JP6417531B2 - 中間的な熱膨張係数を有するガラス - Google Patents
中間的な熱膨張係数を有するガラス Download PDFInfo
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- JP6417531B2 JP6417531B2 JP2016019736A JP2016019736A JP6417531B2 JP 6417531 B2 JP6417531 B2 JP 6417531B2 JP 2016019736 A JP2016019736 A JP 2016019736A JP 2016019736 A JP2016019736 A JP 2016019736A JP 6417531 B2 JP6417531 B2 JP 6417531B2
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- 239000011521 glass Substances 0.000 title claims description 140
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 14
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 13
- 229910052708 sodium Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 229910052700 potassium Inorganic materials 0.000 claims description 8
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052792 caesium Inorganic materials 0.000 claims description 7
- 229910052744 lithium Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052791 calcium Inorganic materials 0.000 claims description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims description 4
- 229910052712 strontium Inorganic materials 0.000 claims description 4
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 claims description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 3
- 238000002844 melting Methods 0.000 description 18
- 230000008018 melting Effects 0.000 description 18
- 229910006404 SnO 2 Inorganic materials 0.000 description 16
- 239000000460 chlorine Substances 0.000 description 16
- 239000003513 alkali Substances 0.000 description 15
- 239000011734 sodium Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 9
- 229910052783 alkali metal Inorganic materials 0.000 description 8
- 150000001340 alkali metals Chemical class 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 7
- 150000001342 alkaline earth metals Chemical group 0.000 description 7
- 229910052801 chlorine Inorganic materials 0.000 description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- 229910052794 bromium Inorganic materials 0.000 description 6
- 238000003280 down draw process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000006060 molten glass Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 5
- 238000005352 clarification Methods 0.000 description 5
- 238000003286 fusion draw glass process Methods 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 150000002500 ions Chemical group 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000003283 slot draw process Methods 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 3
- 239000005407 aluminoborosilicate glass Substances 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052701 rubidium Inorganic materials 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 235000019738 Limestone Nutrition 0.000 description 2
- 238000006124 Pilkington process Methods 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910001423 beryllium ion Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 239000006025 fining agent Substances 0.000 description 2
- 239000006028 limestone Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003258 bubble free glass Substances 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 239000005400 gorilla glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- -1 lithium or sodium Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0272—Selenium or tellurium
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03925—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIIBVI compound materials, e.g. CdTe, CdS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Description
60から65%までのSiO2、
8から12%までのAl2O3、
7から15%までのB2O3、
0を超え8%までのM2O、および
9から15%までのRO、
を含むガラスであって、Mはアルカリ金属であり、かつRはアルカリ土類金属であるガラスである。
60から65%までのSiO2、
8から12%までのAl2O3、
7から15%までのB2O3、
0を超え8%までのM2O、および
9から15%までのRO、
を含むガラスであり、ここで、Mはアルカリ金属であり、Rはアルカリ土類金属である。
61から64%までのSiO2、
8から12%までのAl2O3、
9から15%までのB2O3、
0を超え4%までのM2O、および
12から15%までのRO、
を含むガラスであり、ここで、Mはアルカリ金属であり、Rはアルカリ土類金属である。
60から65%までのSiO2、
8から10%未満までのAl2O3、
11を超え15%までのB2O3、
0を超え1%未満までのM2O、および
9から15%までのRO、
を含むガラスであり、ここで、Mはアルカリ金属であり、Rはアルカリ土類金属である。
60から65%までのSiO2、
10から12%までのAl2O3、
7から11%までのB2O3、
1から8%までのM2O、および
9から15%までのRO、
を含むガラスであり、ここで、Mはアルカリ金属であり、Rはアルカリ土類金属である。
62から65%までのSiO2、
10から12%までのAl2O3、
7から11%までのB2O3、
3から8%までのMgO、
3から10%までのCaO、
3から8%までのSrO、および
1から8%までのM2O、
を含み、ここでMは、K,Naおよびこれらの組合せから選ばれたアルカリ金属であり、その場合、CaO/(CaO+SrO)が0.4から1までである。
1.0≦(M2O+RO)/Al2O3≦2、かつ
0.4≦CaO/(CaO+SrO)≦1
上記比(M2O+RO)/Al2O3は、1.0よりも大きい方が、最初の溶融工程においてガラスから気泡を除去する助けとなる。これは、Al2O3の安定化には含まれないアルカリ金属酸化物およびアルカリ土類金属酸化物が、一般には市販の珪砂であるシリカ源を分解するのに有効であるために生じる。気泡の核生成および成長のための場所となるかも知れない表面領域がそれ故に早期に融解して除去され、比較的気泡の無いガラスが得られる。
0.02≦SnO2≦0.3、かつ
0.005≦Fe2O3≦0.08。
0.02≦SnO2≦0.3、かつ
0.005≦Fe2O3≦0.08
を含み、かつ0.05モル%未満のSb2O3,As2O3またはこれらの組合せを含む。
62から64%までのSiO2、
8から12%までのAl2O3、
9から15%までのB2O3、
0を超え4%までのM2O、および
12から〜15%までのRO、
ここで、Mはアルカリ金属であり、Rはアルカリ土類金属である。
14 導電性層
16 光起電性媒体
200 光起電性デバイス
Claims (11)
- モル%で表して、
60から65%までのSiO2、
10から12%までのAl2O3、
7から11%までのB2O3、
1から8%までのM2O、ここで、MはLi、K、Csまたはそれらの組合せである、および
9から15%までのRO、ここで、RはCa、Mg、Srまたはそれらの組合せである
を含み、故意にバッチ化されたSrOを含まず、およびNa 2 Oを含まない、ガラス。 - 61から64モル%までのSiO2を含む、請求項1記載のガラス。
- 600℃以上の歪み点を有する、請求項1または2記載のガラス。
- 620℃以上の歪み点を有する、請求項3記載のガラス。
- 500,000ポアズ(50,000パスカル秒)以上の液相線粘度を有する、請求項1〜4いずれか1項記載のガラス。
- シートの形態である、請求項1〜5いずれか1項記載のガラス。
- 請求項6記載のガラスを含む基板、および前記基板に近接した能動的光起電性媒体を備える、光起電性デバイス。
- 前記能動的光起電性媒体が、テルル化カドミウム、二セレン化銅インジウム・ガリウム、非晶質シリコン、結晶シリコン、微結晶シリコン、またはそれらの組合せを含む、請求項7記載の光起電性デバイス。
- モル%で表して、
61.55%のSiO2、
11.08%のAl2O3、
10.02%のB2O3、
6.38%のMgO、
8.47%のCaO、
2.43%のK2O、
0%のSrO、および
0%のNa2O
を含む、請求項1記載のガラス。 - ガラスシートを含む基板、および該基板に近接した能動的光起電性媒体を備える光起電性デバイスであって、前記ガラスシートが、モル%で表して、
60から65%までのSiO 2 、
10から12%までのAl 2 O 3 、
7から11%までのB 2 O 3 、
1から8%までのM 2 O、ここで、MはLi、K、Csまたはそれらの組合せである、および
9から15%までのRO、ここで、RはCa、Mg、Srまたはそれらの組合せである
を含み、故意にバッチ化されたSrOを含まないガラス組成を有する、光起電性デバイス。 - 前記能動的光起電性媒体が、テルル化カドミウム、二セレン化銅インジウム・ガリウム、非晶質シリコン、結晶シリコン、微結晶シリコン、またはそれらの組合せを含む、請求項11記載の光起電性デバイス。
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JP6042613B2 (ja) | 2016-12-14 |
CN105271723A (zh) | 2016-01-27 |
JP5883174B2 (ja) | 2016-03-09 |
CN102171154A (zh) | 2011-08-31 |
CA2739098A1 (en) | 2010-04-15 |
US20160145146A1 (en) | 2016-05-26 |
AU2009302561A1 (en) | 2010-04-15 |
US9266769B2 (en) | 2016-02-23 |
TWI403482B (zh) | 2013-08-01 |
US10196297B2 (en) | 2019-02-05 |
KR101647526B1 (ko) | 2016-08-10 |
WO2010042460A3 (en) | 2010-06-03 |
RU2011118352A (ru) | 2012-11-20 |
JP2016084280A (ja) | 2016-05-19 |
KR20170121338A (ko) | 2017-11-01 |
US20130255779A1 (en) | 2013-10-03 |
US8445394B2 (en) | 2013-05-21 |
KR20110066225A (ko) | 2011-06-16 |
EP2349938B1 (en) | 2018-02-21 |
EP2349938A2 (en) | 2011-08-03 |
MX2011003630A (es) | 2011-05-31 |
JP2015164893A (ja) | 2015-09-17 |
TW201022174A (en) | 2010-06-16 |
KR20160097385A (ko) | 2016-08-17 |
JP2012504548A (ja) | 2012-02-23 |
WO2010042460A2 (en) | 2010-04-15 |
US20100084016A1 (en) | 2010-04-08 |
KR101891459B1 (ko) | 2018-08-23 |
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