JP6365092B2 - 部品封止用フィルムの製造方法 - Google Patents
部品封止用フィルムの製造方法 Download PDFInfo
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- JP6365092B2 JP6365092B2 JP2014160648A JP2014160648A JP6365092B2 JP 6365092 B2 JP6365092 B2 JP 6365092B2 JP 2014160648 A JP2014160648 A JP 2014160648A JP 2014160648 A JP2014160648 A JP 2014160648A JP 6365092 B2 JP6365092 B2 JP 6365092B2
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/015—Biocides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08J2367/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
- C08L2203/162—Applications used for films sealable films
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014160648A JP6365092B2 (ja) | 2013-08-23 | 2014-08-06 | 部品封止用フィルムの製造方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013173123 | 2013-08-23 | ||
| JP2013173123 | 2013-08-23 | ||
| JP2014160648A JP6365092B2 (ja) | 2013-08-23 | 2014-08-06 | 部品封止用フィルムの製造方法 |
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| Publication Number | Publication Date |
|---|---|
| JP2015061720A JP2015061720A (ja) | 2015-04-02 |
| JP6365092B2 true JP6365092B2 (ja) | 2018-08-01 |
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| JP2014160648A Active JP6365092B2 (ja) | 2013-08-23 | 2014-08-06 | 部品封止用フィルムの製造方法 |
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| JP (1) | JP6365092B2 (zh) |
| KR (1) | KR102308969B1 (zh) |
| CN (1) | CN104416998B (zh) |
| TW (1) | TWI674972B (zh) |
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| WO2016031615A1 (ja) * | 2014-08-28 | 2016-03-03 | 富士フイルム株式会社 | 転写フィルム、積層体の製造方法、積層体、静電容量型入力装置および画像表示装置 |
| JP6176294B2 (ja) * | 2015-08-21 | 2017-08-09 | 味の素株式会社 | 支持体付き樹脂シート |
| JP6610612B2 (ja) * | 2017-04-28 | 2019-11-27 | 味の素株式会社 | 支持体付き樹脂シート |
| WO2019102719A1 (ja) * | 2017-11-27 | 2019-05-31 | ナミックス株式会社 | フィルム状半導体封止材 |
| WO2019106953A1 (ja) * | 2017-11-30 | 2019-06-06 | 京セラ株式会社 | 樹脂シート、半導体装置及び半導体装置の製造方法 |
| KR102121442B1 (ko) * | 2017-12-28 | 2020-06-10 | 주식회사 엘지화학 | 고분자 복합 재료의 제조방법 |
| JP7192674B2 (ja) * | 2019-06-20 | 2022-12-20 | 味の素株式会社 | 樹脂シート |
| CN114574125B (zh) * | 2021-12-22 | 2024-04-30 | 广东生益科技股份有限公司 | 一种离型膜及其制备方法和应用 |
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| JPS5841908B2 (ja) * | 1972-01-13 | 1983-09-16 | ボンタイル カブシキガイシヤ | ケシヨウソウ ノ ケイセイホウホウ |
| JP3796648B2 (ja) | 1999-04-15 | 2006-07-12 | 信越化学工業株式会社 | エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置 |
| JP2002361173A (ja) | 2001-06-11 | 2002-12-17 | Chugoku Marine Paints Ltd | 電子線硬化積層塗膜の形成方法、その方法で形成された塗膜およびその塗膜で被覆された基材 |
| JP2003177241A (ja) * | 2001-12-10 | 2003-06-27 | Fujimori Kogyo Co Ltd | 光学用積層体、粘着剤転写テープ、および光学用積層体の製造法 |
| TWI390621B (zh) * | 2007-11-08 | 2013-03-21 | 半導體用接著片及切割膠帶一體型半導體用接著片 | |
| JP2009141020A (ja) * | 2007-12-04 | 2009-06-25 | Furukawa Electric Co Ltd:The | 電子部品封止用シート |
| JP5098851B2 (ja) * | 2007-12-25 | 2012-12-12 | 日立化成工業株式会社 | 積層型封止用フィルム |
| JP5651941B2 (ja) * | 2008-10-07 | 2015-01-14 | 味の素株式会社 | エポキシ樹脂組成物 |
| JP5744386B2 (ja) * | 2009-10-07 | 2015-07-08 | 日東電工株式会社 | 光半導体封止材 |
| JP5426511B2 (ja) * | 2009-11-30 | 2014-02-26 | パナソニック株式会社 | 封止用エポキシ樹脂組成物シート及びこれを用いて封止した中空型デバイス |
| JP5308409B2 (ja) | 2010-07-27 | 2013-10-09 | パナソニック株式会社 | 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品 |
| WO2012105659A1 (ja) * | 2011-02-04 | 2012-08-09 | 日立化成工業株式会社 | 接着テープ |
| JP5827864B2 (ja) * | 2011-06-14 | 2015-12-02 | 日東電工株式会社 | 封止用シートおよび光半導体素子装置 |
| JP5674610B2 (ja) * | 2011-09-21 | 2015-02-25 | 日東電工株式会社 | シリコーン樹脂シート、その製造方法、封止シートおよび発光ダイオード装置 |
| CN103165544A (zh) * | 2011-12-12 | 2013-06-19 | 日东电工株式会社 | 层叠片、及使用层叠片的半导体装置的制造方法 |
| KR101897955B1 (ko) * | 2012-01-23 | 2018-09-12 | 아지노모토 가부시키가이샤 | 수지 조성물 |
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- 2014-08-06 JP JP2014160648A patent/JP6365092B2/ja active Active
- 2014-08-11 KR KR1020140103164A patent/KR102308969B1/ko active IP Right Grant
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| KR102308969B1 (ko) | 2021-10-07 |
| CN104416998A (zh) | 2015-03-18 |
| TW201514011A (zh) | 2015-04-16 |
| TWI674972B (zh) | 2019-10-21 |
| JP2015061720A (ja) | 2015-04-02 |
| CN104416998B (zh) | 2019-01-18 |
| KR20150022672A (ko) | 2015-03-04 |
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