TWI629748B - 用於薄基板搬運的靜電載體 - Google Patents

用於薄基板搬運的靜電載體 Download PDF

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Publication number
TWI629748B
TWI629748B TW106117956A TW106117956A TWI629748B TW I629748 B TWI629748 B TW I629748B TW 106117956 A TW106117956 A TW 106117956A TW 106117956 A TW106117956 A TW 106117956A TW I629748 B TWI629748 B TW I629748B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
electrode
dielectric layer
top surface
connector
Prior art date
Application number
TW106117956A
Other languages
English (en)
Chinese (zh)
Other versions
TW201737411A (zh
Inventor
麥可Ｓ 寇克斯
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201737411A publication Critical patent/TW201737411A/zh
Application granted granted Critical
Publication of TWI629748B publication Critical patent/TWI629748B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW106117956A 2013-08-05 2014-07-31 用於薄基板搬運的靜電載體 TWI629748B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361862471P 2013-08-05 2013-08-05
US61/862,471 2013-08-05

Publications (2)

Publication Number Publication Date
TW201737411A TW201737411A (zh) 2017-10-16
TWI629748B true TWI629748B (zh) 2018-07-11

Family

ID=52427454

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106117956A TWI629748B (zh) 2013-08-05 2014-07-31 用於薄基板搬運的靜電載體
TW103126239A TWI613756B (zh) 2013-08-05 2014-07-31 用於薄基板搬運的靜電載體

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103126239A TWI613756B (zh) 2013-08-05 2014-07-31 用於薄基板搬運的靜電載體

Country Status (6)

Country Link
US (2) US9536768B2 (enExample)
JP (2) JP6518666B2 (enExample)
KR (2) KR102139682B1 (enExample)
CN (2) CN105408992B (enExample)
TW (2) TWI629748B (enExample)
WO (1) WO2015020810A1 (enExample)

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KR102139682B1 (ko) * 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
JP6282080B2 (ja) * 2013-10-30 2018-02-21 株式会社日立ハイテクノロジーズ プラズマ処理装置
US9551070B2 (en) * 2014-05-30 2017-01-24 Applied Materials, Inc. In-situ corrosion resistant substrate support coating
KR20200135569A (ko) * 2016-01-13 2020-12-02 어플라이드 머티어리얼스, 인코포레이티드 기판을 홀딩하기 위한 홀딩 어레인지먼트, 기판을 지지하기 위한 캐리어, 진공 프로세싱 시스템, 기판을 홀딩하기 위한 방법, 및 기판을 릴리스하기 위한 방법
DE102016206193A1 (de) * 2016-04-13 2017-10-19 Trumpf Gmbh + Co. Kg Elektroadhäsionsgreifer mit fraktalen Elektroden
JP6867686B2 (ja) * 2017-06-30 2021-05-12 株式会社 セルバック 接合装置
WO2020115952A1 (ja) * 2018-12-05 2020-06-11 株式会社アルバック 静電チャック、真空処理装置及び基板処理方法
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210381101A1 (en) * 2020-06-03 2021-12-09 Applied Materials, Inc. Substrate processing system
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
CN117043926A (zh) * 2021-03-16 2023-11-10 朗姆研究公司 用于静电卡盘的三极电极配置
US12046503B2 (en) * 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
JP2025119839A (ja) * 2024-02-02 2025-08-15 信越化学工業株式会社 静電吸着機能を有する加熱装置

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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US5982607A (en) * 1996-05-08 1999-11-09 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
US6768627B1 (en) * 1999-05-25 2004-07-27 Toto Ltd. Electrostatic chuck and processing apparatus for insulative substrate

Also Published As

Publication number Publication date
US9779975B2 (en) 2017-10-03
WO2015020810A1 (en) 2015-02-12
TWI613756B (zh) 2018-02-01
US20150036260A1 (en) 2015-02-05
KR20160040656A (ko) 2016-04-14
CN110085546B (zh) 2023-05-16
TW201737411A (zh) 2017-10-16
US9536768B2 (en) 2017-01-03
KR102139682B1 (ko) 2020-07-30
JP2019125811A (ja) 2019-07-25
TW201519362A (zh) 2015-05-16
JP6518666B2 (ja) 2019-05-22
US20170062261A1 (en) 2017-03-02
CN105408992B (zh) 2019-01-29
CN110085546A (zh) 2019-08-02
KR101812666B1 (ko) 2017-12-27
JP2016529718A (ja) 2016-09-23
CN105408992A (zh) 2016-03-16
JP6968120B2 (ja) 2021-11-17
KR20170063982A (ko) 2017-06-08

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