CN101626005B - 键合银丝及其制备方法 - Google Patents

键合银丝及其制备方法 Download PDF

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CN101626005B
CN101626005B CN2009100170092A CN200910017009A CN101626005B CN 101626005 B CN101626005 B CN 101626005B CN 2009100170092 A CN2009100170092 A CN 2009100170092A CN 200910017009 A CN200910017009 A CN 200910017009A CN 101626005 B CN101626005 B CN 101626005B
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CN101626005A (zh
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林良
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YANTAI YESNO ELECTRONIC MATERIALS CO Ltd
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Abstract

本发明是一种键合银丝及其制备方法，由以下组分组成：Cu 0.30％-0.80％，Ce 0.20％-0.50％，Pd 0.05％-0.09％，余量为Ag。本发明在高纯银材料的基础上，采取多元掺杂合金，加入其他成分，减少金属化合物的形成，同时阻止了界面氧化物和裂纹的产生，降低了结合性能的退化，使结合性能和金丝一样稳定，从而提高了结合性能、导电性和抗氧化性；并通过控制熔铸、加工、热处理条件，进一步优化组织结构，保证得到合适的机械性能，以满足不同的需要，能够真正应用于集成电路等高级封装中，部分或全部取代金丝。

Description

键合银丝及其制备方法
(一)、技术领域  本发明涉及一种键合银丝并涉及其制备方法。
(二)、背景技术  键合丝(Bonding Wires)作为一个产品族(ProductFamily)是半导体封装的关键材料之一，它的功能是实现半导体芯片与引脚的电连接，起着芯片与外界的电流导入及导出作用。键合丝目前主要由金丝和铝丝及铜丝组成，其中铝丝仅限于低档的玩具电路，金丝则占有中高产品，超过总的80％的份额。近年来黄金价格的持续走高，促使金丝替代品的发展，包括铜丝、金银合金丝等，其中铜丝已经较为成熟，并且开始应用，但由于其易氧化和硬度较大等问题，严重影响了器件的可靠性和效率，故虽然从八十年代就开始探讨，生产制造和使用技术也都有了很大的改进，但到现在还只限于分离器件等低档产品的批量应用。
(三)、发明内容  本发明所要解决的技术问题是，提供一种键合银丝及其制备方法，通过合金技术来改进其材料性能，来接近或达到金丝的要求，使其可以真正应用于集成电路等高级封装中，以部分或全部取代金丝。
本发明的技术方案如下。
一种键合银丝，其特征在于由以下组分组成：Cu 0.30％-0.80％，Ce0.20％-0.50％，Pd 0.05％-0.09％，余量为Ag。
所述的键合银丝的制备方法，其特征在于经过以下步骤制备而成：
a.银原料：选择99.999％以上的高纯银，或选择提纯工艺，将高纯银纯度由初始的99.95％-99.99％去除杂质，达到99.999％以上的高纯银；
b.熔铸：在99.999％的高纯银中按比例加入所述的各种金属，经过预合金、母合金和连续拉铸工艺，熔铸成圆棒；
c.拉丝：将圆棒通过拉丝机拉成丝线；
d.退火；
e.机械性能检测；
f.绕线：将丝线分绕成不同长度的小轴。
本发明的积极效果如下。
键合银丝与金和铜键合丝相比较，(1)、银的导电性比金和铜都好；(2)、银的刚性(强度)适中，比金好，低于铜；(3)、银的抗氧化性不如金，但比铜好；(4)、银的硬度与金基本相同，但低于铜丝。
现在铜丝替代金丝的使用过程中，最大的问题，一个是抗氧化性差，影响器件的可靠性和效率，并增加了生产和使用成本；另外一个问题是硬度太大，容易造成芯片的损坏，大大影响了成品率；而银线的抗氧化性优于铜线，硬度又低于铜线，所以从综合性能上看，银线相对于铜线更有优势，并且强度略高于金，更适合高密度、小型化封装的需要；故从材料性能上看，银丝也更接近于金线；另外，从成本上来看，虽然银价格上高于铜，但远远低于金。
影响银键合丝最主要的问题是键合时银铝扩散过快，造成焊点的中间化合物过厚，影响导电性和可靠性；本发明在高纯银材料的基础上，采取多元掺杂合金，加入其他成分，减少金属化合物的形成，同时阻止了界面氧化物和裂纹的产生，降低了结合性能的退化，使结合性能和金丝一样稳定，从而提高了结合性能、导电性和抗氧化性；并通过控制熔铸、加工、热处理条件，进一步优化组织结构，保证得到合适的机械性能，以满足不同的需要，能够真正应用于集成电路等高级封装中，部分或全部取代金丝。
(四)、附图说明  图1是本发明自由烧球形状图。
图2是本发明键合成弧排列图，可见线弧没有问题。
图3是本发明银球TEM结构图。
图4是本发明银铝界面TEM结构图。
图5是本发明银铜楔焊结合剖面图。
图6是本发明银铝球焊结合剖面图。
图7是本发明银铝扩散层剖面(200℃ 500hr)图。
图8是本发明200℃老化后的剪切试验图。
图9是本发明250℃老化后的剪切试验图。
(五)、具体实施方式  下面结合附图和具体实施例进一步说明本发明。
实施例一
原料配比：Cu 0.30％，Ce 0.50％，Pd 0.05％％，以Ag配至100％。
制备方法：a.银原料：选择99.999％以上的高纯银，或选择提纯工艺，将高纯银纯度由初始的99.95％-99.99％去除杂质，达到99.999％以上的高纯银；
b.熔铸：根据不同型号及客户的要求将99.999％的高纯银，加入各种合金，经过预合金、母合金和连续拉铸工艺，熔铸成圆棒，以满足下一步工艺要求；
c.拉丝：将银棒通过拉丝机拉成不同直径的丝线；
d.退火：根据客户的不同要求，设定不同的退火参数，消除应力，并得到满足要求的机械性能；
e.机械性能检测：检查产品是否符合要求；
f.绕线：根据客户的不同要求将银丝分绕成不同长度的小轴；
g.最终检验：表面、直径、放线、应力、机械性能、长度等检测；
h.包装。
实施例二
原料配比：Cu 0.80％，Ce 0.20％％，Pd 0.09％，以Ag配至100％。
制备方法：同实施例一。
实施例三
原料配比：Cu 0.60％，Ce 0.40％，Pd 0.07％，以Ag配至100％。
制备方法：同实施例一。
对实施例三成品进行检测，检测数据如表1、表2。
由表1可知，本发明的合金丝更接近金键合丝的形成金属间化合物的速度。
由表2可知，本发明的合金丝接近金键合丝的各项机械性能，并能够满足集成电路等高级封装的键合要求。
表1  形成金属间化合物的速度
Figure G2009100170092D00041
表2  本发明的银键合丝与现有金键合丝的机械性能对比表
Figure G2009100170092D00042
其中，表1数据的检测条件是：SE：KBSI-LEO 1455VP；EHT＝20.00KVWD＝10MM；Mag＝2.00kx；Spot Size＝230。
表2断裂负荷和延伸率的检测条件是：Sample Length：10mm；Pull Speed：10mm/min；M/C：Istron 4301。
由图1可见，本发明的烧球均匀，没有缺陷。
由图2可见，线弧没有问题。
由图3可见，成球微观结构良好。
由图4可见，焊接微观结构良好。
由图5可见，尾焊结合良好。
由图6可见，球焊结合良好。
由图7可见，扩散检测良好。
由图8、9可见，焊接良好。

Claims (2)

1.一种键合银丝，其特征在于由以下组分组成：Cu 0.60％，Ce 0.40％，Pd0.07％，余量为Ag。
2.如权利要求1所述的键合银丝的制备方法，其特征在于经过以下步骤制备而成：
a.银原料：选择99.999％以上的高纯银，或选择提纯工艺，将高纯银纯度由初始的99.95％-99.99％去除杂质，达到99.999％以上的高纯银；
b.熔铸：在99.999％的高纯银中按比例加入所述的各种金属，经过预合金、母合金和连续拉铸工艺，熔铸成圆棒；
c.拉丝：将圆棒通过拉丝机拉成丝线；
d.退火；
e.机械性能检测；
f.绕线：将丝线分绕成不同长度的小轴。
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CN102214630A (zh) * 2011-05-18 2011-10-12 苏州衡业新材料科技有限公司 银基微合金键合丝及其制备方法
CN102312120A (zh) * 2011-09-01 2012-01-11 王一平 耐电迁移银铟合金键合丝及其制备方法
CN102776408B (zh) * 2012-08-16 2014-01-08 烟台一诺电子材料有限公司 一种银合金丝及其制备方法
CN103805799A (zh) * 2014-01-09 2014-05-21 东莞市共民实业有限公司 用于超微细银漆包线的稀土银铜合金及其生产工艺
CN104593634B (zh) * 2014-12-31 2016-11-02 北京达博有色金属焊料有限责任公司 一种化学镀金钯键合银合金丝及其制备方法
CN105063407B (zh) * 2015-05-30 2018-01-26 汕头市骏码凯撒有限公司 一种led封装用银合金键合丝及其制造方法
CN107385268A (zh) * 2017-07-28 2017-11-24 浙江普金属制造有限公司 银合金异形丝材及其制备方法
CN110219029A (zh) * 2019-06-20 2019-09-10 广东禾木科技有限公司 一种键合丝阴极钝化保护处理工艺
CN111235425B (zh) * 2020-02-19 2021-04-06 基迈克材料科技（苏州）有限公司 AgPdCu合金及其制备方法、AgPdCu合金溅射靶材及其制备方法
CN112626368B (zh) * 2020-12-23 2022-01-25 南昌航空大学 一种银合金键合线的制备方法

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