JP6518666B2 - 薄い基板をハンドリングするための静電キャリア - Google Patents

薄い基板をハンドリングするための静電キャリア Download PDF

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Publication number
JP6518666B2
JP6518666B2 JP2016533317A JP2016533317A JP6518666B2 JP 6518666 B2 JP6518666 B2 JP 6518666B2 JP 2016533317 A JP2016533317 A JP 2016533317A JP 2016533317 A JP2016533317 A JP 2016533317A JP 6518666 B2 JP6518666 B2 JP 6518666B2
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electrode
electrostatic chuck
dielectric layer
support
top surface
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JP2016533317A
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Japanese (ja)
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JP2016529718A (ja
JP2016529718A5 (enExample
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マイケル エス コックス
マイケル エス コックス
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Applied Materials Inc
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Applied Materials Inc
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Priority to JP2019080749A priority Critical patent/JP6968120B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2016533317A 2013-08-05 2014-07-24 薄い基板をハンドリングするための静電キャリア Active JP6518666B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019080749A JP6968120B2 (ja) 2013-08-05 2019-04-22 薄い基板をハンドリングするための静電キャリア

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862471P 2013-08-05 2013-08-05
US61/862,471 2013-08-05
PCT/US2014/048065 WO2015020810A1 (en) 2013-08-05 2014-07-24 Electrostatic carrier for thin substrate handling

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019080749A Division JP6968120B2 (ja) 2013-08-05 2019-04-22 薄い基板をハンドリングするための静電キャリア

Publications (3)

Publication Number Publication Date
JP2016529718A JP2016529718A (ja) 2016-09-23
JP2016529718A5 JP2016529718A5 (enExample) 2017-08-31
JP6518666B2 true JP6518666B2 (ja) 2019-05-22

Family

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Family Applications (2)

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JP2016533317A Active JP6518666B2 (ja) 2013-08-05 2014-07-24 薄い基板をハンドリングするための静電キャリア
JP2019080749A Active JP6968120B2 (ja) 2013-08-05 2019-04-22 薄い基板をハンドリングするための静電キャリア

Family Applications After (1)

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JP2019080749A Active JP6968120B2 (ja) 2013-08-05 2019-04-22 薄い基板をハンドリングするための静電キャリア

Country Status (6)

Country Link
US (2) US9536768B2 (enExample)
JP (2) JP6518666B2 (enExample)
KR (2) KR102139682B1 (enExample)
CN (2) CN110085546B (enExample)
TW (2) TWI629748B (enExample)
WO (1) WO2015020810A1 (enExample)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
JP6518666B2 (ja) * 2013-08-05 2019-05-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 薄い基板をハンドリングするための静電キャリア
JP6282080B2 (ja) * 2013-10-30 2018-02-21 株式会社日立ハイテクノロジーズ プラズマ処理装置
US9551070B2 (en) * 2014-05-30 2017-01-24 Applied Materials, Inc. In-situ corrosion resistant substrate support coating
CN108474109B (zh) 2016-01-13 2021-08-03 应用材料公司 保持基板的保持布置、支撑基板的载体、沉积系统、保持基板的方法和释放基板的方法
DE102016206193A1 (de) * 2016-04-13 2017-10-19 Trumpf Gmbh + Co. Kg Elektroadhäsionsgreifer mit fraktalen Elektroden
JP6867686B2 (ja) * 2017-06-30 2021-05-12 株式会社 セルバック 接合装置
KR102515262B1 (ko) * 2018-12-05 2023-03-29 가부시키가이샤 아루박 정전척, 진공처리장치 및 기판처리방법
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210381101A1 (en) * 2020-06-03 2021-12-09 Applied Materials, Inc. Substrate processing system
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US12046503B2 (en) 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
JP2025119839A (ja) * 2024-02-02 2025-08-15 信越化学工業株式会社 静電吸着機能を有する加熱装置

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JP6518666B2 (ja) * 2013-08-05 2019-05-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 薄い基板をハンドリングするための静電キャリア
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Also Published As

Publication number Publication date
CN110085546B (zh) 2023-05-16
TW201519362A (zh) 2015-05-16
JP2019125811A (ja) 2019-07-25
CN110085546A (zh) 2019-08-02
TWI629748B (zh) 2018-07-11
KR102139682B1 (ko) 2020-07-30
US20150036260A1 (en) 2015-02-05
JP2016529718A (ja) 2016-09-23
CN105408992B (zh) 2019-01-29
US9779975B2 (en) 2017-10-03
KR101812666B1 (ko) 2017-12-27
KR20170063982A (ko) 2017-06-08
CN105408992A (zh) 2016-03-16
TW201737411A (zh) 2017-10-16
WO2015020810A1 (en) 2015-02-12
KR20160040656A (ko) 2016-04-14
US20170062261A1 (en) 2017-03-02
US9536768B2 (en) 2017-01-03
TWI613756B (zh) 2018-02-01
JP6968120B2 (ja) 2021-11-17

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