JP6380563B2 - 冷却装置及び電子機器 - Google Patents
冷却装置及び電子機器 Download PDFInfo
- Publication number
- JP6380563B2 JP6380563B2 JP2016574547A JP2016574547A JP6380563B2 JP 6380563 B2 JP6380563 B2 JP 6380563B2 JP 2016574547 A JP2016574547 A JP 2016574547A JP 2016574547 A JP2016574547 A JP 2016574547A JP 6380563 B2 JP6380563 B2 JP 6380563B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- evaporator
- passage
- valve
- steam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Description
はじめに、本願の開示する技術の第一実施形態を説明する。
次に、本願の開示する技術の第二実施形態を説明する。
次に、本願の開示する技術の第三実施形態を説明する。
Claims (8)
- 冷媒が収容され、前記冷媒を蒸発させる蒸発器と、
前記蒸発器によって蒸発させられた前記冷媒を凝縮させる凝縮器と、
前記蒸発器内と前記凝縮器内とを連通する蒸気通路及び液通路を有し、前記蒸発器と前記凝縮器との間で前記冷媒を循環させる通路部と、
前記蒸気通路及び前記液通路の少なくとも一方の通路に設けられた弁と、
前記蒸発器内に開口する圧力伝達通路と、前記圧力伝達通路を通じて前記蒸発器内と連通された圧力作動空間とを有し、前記圧力作動空間の圧力の増加に伴い前記弁の開度を増加させる圧力伝達部と、
を備える冷却装置。 - 前記圧力伝達通路の入口の面積は、前記蒸気通路の入口の面積よりも小である、
請求項1に記載の冷却装置。 - 前記圧力作動空間は、前記蒸気通路及び前記液通路に対して独立して設けられている、
請求項1又は請求項2に記載の冷却装置。 - 前記圧力伝達部は、前記圧力作動空間の壁を形成すると共に、前記弁と連結されたダイヤフラムをさらに有する、
請求項3に記載の冷却装置。 - 前記圧力作動空間は、前記蒸気通路の一部に形成されている、
請求項1又は請求項2に記載の冷却装置。 - 前記弁は、前記圧力作動空間の壁を形成するダイヤフラムである、
請求項5に記載の冷却装置。 - 前記弁は、前記圧力作動空間に接して設けられている、
請求項5に記載の冷却装置。 - 発熱体である電子部品と、
前記電子部品に熱的に接触されると共に、冷媒が収容され、前記電子部品からの熱により前記冷媒を蒸発させる蒸発器と、
前記冷媒を凝縮させる凝縮器と、
前記蒸発器内と前記凝縮器内とを連通する蒸気通路及び液通路を有し、前記蒸発器と前記凝縮器との間で前記冷媒を循環させる通路部と、
前記蒸気通路及び前記液通路の少なくとも一方の通路に設けられた弁と、
前記蒸発器内に開口する圧力伝達通路と、前記圧力伝達通路を通じて前記蒸発器内と連通された圧力作動空間とを有し、前記圧力作動空間の圧力の増加に伴い前記弁の開度を増加させる圧力伝達部と、
を備える電子機器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/053554 WO2016129044A1 (ja) | 2015-02-09 | 2015-02-09 | 冷却装置及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016129044A1 JPWO2016129044A1 (ja) | 2017-11-02 |
JP6380563B2 true JP6380563B2 (ja) | 2018-08-29 |
Family
ID=56615470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016574547A Active JP6380563B2 (ja) | 2015-02-09 | 2015-02-09 | 冷却装置及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10123457B2 (ja) |
JP (1) | JP6380563B2 (ja) |
WO (1) | WO2016129044A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20130873A1 (it) * | 2013-10-29 | 2015-04-30 | Alenia Aermacchi Spa | Circuito di raffreddamento/riscaldamento a fluido bifase con valvole di controllo del flusso sensibili alla temperatura |
EP3346221B1 (en) * | 2017-01-06 | 2020-03-04 | ABB Schweiz AG | Cooling regulation system and method for cooling regulation |
JP7131158B2 (ja) * | 2018-07-19 | 2022-09-06 | 株式会社デンソー | 空調装置 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1956977A (en) * | 1931-01-12 | 1934-05-01 | Gen Electric | Combined regulating and snap action gas valve |
US3100502A (en) * | 1959-01-29 | 1963-08-13 | Qualitrol Corp | Pressure relief valve |
US3404730A (en) * | 1966-12-02 | 1968-10-08 | Hughes Aircraft Co | Temperature control arrangement |
US3616783A (en) * | 1970-03-06 | 1971-11-02 | Borg Warner | Vapor control valve |
US3962529A (en) * | 1970-10-07 | 1976-06-08 | Sumitomo Electric Industries, Ltd. | Evaporative cooling power cable line |
US4301831A (en) * | 1980-03-17 | 1981-11-24 | United Aircraft Products, Inc. | Pressure regulating valve with differential pressure response |
US4974667A (en) * | 1989-10-10 | 1990-12-04 | Hughes Aircraft Company | Thermal actuated switchable heat pipe |
JPH0445393A (ja) * | 1990-06-12 | 1992-02-14 | Aisin Seiki Co Ltd | ループ型ヒートパイプ式熱交換器 |
JP2801998B2 (ja) | 1992-10-12 | 1998-09-21 | 富士通株式会社 | 電子機器の冷却装置 |
JP3211618B2 (ja) * | 1995-04-12 | 2001-09-25 | トヨタ自動車株式会社 | 蒸発燃料排出防止装置 |
US6415858B1 (en) * | 1997-12-31 | 2002-07-09 | Temptronic Corporation | Temperature control system for a workpiece chuck |
JP2001349681A (ja) * | 2000-06-05 | 2001-12-21 | Nissan Motor Co Ltd | 沸騰冷却システム |
US6752169B2 (en) * | 2002-10-31 | 2004-06-22 | Lindsay Manufacturing Co. | Pressure regulator and shut-off valve |
US6923205B2 (en) * | 2002-10-31 | 2005-08-02 | Lindsay Manufacturing Co. | Pressure regulator and shut-off valve |
JP2005155895A (ja) | 2003-11-07 | 2005-06-16 | Ckd Corp | ダイアフラム弁 |
JP4353026B2 (ja) | 2003-12-16 | 2009-10-28 | 富士電機ホールディングス株式会社 | 冷却媒体開閉手段をもつ純水沸騰冷却装置 |
JP2005188813A (ja) | 2003-12-25 | 2005-07-14 | Fuji Electric Holdings Co Ltd | サーモサイフォン式冷却装置 |
JP2006029672A (ja) | 2004-07-15 | 2006-02-02 | Japan Aerospace Exploration Agency | 潜熱流体ループを使用する熱輸送装置 |
JP4882699B2 (ja) * | 2005-12-20 | 2012-02-22 | 株式会社デンソー | 排熱回収装置 |
WO2007142292A1 (ja) * | 2006-06-08 | 2007-12-13 | Denso Corporation | 排熱回収装置 |
US8316927B2 (en) * | 2006-06-09 | 2012-11-27 | Denso Corporation | Loop heat pipe waste heat recovery device with pressure controlled mode valve |
JP2007333293A (ja) * | 2006-06-14 | 2007-12-27 | Denso Corp | ループ式ヒートパイプ |
JP2008039373A (ja) * | 2006-07-14 | 2008-02-21 | Denso Corp | 排気熱回収器 |
JP4245063B2 (ja) * | 2007-05-09 | 2009-03-25 | 株式会社デンソー | 排熱回収装置 |
JP2008303728A (ja) * | 2007-06-05 | 2008-12-18 | Denso Corp | 排気熱回収器 |
DE102008027773A1 (de) * | 2007-06-28 | 2009-02-26 | Denso Corp., Kariya-shi | Abgaswärme-Rückgewinnungseinrichtung |
JP4661839B2 (ja) * | 2007-07-31 | 2011-03-30 | 株式会社デンソー | 排気熱回収器 |
JP5067692B2 (ja) * | 2007-08-23 | 2012-11-07 | 財団法人若狭湾エネルギー研究センター | サイフォン式循環型ヒートパイプ |
JP4877284B2 (ja) * | 2008-06-18 | 2012-02-15 | 株式会社デンソー | 排気熱回収装置 |
JP2010059960A (ja) * | 2008-08-08 | 2010-03-18 | Toyota Motor Corp | 排気熱回収装置 |
EP2332839B1 (en) * | 2008-10-02 | 2015-06-24 | Ibérica del Espacio, S.A. | Spaceship heat module |
JP5195381B2 (ja) * | 2008-12-11 | 2013-05-08 | 株式会社デンソー | 排気熱回収装置 |
JP2010275999A (ja) * | 2009-06-01 | 2010-12-09 | Toyota Motor Corp | 内燃機関の排気構造 |
JP4665045B1 (ja) | 2009-09-28 | 2011-04-06 | 株式会社テイエルブイ | 蒸気供給システム及びそれに用いる逆止弁 |
JP2012183978A (ja) * | 2011-03-08 | 2012-09-27 | Denso Corp | 暖房装置 |
-
2015
- 2015-02-09 JP JP2016574547A patent/JP6380563B2/ja active Active
- 2015-02-09 WO PCT/JP2015/053554 patent/WO2016129044A1/ja active Application Filing
-
2017
- 2017-05-26 US US15/606,166 patent/US10123457B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2016129044A1 (ja) | 2016-08-18 |
US10123457B2 (en) | 2018-11-06 |
US20170265330A1 (en) | 2017-09-14 |
JPWO2016129044A1 (ja) | 2017-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6390225B2 (ja) | 冷却システム及び電子装置 | |
JP5741354B2 (ja) | ループ型ヒートパイプ及び電子機器 | |
JP2859927B2 (ja) | 冷却装置および温度制御装置 | |
JP5637216B2 (ja) | ループ型ヒートパイプ及び電子機器 | |
US9797659B2 (en) | Refrigerant heat dissipating apparatus | |
JP5151362B2 (ja) | 冷却装置およびそれを備えた電子機器 | |
US8915293B2 (en) | Heat exchanger | |
US20070012429A1 (en) | Heat Transfer Device | |
JP6380563B2 (ja) | 冷却装置及び電子機器 | |
JP2010054121A (ja) | 可変コンダクタンスヒートパイプ | |
JP5287638B2 (ja) | ループ型ヒートパイプ及び電子機器 | |
JP2015183993A (ja) | 冷却装置、冷却システム及び電子装置 | |
JP5532113B2 (ja) | 冷却装置およびそれを備えた電子機器 | |
JP2006242455A (ja) | 冷却方法及び装置 | |
JP2006284020A (ja) | ヒートパイプ | |
WO2014041621A1 (ja) | 電気熱量効果を利用したヒートポンプ装置及び温度制御装置 | |
JP2007107784A (ja) | ループ型ヒートパイプ | |
JP5696466B2 (ja) | ループ型ヒートパイプ及び情報処理装置 | |
WO2013010038A2 (en) | Heat transfer system with integrated evaporator and condenser | |
JP2015010766A (ja) | ヒートポンプサイクル用の室外機 | |
JP2017083130A (ja) | 蒸発器及び冷却装置 | |
CN107003043B (zh) | 具有加热回路的制冷器具 | |
JP5387523B2 (ja) | 冷却装置 | |
JP2005337701A (ja) | 冷却装置 | |
TW201945680A (zh) | 具不同管徑的迴路熱管 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170601 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170601 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180306 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180426 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180703 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180716 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6380563 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |