JP6518809B1 - スパッタリングターゲット及びその梱包方法 - Google Patents
スパッタリングターゲット及びその梱包方法 Download PDFInfo
- Publication number
- JP6518809B1 JP6518809B1 JP2018051437A JP2018051437A JP6518809B1 JP 6518809 B1 JP6518809 B1 JP 6518809B1 JP 2018051437 A JP2018051437 A JP 2018051437A JP 2018051437 A JP2018051437 A JP 2018051437A JP 6518809 B1 JP6518809 B1 JP 6518809B1
- Authority
- JP
- Japan
- Prior art keywords
- sputtering target
- cylindrical
- protective cap
- backing tube
- target according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005477 sputtering target Methods 0.000 title claims abstract description 160
- 238000000034 method Methods 0.000 title claims description 25
- 238000012856 packing Methods 0.000 title claims description 17
- 230000001681 protective effect Effects 0.000 claims abstract description 101
- 239000013077 target material Substances 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 39
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 11
- 239000000057 synthetic resin Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims description 32
- -1 polypropylene Polymers 0.000 claims description 24
- 229920001971 elastomer Polymers 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 12
- 239000000806 elastomer Substances 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 239000004698 Polyethylene Substances 0.000 claims description 9
- 229920000573 polyethylene Polymers 0.000 claims description 9
- 229920006311 Urethane elastomer Polymers 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 229920001973 fluoroelastomer Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 3
- 229920002449 FKM Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920000800 acrylic rubber Polymers 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920006124 polyolefin elastomer Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- 229920003225 polyurethane elastomer Polymers 0.000 claims 1
- 239000010408 film Substances 0.000 description 35
- 238000011156 evaluation Methods 0.000 description 27
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 18
- 239000007789 gas Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 239000011787 zinc oxide Substances 0.000 description 9
- 230000035699 permeability Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 229910003437 indium oxide Inorganic materials 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229920006298 saran Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000004323 axial length Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000009694 cold isostatic pressing Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011359 shock absorbing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B11/00—Wrapping, e.g. partially or wholly enclosing, articles or quantities of material, in strips, sheets or blanks, of flexible material
- B65B11/02—Wrapping articles or quantities of material, without changing their position during the wrapping operation, e.g. in moulds with hinged folders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Packages (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018051437A JP6518809B1 (ja) | 2018-03-19 | 2018-03-19 | スパッタリングターゲット及びその梱包方法 |
| TW108108464A TWI692539B (zh) | 2018-03-19 | 2019-03-13 | 濺射靶及其包裝方法 |
| KR1020190030712A KR20190110055A (ko) | 2018-03-19 | 2019-03-18 | 스퍼터링 타겟 및 그 포장방법 |
| CN201910207461.9A CN110282177B (zh) | 2018-03-19 | 2019-03-19 | 溅射靶及其包装方法 |
| KR1020210005846A KR102425203B1 (ko) | 2018-03-19 | 2021-01-15 | 스퍼터링 타겟 및 그 포장방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018051437A JP6518809B1 (ja) | 2018-03-19 | 2018-03-19 | スパッタリングターゲット及びその梱包方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6518809B1 true JP6518809B1 (ja) | 2019-05-22 |
| JP2019163501A JP2019163501A (ja) | 2019-09-26 |
Family
ID=66625572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018051437A Active JP6518809B1 (ja) | 2018-03-19 | 2018-03-19 | スパッタリングターゲット及びその梱包方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6518809B1 (zh) |
| KR (2) | KR20190110055A (zh) |
| CN (1) | CN110282177B (zh) |
| TW (1) | TWI692539B (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110979864B (zh) * | 2019-12-31 | 2024-02-06 | 东莞市欧莱溅射靶材有限公司 | 一种平面靶整组包装装置及整组包装方法 |
| DE102021129521B3 (de) * | 2021-11-12 | 2023-03-30 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem, Sputtervorrichtung und Verfahren |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59103857A (ja) * | 1982-12-06 | 1984-06-15 | 松下電器産業株式会社 | 管端保護キヤツプ |
| JPH04231461A (ja) * | 1990-12-27 | 1992-08-20 | Tosoh Corp | スパッタリングターゲットの保護具及び包装方法 |
| JP2538070Y2 (ja) * | 1991-06-25 | 1997-06-04 | 三菱樹脂株式会社 | リブ付管の端部保護用キャップ |
| JP3071989B2 (ja) | 1993-12-20 | 2000-07-31 | 松下電工株式会社 | 気泡発生浴槽の循環ポンプ取付構造 |
| JP3071989U (ja) * | 2000-03-24 | 2000-09-29 | 細田電器産業株式会社 | 電線管の端部保護キャップ |
| DE102004058316A1 (de) * | 2004-12-02 | 2006-06-08 | W.C. Heraeus Gmbh | Rohrförmiges Sputtertarget |
| JP5467735B2 (ja) * | 2007-07-02 | 2014-04-09 | 東ソー株式会社 | 円筒形スパッタリングターゲット |
| WO2010046486A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation |
| JP5428741B2 (ja) * | 2009-10-19 | 2014-02-26 | 東ソー株式会社 | 円筒形スパッタリングターゲットの製造方法 |
| JP5679315B2 (ja) * | 2010-03-31 | 2015-03-04 | 日立金属株式会社 | 円筒型Ｍｏ合金ターゲットの製造方法 |
| JP5607512B2 (ja) * | 2010-11-24 | 2014-10-15 | 古河電気工業株式会社 | 円筒状ターゲット材、その製造方法、及び、そのシート被覆方法 |
| US20140124365A1 (en) * | 2011-04-29 | 2014-05-08 | Dieter Wurczinger | Method of forming a cylindrical sputter target assembly |
| CN103361612A (zh) * | 2012-04-05 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | 圆柱磁控溅射靶 |
| JP6089983B2 (ja) * | 2012-07-18 | 2017-03-08 | 三菱マテリアル株式会社 | 円筒形スパッタリングターゲットおよびその製造方法 |
| JP6383726B2 (ja) * | 2013-07-05 | 2018-08-29 | Ａｇｃセラミックス株式会社 | スパッタリングターゲット及びその製造方法 |
| US10697056B2 (en) * | 2015-03-18 | 2020-06-30 | Vital Thin Film Materials (Guangdong) Co., Ltd. | Methods of forming rotary sputtering target |
| JP6178455B1 (ja) * | 2016-03-30 | 2017-08-09 | Ｊｘ金属株式会社 | 円筒型スパッタリングターゲット及びその梱包方法 |
-
2018
- 2018-03-19 JP JP2018051437A patent/JP6518809B1/ja active Active
-
2019
- 2019-03-13 TW TW108108464A patent/TWI692539B/zh active
- 2019-03-18 KR KR1020190030712A patent/KR20190110055A/ko active Application Filing
- 2019-03-19 CN CN201910207461.9A patent/CN110282177B/zh active Active
-
2021
- 2021-01-15 KR KR1020210005846A patent/KR102425203B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TWI692539B (zh) | 2020-05-01 |
| JP2019163501A (ja) | 2019-09-26 |
| KR20190110055A (ko) | 2019-09-27 |
| TW201938830A (zh) | 2019-10-01 |
| KR20210008140A (ko) | 2021-01-20 |
| KR102425203B1 (ko) | 2022-07-25 |
| CN110282177A (zh) | 2019-09-27 |
| CN110282177B (zh) | 2021-02-09 |
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