 4 is a diagram illustrating a structure of the present invention;
FIG. 5 is a schematic view of a slip ring according to the present invention;
FIG. 6 is a schematic view of the tube axis of the present invention;
FIG. 7 is a schematic view of a spray head according to the present invention.
In the figure: 1. a base; 101. a shaft groove; 102. a guide groove; 2. a first driving member; 3. a first drive wheel; 4. an outer ring gear; 501. an air tank; 5. rotating base; 502. an annular groove; 6. a main board; 7. a side plate; 8. a guide plate; 9. a loading mechanism; 901. a mounting ring; 902. a slip ring; 903. a ring shell; 904. a ring seat; 905. a slide; 906. a sloping block; 907. an air outlet pipe; 908. a tube shaft; 909. a curved tube; 910. a pipe sleeve; 911. a top cover; 912. a limit ring; 10. an air inlet mechanism; 1001. a top block; 1002. a first telescopic rod; 1003. a gas shell; 1004. an air inlet pipe; 1005. a connecting pipe; 1006. a valve housing; 1007. a sleeve; 1008. a spray head; 1009. a rotating plate; 1010. a connecting plate; 1011. a sloping plate; 1012. a piston; 1013. a second telescopic rod; 11. a pushing mechanism; 1101. pushing the sleeve; 1102. an elastic member; 1103. pushing the plug; 1104. a middle plate; 1105. a pushing block; 12. a carrying mechanism; 1201. a third telescopic rod; 1202. a sliding block; 1203. a main shaft; 1204. a push rod; 1205. a driving seat; 1206. a second driving member; 1207. a second driving wheel; 1208. a passive toothed ring; 1209. a collar; 1210. a clamp; 1211. and (5) lifting the plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 7, the embodiment of the invention provides a drying device after etching and cleaning of wafers, which comprises a base 1, wherein a shaft groove 101 is formed in the left side of the middle part of the upper surface of the base 1, a guide groove 102 is formed in the right side of the middle part of the upper surface of the base 1, a first driving piece 2 is fixedly arranged on the left side of the front of the base 1, a first driving wheel 3 is fixedly arranged at the top end of an output shaft of the first driving piece 2, a rotating seat 5 is movably sleeved in the middle part of the shaft groove 101, an outer ring 4 meshed with the first driving wheel 3 is fixedly arranged in the middle part of the curved surface of the rotating seat 5, a main plate 6 is fixedly arranged on the left side of the upper surface of the rotating seat 5, air grooves 501 are formed in the middle part of the upper surface of the rotating seat 5, annular grooves 502 are symmetrically formed in front and rear sides of the upper surface of the rotating seat 5, side plates 7 are sleeved in the middle parts of the two annular grooves 502 in a sliding mode, a guide plate 8 is fixedly arranged on the right side surface of the upper part of the main plate 6, the right side surface of the middle part of the main board 6 is fixedly provided with a carrying mechanism 9, the carrying mechanism 9 is in sliding sleeve connection with the side board 7, the middle part of the air groove 501 is provided with an air inlet mechanism 10, the right side surface of the bottom of the main board 6 is fixedly provided with a pushing mechanism 11, the middle part of the guide groove 102 is provided with a carrying mechanism 12, wherein the contact surface of the swivel base 5 and the shaft groove 101 is a smooth surface, thereby reducing friction resistance between the swivel base 5 and the shaft groove 101, reducing heat generated by friction between the swivel base 5 and the shaft groove 101, avoiding rapid heating deformation of the swivel base 5 and the shaft groove 101, and greatly vibrating the swivel base 5 when the swivel base 5 rotates at a high speed, so that the device and a wafer are damaged, when the wafer are used, the output shaft of the first driving piece 2 is electrified, the output shaft of the first driving piece 2 drives the first driving wheel 3 to rotate at a high speed, the first driving wheel 3 drives the outer gear ring 4 to rotate, the outer gear ring 4 drives the swivel base 5 to rotate, and the swivel base 5 drives the main board 6 to be damaged The side plate 7 and the air inlet mechanism 10 rotate, the main plate 6 drives the guide plate 8 and the pushing mechanism 11, the main plate 6, the side plate 7 and the guide plate 8 drive the carrying mechanism 9 to rotate, and the carrying mechanism 9 drives the wafer to rotate at a high speed, so that moisture and impurities on the wafer are separated from the processing surface of the wafer.
As shown in fig. 1, 5 and 6, the carrying mechanism 9 comprises a mounting ring 901, the left side of the curved surface of the mounting ring 901 is fixedly mounted in the middle of the right side surface of the main board 6, sliding rings 902 are symmetrically and slidably sleeved on the front side and the rear side of the curved surface of the mounting ring 901, a ring shell 903 is fixedly mounted on the inner curved surface of the mounting ring 901, a ring seat 904 is fixedly mounted at the bottom of the inner curved surface of the ring shell 903, a wafer is arranged in the middle of the ring seat 904, a slide seat 905 is slidably sleeved on the right side of the middle of the guide plate 8, inclined blocks 906 are symmetrically and fixedly mounted in the front and the rear of the slide seat 905, an air outlet pipe 907 is fixedly mounted at the upper part of the inner cavity of the slide seat 905, a pipe shaft 908 is movably sleeved at the bottom circumference of the pipe shaft 908, a plurality of curved pipes 909 are fixedly mounted at equal intervals, a plurality of pipe sleeves 910 are fixedly mounted at the circumference of the upper surface of the ring shell 903 at equal intervals, one end of each curved pipe 909 far away from the slide seat 905 is slidably sleeved in the middle of the adjacent pipe sleeves 910, the bottom end of the tube shaft 908 is fixedly provided with a top cover 911, the upper part of the outer curved surface of the top cover 911 is fixedly provided with a limit ring 912, wherein the depth of the inner cavity of the top cover 911 is two thirds of the height of the sliding seat 905, the depth of the side surface of the upper part of the ring seat 904 is one third of the height of the sliding seat 905, the vertical distance between the top surface of the ring seat 904 and the top surface of the top cover 911 is one third to two thirds of the height of the sliding seat 905, the top surface of the inner cavity of the top cover 911 is provided with a rubber coating, so that the friction resistance between the top surface of a wafer and the top cover 911 is improved, the wafer is prevented from sliding when the top cover 911 drives the wafer to rotate, during use, the processing surface of the wafer is firstly placed downwards on the upper part of the inner cavity of the ring seat 904, then the air inlet mechanism 10 is started, and nitrogen sprayed by the air inlet mechanism 10 pushes the wafer to move upwards along the curved surfaces of the ring seat 904 and the inner cavity of the top cover 911 to enable the upper surface of the wafer to be attached to the top surface of the inner cavity of the top cover, at this time, the bottom surface of the wafer is located between the top surface of the ring seat 904 and the bottom surface of the top cover 911, then the first driving piece 2 is started, the first driving piece 2 drives the carrying mechanism 9 to rotate through the first driving wheel 3, the outer ring gear 4, the rotating seat 5, the main board 6, the side boards 7 and the guide boards 8, and the carrying mechanism 9 drives the wafer to rotate, so that water and impurities on the processing surface of the bottom of the wafer are separated from the processing surface of the bottom of the wafer, and the processing surface of the wafer is dried in a centrifugal manner, so that when the edge of the wafer is clamped and centrifugally dried by the clamp of the conventional wafer drying equipment, the bottom processing surface is located between the top surface of the ring seat 904 and the bottom surface of the top cover 911, part of the water and impurities are prevented from remaining at the edge of the clamp and the wafer, the qualification rate of the wafer is improved, and in addition, the processing surface of the wafer is placed downwards, and water drops attached to the processing surface of the wafer can be enabled to generate downward dropping trend under the action of self gravity, so that the contact area between the root and the wafer is reduced, so that the water drops are easier to separate from the processing surface of the wafer, and the drying speed and efficiency are improved.
As shown in fig. 1, 3, 4 and 7, the air intake mechanism 10 comprises a top block 1001, the top block 1001 is fixedly mounted on the right side of the upper surface of a swivel base 5, a first telescopic rod 1002 is fixedly mounted on the left side of the top block 1001, an air shell 1003 in sliding sleeve connection with an air tank 501 is fixedly mounted at the left end of the first telescopic rod 1002, an air intake pipe 1004 is fixedly mounted in the middle of the swivel base 5, a connecting pipe 1005 is fixedly mounted at the top of the air shell 1003, a valve casing 1006 is fixedly mounted at the top of the connecting pipe 1005, a sleeve 1007 is fixedly mounted at the upper end of the valve casing 1006, the sleeve 1007 is in sliding sleeve connection with a spray head 1008 in the middle, wherein the inner cavity of the spray head 1008 is conical, a plurality of groups of through grooves are formed in the circumference of the bottom of the spray head 1008 at equal intervals, a rotating plate 1009 is fixedly mounted at the upper part of the spray head 1008, a connecting plate 1010 is fixedly mounted at the rear of the rotating plate 1009, a sloping plate 1011 is fixedly mounted at the rear side of the lower surface of the connecting plate 1010, a piston 1012 is in sliding sleeve connection with the bottom of the sloping plate 1011, the bottom end of the sloping plate 1011 is inclined towards the direction of the sleeve 1007, so that when the sloping plate 1011 moves downwards, the piston 1012 can be driven to move backwards, the valve port of the valve casing 1006 is opened, the conical spray head 1008 can enable the gas flowing out of the inner cavity of the spray head 1008 to spread outwards circularly, and thus the whole processing surface of the wafer is dried, when the device is used, the second telescopic rod 1013 drives the rotating plate 1009 to move downwards, the rotating plate 1009 drives the spray head 1008 and the connecting plate 1010 to move downwards, the connecting plate 1010 drives the sloping plate 1011 to move downwards, the sloping plate 1011 pushes the piston 1012 which is in sliding connection with the sloping plate 1011 to move backwards, thus the valve casing 1006 is opened, the nitrogen gas used for drying flows into the air inlet pipe 1004, the nitrogen gas in the air inlet pipe 1004 enters the inner cavity of the valve casing 1006 sequentially through the air inlet casing 1003 and the connecting pipe 1005, the gas in the inner cavity of the valve casing 1006 sequentially passes through the sleeve 1007 and the spray head 1008, finally, the nitrogen gas sprayed from the spray head 1008 pushes the wafer to move upwards along the curved surfaces of the ring seat 904 and the inner cavity of the top cover 911 through the opening of the spray head 1008, so that the upper surface of the wafer is attached to the top surface of the inner cavity of the top cover 911, at the moment, the bottom surface of the wafer is positioned between the top surface of the ring seat 904 and the bottom surface of the top cover 911, in addition, as the second telescopic rod 1013 moves downwards along with the spray head 1008 through the rotating plate 1009, the distance between the top end of the spray head 1008 and the processing surface of the wafer bottom is gradually increased, so that the gas sprayed from the spray head 1008 gradually expands from the center of the wafer to the outer side of the wafer, and the whole processing surface of the wafer is dried, in addition, as the second telescopic rod 1013 moves downwards along with the spray head 1008 through the rotating plate 1009, the rotating plate 1010 and the inclined plate 1011 drives the piston 1012 to gradually move backwards, so that the valve port of the valve housing 1006 gradually increases, and thus the gas flowing out of the spray head 1008 increases, when the spray head 1008 moves downwards, the distance between the top end of the processing surface of the spray head 1008 and the wafer bottom is ensured, the nitrogen gas sprayed from the top end of the wafer is kept uniform, in addition, the non-uniform drying is avoided, the first telescopic rod 1002 is started, the gas sprayed from the center of the wafer is gradually expands from the center of the wafer to the wafer, and the wafer is gradually, the drying surface is sprayed from the front of the wafer, and the wafer is sprayed to the wafer is gradually when the front is sprayed and the front is sprayed to the front, and the wafer is in the front, and the front is, and the front of the wafer is, and the wafer is sprayed.
As shown in fig. 1, 3 and 4, the pushing mechanism 11 includes a push sleeve 1101, a left end of the push sleeve 1101 is fixedly mounted on a right side surface of a bottom of the main board 6, an elastic member 1102 is fixedly mounted on a left side of an inner cavity of the push sleeve 1101, a push plug 1103 is fixedly mounted on a right end of the elastic member 1102 in sliding sleeve connection with an inner side surface of the push sleeve 1101, a middle board 1104 is fixedly mounted on a right end of the push plug 1103, push blocks 1105 are fixedly mounted on front and rear sides of the right side surface of the middle board 1104, when a push rod 1204 on the handling mechanism 12 pushes the side board 7 to move leftwards along the annular groove 502, the side board 7 pushes the push blocks 1105 to move leftwards, the middle board 1104 pushes the push plug 1103 to move leftwards, the push plug 1103 compresses the elastic member 1102, and when the handling mechanism 12 moves rightwards, the push plug 1103 pushes the middle board 1104 to move rightwards, the push blocks 1105 push the side board 7 to reset rightwards, so that the handling mechanism 12 can drive the two side boards 7 to pass through the middle part 904 to move upwards.
As shown in fig. 1 and 2, the carrying mechanism 12 includes a third telescopic rod 1201, a right end of the third telescopic rod 1201 is fixedly mounted on a right side surface of the guide slot 102, a sliding block 1202 in sliding sleeve connection with the guide slot 102 is fixedly mounted at a left end of the third telescopic rod 1201, a main shaft 1203 is fixedly mounted at a top end of the sliding block 1202, a push rod 1204 is fixedly mounted at a bottom of the main shaft 1203, a driving seat 1205 is fixedly mounted at a middle part of the main shaft 1203, a second driving member 1206 is fixedly mounted at a front side of an upper surface of the driving seat 1205, a second driving wheel 1207 is fixedly mounted at a top end of an output shaft of the second driving member 1206, a collar 1209 is movably sleeved at an upper portion of the main shaft 1203, a driven toothed ring 1208 meshed with the second driving wheel 1207 is fixedly mounted at a lower surface of the collar 1209, a clamp 1210 is fixedly mounted at a side surface of the collar 1209, a lifting plate 1211 is fixedly mounted at a top of the main shaft 1203, the second driving member 1206 drives the second driving wheel 1207 to rotate, the second driving wheel 1207 drives the driven toothed ring 1208 to rotate, the driven toothed ring 1208 drives the collar 1209 to rotate around the curved surface of the main shaft 1203, the collar 1209 drives the clamp 1210 to rotate, the clamp 1210 takes materials from the feeding area, the second driving member 1206 reverses, the clamp 1210 drives the wafer to rotate, the circle center of the wafer is positioned at the left side of the center line of the base 1, the third telescopic rod 1201 is started again, the third telescopic rod 1201 drives the sliding block 1202 to move leftwards along the guide groove 102, the sliding block 1202 drives the wafer to move leftwards through the main shaft 1203, the collar 1209 and the clamp 1210, meanwhile, the push rod 1204 drives the side plate 7 to move leftwards, the side plate 7 drives the pushing mechanism 11 to shrink, the lifting plate 1211 contacts with the inclined block 906, the inclined block 906 drives the slide 905 to move upwards along the inner cavity side surface of the guide plate 8, the slide 905 drives the air outlet pipe 907 and the pipe 908 to move upwards, the pipe shaft 908 drives the curved pipe 909 and the top cover 911 to move upwards, the top cover 911 drives the limit ring 912 to move upwards, the curved tube 909 is separated from the middle part of the pipe sleeve 910, the clamp 1210 drives the wafer to pass through the two side plates 7 to move to the middle part of the ring seat 904 and the top cover 911, the clamp 1210 loosens the wafer, the wafer is placed on the ring seat 904, the third telescopic rod 1201 is contracted, the third telescopic rod 1201 drives the push rod 1204 to move right through the sliding block 1202 and the main shaft 1203, the pushing mechanism 11 pushes the side plates 7 to reset, the lifting plate 1211 moves right simultaneously, the lifting plate 1211 is separated from the inclined block 906, the top cover 911 is moved downwards by gravity, the top cover 911 drives the pipe shaft 908 to move downwards, the pipe shaft 908 drives the curved tube 909 to move downwards and be inserted into the middle part of the pipe sleeve 910, and the main shaft 1203 drives the clamp 1210 to return to the initial position through the collar 1209.
Working principle and using flow:
when in use, the carrying mechanism 12 carries the wafer in the feeding area to the middle part of the carrying mechanism 9, the processing surface of the wafer is downward, the second telescopic rod 1013 is started, the second telescopic rod 1013 is contracted, the second telescopic rod 1013 drives the piston 1012 to move backward through the rotating plate 1009, the connecting plate 1010 and the inclined plate 1011, the valve port of the valve casing 1006 is opened, the air inlet pipe 1004 is used for air inlet, nitrogen in the air inlet pipe 1004 sequentially passes through the air shell 1003, the air inlet pipe 1004, the connecting pipe 1005, the valve casing 1006 and the sleeve 1007 and then is sprayed out from the top of the spray head 1008, the nitrogen sprayed by the spray head 1008 pushes the wafer to move upward along the curved surfaces of the inner cavities of the ring seat 904 and the top cover 911, the upper surface of the wafer is attached to the top surface of the inner cavity of the top cover 911, at the moment, the bottom surface of the wafer is positioned between the top surface of the ring seat 904 and the bottom surface of the top cover 911, the air outlet pipe 907 is sucked at the same time, the nitrogen sprayed out of the spray head 1008 flows into the ring casing 903 through the processing surface of the wafer, the nitrogen in the ring shell 903 flows out through the pipe sleeve 910, the curved pipe 909, the pipe shaft 908 and the air outlet pipe 907, along with the second telescopic rod 1013 moving downwards through the rotating plate 1009 with the spray head 1008, the distance between the top end of the spray head 1008 and the processing surface of the bottom of the wafer is gradually increased, so that the gas sprayed from the spray head 1008 is gradually expanded from the center of the wafer to the outer side of the wafer, in addition, the first telescopic rod 1002 is started, the first telescopic rod 1002 pushes the gas shell 1003 to move left and right, the gas shell 1003 drives the connecting pipe 1005, the valve shell 1006, the sleeve 1007 and the spray head 1008 to move left and right, so that the center of the processing surface of the bottom of the wafer is compensated, the whole processing surface of the bottom of the wafer is air-dried, in addition, the first driving piece 2 is electrified, the output shaft of the first driving piece 2 drives the first driving wheel 3 to rotate at high speed, the first driving wheel 3 drives the outer gear ring 4 to rotate, the outer gear 4 drives the rotating seat 5 to rotate, the swivel mount 5 drives mainboard 6, curb plate 7 and mechanism 10 that admits air and rotates, and mainboard 6 drives deflector 8 and pushing mechanism 11, and curb plate 7, mainboard 6 and deflector 8 and drive and carry thing mechanism 9 rotation, carry thing mechanism 9 to drive the wafer high-speed rotation to accelerate moisture and impurity and break away from the surface of wafer, improve drying rate.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a wafer etching washs back drying equipment, includes base (1), axle groove (101) have been seted up in the left side at base (1) upper surface middle part, guide way (102), its characterized in that have been seted up on the right side at base (1) upper surface middle part: the novel automatic lifting device is characterized in that a first driving piece (2) is fixedly arranged on the left side of the front face of the base (1), a first driving wheel (3) is fixedly arranged at the top end of an output shaft of the first driving piece (2), a rotating seat (5) is movably sleeved at the middle part of the shaft groove (101), an outer gear ring (4) meshed with the first driving wheel (3) is fixedly arranged at the middle part of the curved surface of the rotating seat (5), a main plate (6) is fixedly arranged on the left side of the upper surface of the rotating seat (5), an air groove (501) is formed in the middle part of the upper surface of the rotating seat (5), annular grooves (502) are symmetrically formed in the front side and the rear side of the upper surface of the rotating seat (5), side plates (7) are respectively and slidably sleeved at the middle parts of the two annular grooves (502), a guide plate (8) is fixedly arranged at the right side surface of the upper part of the main plate (6), a carrying mechanism (9) is fixedly arranged at the right side surface of the middle part of the main plate (6), the carrying mechanism (9) is slidably sleeved with the side plate (7), an air inlet mechanism (10) is fixedly arranged at the middle part of the main plate (6), and a pushing mechanism (12) is fixedly arranged at the right side surface of the main plate (12).
The object carrying mechanism (9) comprises a mounting ring (901), the left side of the curved surface of the mounting ring (901) is fixedly arranged in the middle of the right side surface of a main board (6), sliding rings (902) are symmetrically sleeved on the front side and the rear side of the curved surface of the mounting ring (901) in a sliding mode, a ring shell (903) is fixedly arranged on the inner curved surface of the mounting ring (901), a ring seat (904) is fixedly arranged at the bottom of the inner curved surface of the ring shell (903), a wafer is arranged in the middle of the ring seat (904), a slide seat (905) is sleeved on the right side of the middle of the guide plate (8) in a sliding mode, oblique blocks (906) are symmetrically and fixedly arranged in front of and behind the slide seat (905), an air outlet pipe (907) is fixedly arranged at the upper portion of an inner cavity of the slide seat (905), a plurality of groups of curved pipes (909) are fixedly arranged on the bottom circumference of the inner cavity of the slide seat (905) in an equidistant mode, a plurality of groups of pipe sleeves (910) are fixedly arranged on the upper surface of the ring shell (903) in an equidistant mode, a plurality of groups of pipe sleeves (910) are fixedly arranged on the circumference of the bottom of the curved pipe (908), one end of the curved pipe (909) far away from the adjacent sliding surfaces of the curved surface (911) are fixedly sleeved on the top cover (908);
the utility model provides an inlet mechanism (10) including kicking block (1001), kicking block (1001) fixed mounting is on the right side of swivel mount (5) upper surface, the left side fixed mounting of kicking block (1001) has first telescopic link (1002), the left end fixed mounting of first telescopic link (1002) has gas shell (1003) that cup joints with gas groove (501) slip, the middle part fixed mounting of swivel mount (5) has intake pipe (1004), the top fixed mounting of gas shell (1003) has connecting pipe (1005), connecting pipe (1005) top fixed mounting has valve casing (1006), the upper end fixed mounting of valve casing (1006) has sleeve pipe (1007) and second telescopic link (1013), sleeve pipe (1007) are that the middle part slides and cup joints shower nozzle (1008), the upper portion fixed mounting of shower nozzle (1008) has swivel plate (1009), the rear side fixed mounting of swivel plate (1009) lower surface has connecting plate (1011), the bottom sliding of swash plate (1011) has connecting pipe (1005) to connect with piston (1006) and slide through valve casing (1013) and second telescopic link (1013) and drive piston (1009) and stretch out and draw down.
2. The post wafer etching cleaning drying apparatus of claim 1, wherein: the pushing mechanism (11) comprises a pushing sleeve (1101), the left end of the pushing sleeve (1101) is fixedly arranged on the right side face of the bottom of the main board (6), an elastic piece (1102) is fixedly arranged on the left side of an inner cavity of the pushing sleeve (1101), a pushing plug (1103) which is in sliding sleeve connection with the inner side face of the pushing sleeve (1101) is fixedly arranged on the right end of the elastic piece (1102), a middle board (1104) is fixedly arranged on the right end of the pushing plug (1103), pushing blocks (1105) are fixedly arranged on the front side and the rear side of the right side face of the middle board (1104), and the right end face of each pushing block (1105) is in sliding contact with the side board (7).
3. The post wafer etching cleaning drying apparatus of claim 1, wherein: the carrying mechanism (12) comprises a third telescopic rod (1201), the right end of the third telescopic rod (1201) is fixedly arranged on the right side face of the guide groove (102), a sliding block (1202) which is in sliding sleeve connection with the guide groove (102) is fixedly arranged at the left end of the third telescopic rod (1201), a main shaft (1203) is fixedly arranged at the top end of the sliding block (1202), a push rod (1204) is fixedly arranged at the bottom of the main shaft (1203), a driving seat (1205) is fixedly arranged in the middle of the main shaft (1203), a second driving piece (1206) is fixedly arranged at the front side of the upper surface of the driving seat (1205), a second driving wheel (1207) is fixedly arranged at the top end of an output shaft of the second driving piece (1206), a shaft ring (1209) is movably sleeved at the upper part of the main shaft (1203), a driven toothed ring (1208) which is meshed with the second driving wheel (1207) is fixedly arranged at the lower surface of the shaft ring (1209), a clamp (1210) is fixedly arranged at the side face of the shaft ring (1209), and a lifting plate (1211) is fixedly arranged at the top of the main shaft (1203).
4. The post wafer etching cleaning drying apparatus of claim 1, wherein: the inner cavity of the spray head (1008) is conical, and a plurality of groups of through grooves are formed in the circumference of the bottom of the spray head (1008) at equal intervals.
5. The post wafer etching cleaning drying apparatus of claim 1, wherein: the depth of the inner cavity of the top cover (911) is two thirds of the height of the sliding seat (905), the depth of the side face of the upper portion of the ring seat (904) is one third of the height of the sliding seat (905), and the vertical distance between the top face of the ring seat (904) and the top face of the top cover (911) is one third to two thirds of the height of the sliding seat (905).
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