JP6491044B2 - 製造装置及び製造方法 - Google Patents

製造装置及び製造方法 Download PDF

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Publication number
JP6491044B2
JP6491044B2 JP2015110741A JP2015110741A JP6491044B2 JP 6491044 B2 JP6491044 B2 JP 6491044B2 JP 2015110741 A JP2015110741 A JP 2015110741A JP 2015110741 A JP2015110741 A JP 2015110741A JP 6491044 B2 JP6491044 B2 JP 6491044B2
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JP
Japan
Prior art keywords
rotary blade
light
cutting
manufacturing apparatus
amount
Prior art date
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Active
Application number
JP2015110741A
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English (en)
Japanese (ja)
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JP2016221629A (ja
JP2016221629A5 (zh
Inventor
昌一 片岡
昌一 片岡
啓人 望月
啓人 望月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2015110741A priority Critical patent/JP6491044B2/ja
Priority to TW105103019A priority patent/TWI617392B/zh
Priority to KR1020160062056A priority patent/KR101800120B1/ko
Priority to CN201610366184.2A priority patent/CN106206370B/zh
Publication of JP2016221629A publication Critical patent/JP2016221629A/ja
Publication of JP2016221629A5 publication Critical patent/JP2016221629A5/ja
Application granted granted Critical
Publication of JP6491044B2 publication Critical patent/JP6491044B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
JP2015110741A 2015-05-29 2015-05-29 製造装置及び製造方法 Active JP6491044B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015110741A JP6491044B2 (ja) 2015-05-29 2015-05-29 製造装置及び製造方法
TW105103019A TWI617392B (zh) 2015-05-29 2016-01-30 製造裝置及製造方法
KR1020160062056A KR101800120B1 (ko) 2015-05-29 2016-05-20 제조 장치 및 제조 방법
CN201610366184.2A CN106206370B (zh) 2015-05-29 2016-05-27 制造装置及制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015110741A JP6491044B2 (ja) 2015-05-29 2015-05-29 製造装置及び製造方法

Publications (3)

Publication Number Publication Date
JP2016221629A JP2016221629A (ja) 2016-12-28
JP2016221629A5 JP2016221629A5 (zh) 2017-02-09
JP6491044B2 true JP6491044B2 (ja) 2019-03-27

Family

ID=57453490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015110741A Active JP6491044B2 (ja) 2015-05-29 2015-05-29 製造装置及び製造方法

Country Status (4)

Country Link
JP (1) JP6491044B2 (zh)
KR (1) KR101800120B1 (zh)
CN (1) CN106206370B (zh)
TW (1) TWI617392B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6462761B2 (ja) * 2017-04-26 2019-01-30 Ｔｏｗａ株式会社 製品の製造装置及び製造方法
JP6932436B2 (ja) * 2017-05-24 2021-09-08 株式会社ディスコ 切削装置
JP6612372B2 (ja) * 2018-01-30 2019-11-27 Ｔｏｗａ株式会社 フランジ交換機構、切断装置、フランジ交換方法および切断品の製造方法
KR102187996B1 (ko) * 2018-12-31 2020-12-07 코리아테크(주) 커팅기의 커팅휠 마모 보상시스템
IT201900001053A1 (it) * 2019-01-24 2020-07-24 Faspar S P A Sistema automatico di controllo lama
CN111487741A (zh) * 2020-04-09 2020-08-04 天活松林光学（广州）有限公司 一种xy轴向调节装置及其调芯治具和调芯机
JP7354069B2 (ja) * 2020-08-26 2023-10-02 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法
IT202200006260A1 (it) * 2022-03-30 2023-09-30 Giorgio Donatoni Testa di taglio, macchina utensile multiassiale, metodo di misura e metodo di taglio
CN116252398A (zh) * 2022-12-20 2023-06-13 苏州镁伽科技有限公司 控制装置和控制方法
KR102636880B1 (ko) * 2023-02-17 2024-02-14 전호대 절삭유를 사용하지 않는 메탈 로드 커팅장치
CN116167271A (zh) * 2023-04-26 2023-05-26 中建隧道装备制造有限公司 一种基于有限元分析的刀盘设计及优化方法
CN118080969B (zh) * 2024-04-24 2024-08-20 泰兴市金鸡液压机械有限公司 一种电动堆高车零部件的锯切装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603667Y2 (ja) * 1993-07-07 2000-03-15 株式会社ディスコ ブレード検出手段
TW413100U (en) * 1998-09-30 2000-11-21 Ind Tech Res Inst Non-contact tool position detecting device
JP2002370140A (ja) * 2001-06-12 2002-12-24 Disco Abrasive Syst Ltd ブレード監視装置
JP2003124152A (ja) * 2001-10-18 2003-04-25 Tokyo Seimitsu Co Ltd 移動型ブレード検出器を備えたダイシング装置
JP2005125459A (ja) 2003-10-24 2005-05-19 Nitto Denko Corp 半導体ウエハの保護テープ切断方法及び保護テープ切断装置
JP4679209B2 (ja) * 2005-04-04 2011-04-27 株式会社ディスコ 切削装置およびブレード状態検出方法
JP4890067B2 (ja) * 2006-03-28 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
JP2009054904A (ja) * 2007-08-29 2009-03-12 Disco Abrasive Syst Ltd 切削方法および切削装置
JP5068621B2 (ja) * 2007-10-03 2012-11-07 株式会社ディスコ 切削装置
US7495759B1 (en) * 2007-10-23 2009-02-24 Asm Assembly Automation Ltd. Damage and wear detection for rotary cutting blades
JP2009231760A (ja) * 2008-03-25 2009-10-08 Tokyo Seimitsu Co Ltd ブレード破損／磨耗検出装置
JP5603175B2 (ja) 2010-09-03 2014-10-08 株式会社ディスコ 切削装置の切削ブレード検出機構
JP6151531B2 (ja) 2013-02-20 2017-06-21 株式会社ディスコ 切削ブレード検出機構
CN104658975A (zh) * 2013-11-15 2015-05-27 台湾暹劲股份有限公司 晶圆切割方法

Also Published As

Publication number Publication date
CN106206370B (zh) 2019-09-13
KR101800120B1 (ko) 2017-11-21
CN106206370A (zh) 2016-12-07
JP2016221629A (ja) 2016-12-28
TW201641213A (zh) 2016-12-01
KR20160140406A (ko) 2016-12-07
TWI617392B (zh) 2018-03-11

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