JP6403503B2 - 銅張積層板、プリント配線板及びその使用方法 - Google Patents

銅張積層板、プリント配線板及びその使用方法 Download PDF

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Publication number
JP6403503B2
JP6403503B2 JP2014178646A JP2014178646A JP6403503B2 JP 6403503 B2 JP6403503 B2 JP 6403503B2 JP 2014178646 A JP2014178646 A JP 2014178646A JP 2014178646 A JP2014178646 A JP 2014178646A JP 6403503 B2 JP6403503 B2 JP 6403503B2
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JP
Japan
Prior art keywords
copper
polyimide
insulating layer
copper foil
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014178646A
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English (en)
Japanese (ja)
Other versions
JP2015091644A (ja
Inventor
亮 森
亮 森
威吏 徳山
威吏 徳山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2014178646A priority Critical patent/JP6403503B2/ja
Priority to KR1020140129485A priority patent/KR102234045B1/ko
Priority to CN201410505175.8A priority patent/CN104519657B/zh
Priority to TW103133381A priority patent/TWI634986B/zh
Publication of JP2015091644A publication Critical patent/JP2015091644A/ja
Application granted granted Critical
Publication of JP6403503B2 publication Critical patent/JP6403503B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2014178646A 2013-09-30 2014-09-03 銅張積層板、プリント配線板及びその使用方法 Active JP6403503B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014178646A JP6403503B2 (ja) 2013-09-30 2014-09-03 銅張積層板、プリント配線板及びその使用方法
KR1020140129485A KR102234045B1 (ko) 2013-09-30 2014-09-26 구리 피복 적층판, 프린트 배선판 및 그 사용 방법
CN201410505175.8A CN104519657B (zh) 2013-09-30 2014-09-26 覆铜积层板、印刷配线板及其使用方法
TW103133381A TWI634986B (zh) 2013-09-30 2014-09-26 覆銅積層板、印刷配線板及其使用方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013205950 2013-09-30
JP2013205950 2013-09-30
JP2014178646A JP6403503B2 (ja) 2013-09-30 2014-09-03 銅張積層板、プリント配線板及びその使用方法

Publications (2)

Publication Number Publication Date
JP2015091644A JP2015091644A (ja) 2015-05-14
JP6403503B2 true JP6403503B2 (ja) 2018-10-10

Family

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Family Applications (1)

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JP2014178646A Active JP6403503B2 (ja) 2013-09-30 2014-09-03 銅張積層板、プリント配線板及びその使用方法

Country Status (4)

Country Link
JP (1) JP6403503B2 (zh)
KR (1) KR102234045B1 (zh)
CN (1) CN104519657B (zh)
TW (1) TWI634986B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6379071B2 (ja) * 2015-06-15 2018-08-22 Ｊｘ金属株式会社 電磁波シールド材
TWI564145B (zh) 2015-06-17 2017-01-01 長興材料工業股份有限公司 金屬被覆積層板及其製造方法
JP6426290B2 (ja) * 2015-07-23 2018-11-21 三井金属鉱業株式会社 樹脂付銅箔、銅張積層板及びプリント配線板
JP6825368B2 (ja) * 2016-01-05 2021-02-03 荒川化学工業株式会社 銅張積層体及びプリント配線板
TWI754668B (zh) * 2016-09-05 2022-02-11 日商荒川化學工業股份有限公司 可撓性印刷線路板用覆銅積層板及可撓性印刷線路板
JP7115165B2 (ja) * 2017-09-15 2022-08-09 Jsr株式会社 高周波回路用積層体及びフレキシブルプリント基板
KR102686120B1 (ko) * 2018-09-03 2024-07-19 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 금속 피복 적층판, 접착 시트, 접착성 폴리이미드 수지 조성물 및 회로 기판
JP7446741B2 (ja) * 2018-09-28 2024-03-11 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
JP7095880B2 (ja) * 2018-10-12 2022-07-05 ユニチカ株式会社 ポリイミドフィルム
JP7503289B2 (ja) * 2019-01-21 2024-06-20 ユニチカ株式会社 ポリイミド
JP7267591B2 (ja) * 2019-05-22 2023-05-02 ユニチカ株式会社 ポリエステルイミド
JP7378122B2 (ja) * 2019-10-23 2023-11-13 ユニチカ株式会社 ポリイミドフィルム
US20220204697A1 (en) * 2020-12-31 2022-06-30 Industrial Technology Research Institute Polymer and resin composition thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5031639B1 (zh) 1969-06-04 1975-10-13
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JP2003306649A (ja) * 2002-04-12 2003-10-31 Kanegafuchi Chem Ind Co Ltd 接着シート及びプリント配線板
CN1720136A (zh) * 2002-12-05 2006-01-11 株式会社钟化 叠层体、印刷电路布线板及它们的制造方法
JP2004189981A (ja) * 2002-12-13 2004-07-08 Kanegafuchi Chem Ind Co Ltd 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法
JP4872185B2 (ja) 2003-05-06 2012-02-08 三菱瓦斯化学株式会社 金属張り積層体
CN100572416C (zh) * 2004-02-25 2009-12-23 株式会社钟化 热固性树脂组合物及其应用
JP2009007551A (ja) * 2007-05-30 2009-01-15 Hitachi Chem Co Ltd 樹脂ワニス、接着層付き金属箔、金属張積層板、印刷配線板及び多層配線板
JP5636159B2 (ja) * 2007-12-28 2014-12-03 三井金属鉱業株式会社 樹脂付銅箔および樹脂付銅箔の製造方法
JP5031639B2 (ja) * 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
JP2010234638A (ja) * 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd 銅張積層板及びその製造方法
JP5746866B2 (ja) * 2011-01-05 2015-07-08 Jx日鉱日石金属株式会社 銅張積層板及びその製造方法

Also Published As

Publication number Publication date
TWI634986B (zh) 2018-09-11
JP2015091644A (ja) 2015-05-14
KR102234045B1 (ko) 2021-03-30
TW201511941A (zh) 2015-04-01
KR20150037602A (ko) 2015-04-08
CN104519657B (zh) 2018-04-06
CN104519657A (zh) 2015-04-15

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