JP6359789B2 - ボンディングワイヤ - Google Patents
ボンディングワイヤ Download PDFInfo
- Publication number
- JP6359789B2 JP6359789B2 JP2018504065A JP2018504065A JP6359789B2 JP 6359789 B2 JP6359789 B2 JP 6359789B2 JP 2018504065 A JP2018504065 A JP 2018504065A JP 2018504065 A JP2018504065 A JP 2018504065A JP 6359789 B2 JP6359789 B2 JP 6359789B2
- Authority
- JP
- Japan
- Prior art keywords
- mass
- wire
- bonding wire
- less
- fab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052763 palladium Inorganic materials 0.000 claims description 22
- 229910052737 gold Inorganic materials 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- 238000010265 fast atom bombardment Methods 0.000 description 38
- 239000010931 gold Substances 0.000 description 33
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 27
- 239000011575 calcium Substances 0.000 description 17
- 238000005491 wire drawing Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001579 optical reflectometry Methods 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Led Device Packages (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016048738 | 2016-03-11 | ||
| JP2016048738 | 2016-03-11 | ||
| PCT/JP2017/004771 WO2017154453A1 (ja) | 2016-03-11 | 2017-02-09 | ボンディングワイヤ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6359789B2 true JP6359789B2 (ja) | 2018-07-18 |
| JPWO2017154453A1 JPWO2017154453A1 (ja) | 2018-08-09 |
Family
ID=59790333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018504065A Active JP6359789B2 (ja) | 2016-03-11 | 2017-02-09 | ボンディングワイヤ |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6359789B2 (ko) |
| KR (1) | KR102455208B1 (ko) |
| CN (1) | CN108701622B (ko) |
| MY (1) | MY179434A (ko) |
| TW (1) | TWI679290B (ko) |
| WO (1) | WO2017154453A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020218968A1 (en) * | 2019-04-26 | 2020-10-29 | Heraeus Materials Singapore Pte. Ltd. | Coated wire |
| CN116325102A (zh) * | 2021-01-26 | 2023-06-23 | 株式会社新川 | 打线接合装置、打线接合装置的控制方法以及打线接合装置的控制程序 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5064577B2 (ja) * | 2011-01-20 | 2012-10-31 | タツタ電線株式会社 | ボールボンディング用ワイヤ |
| KR101323246B1 (ko) * | 2011-11-21 | 2013-10-30 | 헤레우스 머티어리얼즈 테크놀로지 게엠베하 운트 코 카게 | 반도체 소자용 본딩 와이어, 그 제조방법, 반도체 소자용 본딩 와이어를 포함하는 발광다이오드 패키지 |
| JP5165810B1 (ja) * | 2012-09-12 | 2013-03-21 | 田中電子工業株式会社 | 銀金パラジウム系合金バンプワイヤ |
| JP5671512B2 (ja) * | 2012-11-07 | 2015-02-18 | タツタ電線株式会社 | ボンディング用ワイヤ |
| JP6276501B2 (ja) * | 2012-12-07 | 2018-02-07 | 田中電子工業株式会社 | 白色発光ダイオード用ボンディングワイヤ |
| JP5529992B1 (ja) * | 2013-03-14 | 2014-06-25 | タツタ電線株式会社 | ボンディング用ワイヤ |
| JP6343197B2 (ja) | 2014-07-16 | 2018-06-13 | タツタ電線株式会社 | ボンディング用ワイヤ |
-
2017
- 2017-02-09 JP JP2018504065A patent/JP6359789B2/ja active Active
- 2017-02-09 CN CN201780012704.2A patent/CN108701622B/zh active Active
- 2017-02-09 MY MYPI2018703140A patent/MY179434A/en unknown
- 2017-02-09 WO PCT/JP2017/004771 patent/WO2017154453A1/ja active Application Filing
- 2017-02-09 KR KR1020187020870A patent/KR102455208B1/ko active IP Right Grant
- 2017-02-15 TW TW106104906A patent/TWI679290B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017154453A1 (ja) | 2017-09-14 |
| TW201800585A (zh) | 2018-01-01 |
| CN108701622A (zh) | 2018-10-23 |
| TWI679290B (zh) | 2019-12-11 |
| KR102455208B1 (ko) | 2022-10-14 |
| KR20180123472A (ko) | 2018-11-16 |
| MY179434A (en) | 2020-11-06 |
| JPWO2017154453A1 (ja) | 2018-08-09 |
| CN108701622B (zh) | 2021-12-10 |
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