CN101626005A - 键合银丝及其制备方法 - Google Patents
键合银丝及其制备方法 Download PDFInfo
- Publication number
- CN101626005A CN101626005A CN200910017009A CN200910017009A CN101626005A CN 101626005 A CN101626005 A CN 101626005A CN 200910017009 A CN200910017009 A CN 200910017009A CN 200910017009 A CN200910017009 A CN 200910017009A CN 101626005 A CN101626005 A CN 101626005A
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- Prior art keywords
- silver
- bonding
- gold
- filamentary
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052709 silver Inorganic materials 0.000 title claims abstract description 27
- 239000004332 silver Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005266 casting Methods 0.000 claims abstract description 4
- 239000010946 fine silver Substances 0.000 claims description 12
- 238000005491 wire drawing Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000010944 silver (metal) Substances 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 19
- 239000010931 gold Substances 0.000 abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 16
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 229910052802 copper Chemical group 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 240000006409 Acacia auriculiformis Species 0.000 description 1
- 241001226615 Asphodelus albus Species 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001254 electrum Inorganic materials 0.000 description 1
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100170092A CN101626005B (zh) | 2009-07-09 | 2009-07-09 | 键合银丝及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009100170092A CN101626005B (zh) | 2009-07-09 | 2009-07-09 | 键合银丝及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN101626005A true CN101626005A (zh) | 2010-01-13 |
CN101626005B CN101626005B (zh) | 2012-02-01 |
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CN2009100170092A Active CN101626005B (zh) | 2009-07-09 | 2009-07-09 | 键合银丝及其制备方法 |
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CN (1) | CN101626005B (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102214630A (zh) * | 2011-05-18 | 2011-10-12 | 苏州衡业新材料科技有限公司 | 银基微合金键合丝及其制备方法 |
CN102312120A (zh) * | 2011-09-01 | 2012-01-11 | 王一平 | 耐电迁移银铟合金键合丝及其制备方法 |
CN102776408A (zh) * | 2012-08-16 | 2012-11-14 | 烟台一诺电子材料有限公司 | 一种银合金丝及其制备方法 |
CN103805799A (zh) * | 2014-01-09 | 2014-05-21 | 东莞市共民实业有限公司 | 用于超微细银漆包线的稀土银铜合金及其生产工艺 |
CN104593634A (zh) * | 2014-12-31 | 2015-05-06 | 北京达博有色金属焊料有限责任公司 | 一种化学镀金钯键合银合金丝及其制备方法 |
CN105063407A (zh) * | 2015-05-30 | 2015-11-18 | 汕头市骏码凯撒有限公司 | 一种led封装用银合金键合丝及其制造方法 |
CN107385268A (zh) * | 2017-07-28 | 2017-11-24 | 浙江普金属制造有限公司 | 银合金异形丝材及其制备方法 |
CN110219029A (zh) * | 2019-06-20 | 2019-09-10 | 广东禾木科技有限公司 | 一种键合丝阴极钝化保护处理工艺 |
CN111235425A (zh) * | 2020-02-19 | 2020-06-05 | 基迈克材料科技(苏州)有限公司 | AgPdCu合金及其制备方法、AgPdCu合金溅射靶材及其制备方法 |
CN112626368A (zh) * | 2020-12-23 | 2021-04-09 | 南昌航空大学 | 一种银合金键合线的制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1594620A (zh) * | 2004-07-06 | 2005-03-16 | 贺利氏招远贵金属材料有限公司 | 合金金丝及其制造方法 |
CN101431029B (zh) * | 2007-11-06 | 2010-07-07 | 李俊德 | 封装导线用的复合金属线及其制造方法 |
-
2009
- 2009-07-09 CN CN2009100170092A patent/CN101626005B/zh active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102214630A (zh) * | 2011-05-18 | 2011-10-12 | 苏州衡业新材料科技有限公司 | 银基微合金键合丝及其制备方法 |
CN102312120A (zh) * | 2011-09-01 | 2012-01-11 | 王一平 | 耐电迁移银铟合金键合丝及其制备方法 |
CN102776408A (zh) * | 2012-08-16 | 2012-11-14 | 烟台一诺电子材料有限公司 | 一种银合金丝及其制备方法 |
CN103805799A (zh) * | 2014-01-09 | 2014-05-21 | 东莞市共民实业有限公司 | 用于超微细银漆包线的稀土银铜合金及其生产工艺 |
CN104593634A (zh) * | 2014-12-31 | 2015-05-06 | 北京达博有色金属焊料有限责任公司 | 一种化学镀金钯键合银合金丝及其制备方法 |
CN105063407A (zh) * | 2015-05-30 | 2015-11-18 | 汕头市骏码凯撒有限公司 | 一种led封装用银合金键合丝及其制造方法 |
CN107385268A (zh) * | 2017-07-28 | 2017-11-24 | 浙江普金属制造有限公司 | 银合金异形丝材及其制备方法 |
CN110219029A (zh) * | 2019-06-20 | 2019-09-10 | 广东禾木科技有限公司 | 一种键合丝阴极钝化保护处理工艺 |
CN111235425A (zh) * | 2020-02-19 | 2020-06-05 | 基迈克材料科技(苏州)有限公司 | AgPdCu合金及其制备方法、AgPdCu合金溅射靶材及其制备方法 |
CN112626368A (zh) * | 2020-12-23 | 2021-04-09 | 南昌航空大学 | 一种银合金键合线的制备方法 |
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Publication number | Publication date |
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CN101626005B (zh) | 2012-02-01 |
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