JP2018155604A - ゲージユニット - Google Patents
ゲージユニット Download PDFInfo
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- JP2018155604A JP2018155604A JP2017052744A JP2017052744A JP2018155604A JP 2018155604 A JP2018155604 A JP 2018155604A JP 2017052744 A JP2017052744 A JP 2017052744A JP 2017052744 A JP2017052744 A JP 2017052744A JP 2018155604 A JP2018155604 A JP 2018155604A
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- 238000012545 processing Methods 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 230000001788 irregular Effects 0.000 claims abstract description 13
- 230000033001 locomotion Effects 0.000 claims abstract description 10
- 230000002159 abnormal effect Effects 0.000 claims description 2
- 239000000523 sample Substances 0.000 abstract description 14
- 239000011295 pitch Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 43
- 238000000227 grinding Methods 0.000 description 42
- 238000005259 measurement Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- 238000009966 trimming Methods 0.000 description 1
Images
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- Transmission And Conversion Of Sensor Element Output (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
42 測定子(可動子)
44 認識部
45 昇降手段(移動手段)
46 メインスケール(スケール)
47 メインスケールの目盛
48 投光部(読取部)
49 受光部(読取部)
51 コリメートレンズ
52 インデックススケール
53 スリット
54、55 A相、B相受光面
56 信号処理部
57 カウンタ回路
58 判断部
Claims (1)
- 可動子を移動させる移動手段と、該可動子の位置を認識する認識部と、を備えるゲージユニットであって、
該認識部は、該可動子の移動方向に等ピッチの目盛を配置して延在するスケールと、該可動子の移動に応じて該スケールの目盛の有無を読み取る読取部と、該読取部の読み取り結果に応じた方形波信号を出力する信号処理部と、該可動子を移動させる間に、該方形波信号の検出結果に不規則な変化が生じたら該信号処理部もしくは該移動手段に異常があると判断する判断部と、を備えたゲージユニット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017052744A JP7017858B2 (ja) | 2017-03-17 | 2017-03-17 | ゲージユニット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017052744A JP7017858B2 (ja) | 2017-03-17 | 2017-03-17 | ゲージユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018155604A true JP2018155604A (ja) | 2018-10-04 |
JP7017858B2 JP7017858B2 (ja) | 2022-02-09 |
Family
ID=63715635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017052744A Active JP7017858B2 (ja) | 2017-03-17 | 2017-03-17 | ゲージユニット |
Country Status (1)
Country | Link |
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JP (1) | JP7017858B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021058952A (ja) * | 2019-10-04 | 2021-04-15 | 株式会社ディスコ | 研削装置 |
JP7328063B2 (ja) | 2019-08-07 | 2023-08-16 | 株式会社ディスコ | 研削装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63218805A (ja) * | 1987-03-06 | 1988-09-12 | Citizen Watch Co Ltd | 電子測長器 |
JPH08287592A (ja) * | 1995-04-13 | 1996-11-01 | Sony Disc Technol:Kk | 運動乱れ検出装置 |
JP2000065604A (ja) * | 1998-08-26 | 2000-03-03 | Omron Corp | エンコーダ |
JP2015175758A (ja) * | 2014-03-17 | 2015-10-05 | 株式会社ディスコ | リニアゲージ |
-
2017
- 2017-03-17 JP JP2017052744A patent/JP7017858B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63218805A (ja) * | 1987-03-06 | 1988-09-12 | Citizen Watch Co Ltd | 電子測長器 |
JPH08287592A (ja) * | 1995-04-13 | 1996-11-01 | Sony Disc Technol:Kk | 運動乱れ検出装置 |
JP2000065604A (ja) * | 1998-08-26 | 2000-03-03 | Omron Corp | エンコーダ |
JP2015175758A (ja) * | 2014-03-17 | 2015-10-05 | 株式会社ディスコ | リニアゲージ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7328063B2 (ja) | 2019-08-07 | 2023-08-16 | 株式会社ディスコ | 研削装置 |
JP2021058952A (ja) * | 2019-10-04 | 2021-04-15 | 株式会社ディスコ | 研削装置 |
JP7274998B2 (ja) | 2019-10-04 | 2023-05-17 | 株式会社ディスコ | 研削装置 |
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JP7017858B2 (ja) | 2022-02-09 |
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