JP6412654B2 - 動的な応答解析プローバ装置 - Google Patents
動的な応答解析プローバ装置 Download PDFInfo
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- JP6412654B2 JP6412654B2 JP2017531112A JP2017531112A JP6412654B2 JP 6412654 B2 JP6412654 B2 JP 6412654B2 JP 2017531112 A JP2017531112 A JP 2017531112A JP 2017531112 A JP2017531112 A JP 2017531112A JP 6412654 B2 JP6412654 B2 JP 6412654B2
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- sample
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
- G01R31/2603—Apparatus or methods therefor for curve tracing of semiconductor characteristics, e.g. on oscilloscope
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
- G01R31/2653—Contactless testing using electron beams
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
- G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2839—Fault-finding or characterising using signal generators, power supplies or circuit analysers
- G01R31/2841—Signal generators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2008—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated specially adapted for studying electrical or magnetical properties of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
Description
2…入力ケーブル
3…探針
4…試料
5…出力ケーブル
6…オシロスコープ
7…真空チャンバ
8…コンタクト
9…SEMカラム
10…二次電子検出器
11…試料ステージ
12…半導体パラメータアナライザ
13…ターボ分子ポンプ
14…ドライポンプ
15…SEMによる試料観察領域
16…光学顕微鏡による試料観察領域
17…探針の交換領域
18…探針交換室
19…探針引き上げ棒
20…CCDカメラ
21…CCDカメラ
22…表示ディスプレイ
23…データベース
24…演算処理部
Claims (5)
- 試料を保持する試料ステージと、
前記試料の所定箇所と接触する複数の探針と、
その内部に前記試料ステージと前記複数の探針が配置された試料室と、
前記試料および前記探針を観察する荷電粒子線顕微鏡と、
を備えるプローバ装置であって、
前記探針の一つに入力される動的な電気信号の入力波形を整形する入力波形形成機構と、
前記試料を介して出力される動的な電気信号の出力波形を観察する出力波形観察機構と、を備え、
前記入力波形形成機構が、前記出力波形に基づき、当該出力波形が略矩形となるように前記出力波形を修正することを特徴とするプローバ装置。 - 請求項1記載のプローバ装置において、
前記入力波形は、前記試料を介して出力される動的な電気信号の出力波形が、略パルス形状となるように調整されていることを特徴とするプローバ装置。 - 請求項2記載のプローバ装置において、
前記入力波形は、波形の前方部で凸形状であるか、または、波形の後方部分で凹形状であることを特徴とするプローバ装置。 - 請求項1記載のプローバ装置において、
動的な電気信号の入力波形が記録されたデータベースを備え、
入力する動的な電気信号の条件に応じ、前記入力波形形成機構が、前記データベースに記録された入力波形を形成することを特徴とするプローバ装置。 - 請求項1記載のプローバ装置において、
測定系の等価回路シミュレーションに基づき、前記入力波形形成機構が前記入力波形を自動形成することを特徴とするプローバ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015149172 | 2015-07-29 | ||
JP2015149172 | 2015-07-29 | ||
PCT/JP2016/070072 WO2017018148A1 (ja) | 2015-07-29 | 2016-07-07 | 動的な応答解析プローバ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017018148A1 JPWO2017018148A1 (ja) | 2018-03-29 |
JP6412654B2 true JP6412654B2 (ja) | 2018-10-24 |
Family
ID=57884598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017531112A Active JP6412654B2 (ja) | 2015-07-29 | 2016-07-07 | 動的な応答解析プローバ装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10782340B2 (ja) |
JP (1) | JP6412654B2 (ja) |
KR (2) | KR102234251B1 (ja) |
CN (1) | CN108351377B (ja) |
TW (1) | TWI600910B (ja) |
WO (1) | WO2017018148A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112313782B (zh) * | 2018-06-28 | 2023-10-13 | 株式会社日立高新技术 | 半导体检查装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3286565B2 (ja) * | 1997-07-28 | 2002-05-27 | セイコーインスツルメンツ株式会社 | サンプリング走査プローブ顕微鏡 |
JP4290255B2 (ja) * | 1998-11-25 | 2009-07-01 | 株式会社アドバンテスト | 半導体試験装置 |
JP4365970B2 (ja) * | 2000-02-07 | 2009-11-18 | 株式会社アドバンテスト | 任意波形発生装置及びこの任意波形発生装置を備えた試験装置 |
JP3817466B2 (ja) * | 2000-11-29 | 2006-09-06 | キヤノン株式会社 | 非接触型原子間力顕微鏡およびそれを用いた観察方法 |
US7297945B2 (en) * | 2003-12-05 | 2007-11-20 | Hitachi High-Technologies Corporation | Defective product inspection apparatus, probe positioning method and probe moving method |
WO2006001108A1 (ja) * | 2004-06-25 | 2006-01-05 | Japan Science And Technology Agency | 探針装置 |
JP2007064834A (ja) * | 2005-08-31 | 2007-03-15 | Agilent Technol Inc | デバイス特性測定システム |
JP4741991B2 (ja) | 2006-07-14 | 2011-08-10 | 株式会社日立製作所 | シリアアライザ/デシリアライザ方式の転送装置 |
JP4474405B2 (ja) * | 2006-12-21 | 2010-06-02 | 株式会社日立ハイテクノロジーズ | 試料検査装置及び試料検査方法 |
CN101119109B (zh) * | 2007-09-07 | 2011-04-20 | 史宝祥 | 一种波形整形电路 |
JP4598093B2 (ja) * | 2008-02-15 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | 不良検査装置 |
JP5276921B2 (ja) * | 2008-08-08 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 検査装置 |
JP5631549B2 (ja) | 2009-02-13 | 2014-11-26 | セイコーインスツル株式会社 | バッテリーの保護回路装置 |
JP2010243218A (ja) * | 2009-04-01 | 2010-10-28 | Toyota Motor Corp | 半導体装置、並びに半導体装置の検査方法及びその検査装置 |
JP5611661B2 (ja) * | 2009-06-04 | 2014-10-22 | 株式会社東芝 | 磁気共鳴イメージング装置 |
JP2011002402A (ja) * | 2009-06-22 | 2011-01-06 | Yokogawa Electric Corp | 半導体試験装置及び半導体試験方法 |
JP5873741B2 (ja) | 2012-03-09 | 2016-03-01 | 株式会社日立ハイテクノロジーズ | 半導体検査装置および半導体検査方法 |
-
2016
- 2016-07-07 WO PCT/JP2016/070072 patent/WO2017018148A1/ja active Application Filing
- 2016-07-07 US US15/737,966 patent/US10782340B2/en active Active
- 2016-07-07 KR KR1020197036168A patent/KR102234251B1/ko active IP Right Grant
- 2016-07-07 JP JP2017531112A patent/JP6412654B2/ja active Active
- 2016-07-07 CN CN201680042308.XA patent/CN108351377B/zh active Active
- 2016-07-07 KR KR1020177037676A patent/KR102189053B1/ko active IP Right Grant
- 2016-07-15 TW TW105122431A patent/TWI600910B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102189053B1 (ko) | 2020-12-09 |
KR20190139323A (ko) | 2019-12-17 |
TWI600910B (zh) | 2017-10-01 |
CN108351377B (zh) | 2020-08-11 |
WO2017018148A1 (ja) | 2017-02-02 |
TW201704763A (zh) | 2017-02-01 |
CN108351377A (zh) | 2018-07-31 |
US10782340B2 (en) | 2020-09-22 |
KR102234251B1 (ko) | 2021-04-01 |
JPWO2017018148A1 (ja) | 2018-03-29 |
KR20180014074A (ko) | 2018-02-07 |
US20180299504A1 (en) | 2018-10-18 |
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