KR102139682B1 - 얇은 기판 취급을 위한 정전 캐리어 - Google Patents

얇은 기판 취급을 위한 정전 캐리어 Download PDF

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Publication number
KR102139682B1
KR102139682B1 KR1020177014510A KR20177014510A KR102139682B1 KR 102139682 B1 KR102139682 B1 KR 102139682B1 KR 1020177014510 A KR1020177014510 A KR 1020177014510A KR 20177014510 A KR20177014510 A KR 20177014510A KR 102139682 B1 KR102139682 B1 KR 102139682B1
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South Korea
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electrode
dielectric layer
esc
electrostatic chuck
substrate
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Korean (ko)
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KR20170063982A (ko
Inventor
마이클 에스. 콕스
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020177014510A 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어 Active KR102139682B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862471P 2013-08-05 2013-08-05
US61/862,471 2013-08-05
PCT/US2014/048065 WO2015020810A1 (en) 2013-08-05 2014-07-24 Electrostatic carrier for thin substrate handling

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167005660A Division KR101812666B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어

Publications (2)

Publication Number Publication Date
KR20170063982A KR20170063982A (ko) 2017-06-08
KR102139682B1 true KR102139682B1 (ko) 2020-07-30

Family

ID=52427454

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177014510A Active KR102139682B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어
KR1020167005660A Active KR101812666B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어

Family Applications After (1)

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KR1020167005660A Active KR101812666B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어

Country Status (6)

Country Link
US (2) US9536768B2 (enExample)
JP (2) JP6518666B2 (enExample)
KR (2) KR102139682B1 (enExample)
CN (2) CN105408992B (enExample)
TW (2) TWI629748B (enExample)
WO (1) WO2015020810A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102139682B1 (ko) * 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
JP6282080B2 (ja) * 2013-10-30 2018-02-21 株式会社日立ハイテクノロジーズ プラズマ処理装置
US9551070B2 (en) * 2014-05-30 2017-01-24 Applied Materials, Inc. In-situ corrosion resistant substrate support coating
EP3402908A1 (en) * 2016-01-13 2018-11-21 Applied Materials, Inc. Holding arrangement for holding a substrate, carrier for supporting a substrate, vacuum processing system, method for holding a substrate, and method for releasing a substrate
DE102016206193A1 (de) * 2016-04-13 2017-10-19 Trumpf Gmbh + Co. Kg Elektroadhäsionsgreifer mit fraktalen Elektroden
JP6867686B2 (ja) * 2017-06-30 2021-05-12 株式会社 セルバック 接合装置
CN112640082B (zh) * 2018-12-05 2023-12-26 株式会社爱发科 静电吸盘、真空处理装置及基板处理方法
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210381101A1 (en) * 2020-06-03 2021-12-09 Applied Materials, Inc. Substrate processing system
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US12046503B2 (en) * 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
JP2025119839A (ja) * 2024-02-02 2025-08-15 信越化学工業株式会社 静電吸着機能を有する加熱装置

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JP2008085245A (ja) * 2006-09-29 2008-04-10 Shinko Electric Ind Co Ltd 静電チャック

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JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
US5528451A (en) 1994-11-02 1996-06-18 Applied Materials, Inc Erosion resistant electrostatic chuck
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JP2007258607A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
JP2008085245A (ja) * 2006-09-29 2008-04-10 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
CN110085546A (zh) 2019-08-02
JP2019125811A (ja) 2019-07-25
TW201519362A (zh) 2015-05-16
CN105408992B (zh) 2019-01-29
KR20170063982A (ko) 2017-06-08
TW201737411A (zh) 2017-10-16
KR101812666B1 (ko) 2017-12-27
TWI629748B (zh) 2018-07-11
US20170062261A1 (en) 2017-03-02
KR20160040656A (ko) 2016-04-14
CN105408992A (zh) 2016-03-16
JP6518666B2 (ja) 2019-05-22
WO2015020810A1 (en) 2015-02-12
TWI613756B (zh) 2018-02-01
CN110085546B (zh) 2023-05-16
US9779975B2 (en) 2017-10-03
JP6968120B2 (ja) 2021-11-17
US20150036260A1 (en) 2015-02-05
US9536768B2 (en) 2017-01-03
JP2016529718A (ja) 2016-09-23

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