CN102776408A - 一种银合金丝及其制备方法 - Google Patents
一种银合金丝及其制备方法 Download PDFInfo
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- CN102776408A CN102776408A CN2012102910676A CN201210291067A CN102776408A CN 102776408 A CN102776408 A CN 102776408A CN 2012102910676 A CN2012102910676 A CN 2012102910676A CN 201210291067 A CN201210291067 A CN 201210291067A CN 102776408 A CN102776408 A CN 102776408A
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- 229910001316 Ag alloy Inorganic materials 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 10
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 8
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 8
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 229910052718 tin Inorganic materials 0.000 claims abstract description 8
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims description 28
- 239000004332 silver Substances 0.000 claims description 28
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000005491 wire drawing Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 13
- 230000007797 corrosion Effects 0.000 abstract description 13
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 2
- 238000009749 continuous casting Methods 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 8
- 239000013078 crystal Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- -1 silver ions Chemical class 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 229910001254 electrum Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 229910000923 precious metal alloy Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
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CN201210291067.6A CN102776408B (zh) | 2012-08-16 | 2012-08-16 | 一种银合金丝及其制备方法 |
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CN201210291067.6A CN102776408B (zh) | 2012-08-16 | 2012-08-16 | 一种银合金丝及其制备方法 |
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CN102776408A true CN102776408A (zh) | 2012-11-14 |
CN102776408B CN102776408B (zh) | 2014-01-08 |
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Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103614588A (zh) * | 2013-11-19 | 2014-03-05 | 苏州衡业新材料科技有限公司 | 银及银合金微细线的制备方法 |
CN103789568A (zh) * | 2014-02-18 | 2014-05-14 | 浙江佳博科技股份有限公司 | 一种合金键合丝及其制备方法及应用 |
CN104009015A (zh) * | 2013-02-21 | 2014-08-27 | 光洋应用材料科技股份有限公司 | 用于半导体封装的银合金焊接导线 |
CN104073676A (zh) * | 2014-07-15 | 2014-10-01 | 汕头市骏码凯撒有限公司 | 一种半导体用键合银合金丝及其制造方法 |
CN104134644A (zh) * | 2013-04-02 | 2014-11-05 | 田中电子工业株式会社 | 球焊用稀贵金属银合金丝 |
CN104593634A (zh) * | 2014-12-31 | 2015-05-06 | 北京达博有色金属焊料有限责任公司 | 一种化学镀金钯键合银合金丝及其制备方法 |
CN104637711A (zh) * | 2015-01-27 | 2015-05-20 | 上海银点电子科技有限公司 | 一种铆钉触点加工工艺 |
CN104646846A (zh) * | 2013-11-21 | 2015-05-27 | 北京有色金属与稀土应用研究所 | 银铜钯金合金丝状钎料及其制备方法 |
CN105470228A (zh) * | 2015-12-05 | 2016-04-06 | 烟台一诺半导体材料有限公司 | 一种绝缘覆膜抗腐蚀合金键合丝及其制备方法 |
CN105543532A (zh) * | 2016-02-18 | 2016-05-04 | 安徽华晶微电子材料科技有限公司 | 一种极微细键合混合合金丝及其制作方法 |
CN105671355A (zh) * | 2016-04-15 | 2016-06-15 | 浙江佳博科技股份有限公司 | 一种低成本合金键合丝及其制备方法与应用 |
CN105772522A (zh) * | 2014-12-23 | 2016-07-20 | 福建盈盛号金银饰品有限公司 | 银纸编纺工艺及生产设备 |
CN106757281A (zh) * | 2016-12-29 | 2017-05-31 | 广东工业大学 | 一种保护剂组合物和抗腐蚀键合丝及其制备方法 |
KR101758038B1 (ko) * | 2015-08-12 | 2017-07-13 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
TWI596219B (zh) * | 2015-08-03 | 2017-08-21 | 陳江沂 | 銀合金材料與銀合金線 |
KR101777995B1 (ko) * | 2015-06-15 | 2017-09-12 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
CN107653400A (zh) * | 2017-09-05 | 2018-02-02 | 钱友静 | 一种用于书画表面装饰的银箔 |
CN108130445A (zh) * | 2016-12-01 | 2018-06-08 | 领宙私人有限公司 | 抗失泽银合金及其制品和制品的制造方法 |
US10468370B2 (en) | 2015-07-23 | 2019-11-05 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
CN112143931A (zh) * | 2020-09-18 | 2020-12-29 | 国金黄金股份有限公司 | 一种低导热银材料及其制备方法、银器 |
CN112342426A (zh) * | 2020-11-10 | 2021-02-09 | 汕头市骏码凯撒有限公司 | 新型银合金键合丝及其制造方法 |
US10950570B2 (en) | 2014-04-21 | 2021-03-16 | Nippon Steel Chemical & Material Co., Ltd. | Bonding wire for semiconductor device |
CN113045920A (zh) * | 2021-05-13 | 2021-06-29 | 深圳中宝新材科技有限公司 | 一种抗氧化键合铜丝及其制备方法 |
CN113241303A (zh) * | 2021-05-19 | 2021-08-10 | 合肥矽格玛应用材料有限公司 | 封装键合铂金丝及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002062375A (ja) * | 2000-08-16 | 2002-02-28 | Furuya Kinzoku:Kk | 腕時計及び腕時計用金属材料 |
CN101626005A (zh) * | 2009-07-09 | 2010-01-13 | 烟台一诺电子材料有限公司 | 键合银丝及其制备方法 |
-
2012
- 2012-08-16 CN CN201210291067.6A patent/CN102776408B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002062375A (ja) * | 2000-08-16 | 2002-02-28 | Furuya Kinzoku:Kk | 腕時計及び腕時計用金属材料 |
CN101626005A (zh) * | 2009-07-09 | 2010-01-13 | 烟台一诺电子材料有限公司 | 键合银丝及其制备方法 |
Cited By (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104009015A (zh) * | 2013-02-21 | 2014-08-27 | 光洋应用材料科技股份有限公司 | 用于半导体封装的银合金焊接导线 |
CN104009015B (zh) * | 2013-02-21 | 2018-07-20 | 光洋应用材料科技股份有限公司 | 用于半导体封装的银合金焊接导线 |
CN104134644B (zh) * | 2013-04-02 | 2017-04-12 | 田中电子工业株式会社 | 球焊用稀贵金属银合金丝 |
CN104134644A (zh) * | 2013-04-02 | 2014-11-05 | 田中电子工业株式会社 | 球焊用稀贵金属银合金丝 |
CN103614588A (zh) * | 2013-11-19 | 2014-03-05 | 苏州衡业新材料科技有限公司 | 银及银合金微细线的制备方法 |
CN104646846A (zh) * | 2013-11-21 | 2015-05-27 | 北京有色金属与稀土应用研究所 | 银铜钯金合金丝状钎料及其制备方法 |
CN103789568A (zh) * | 2014-02-18 | 2014-05-14 | 浙江佳博科技股份有限公司 | 一种合金键合丝及其制备方法及应用 |
CN103789568B (zh) * | 2014-02-18 | 2018-02-23 | 浙江佳博科技股份有限公司 | 一种合金键合丝及其制备方法及应用 |
US10950570B2 (en) | 2014-04-21 | 2021-03-16 | Nippon Steel Chemical & Material Co., Ltd. | Bonding wire for semiconductor device |
CN104073676A (zh) * | 2014-07-15 | 2014-10-01 | 汕头市骏码凯撒有限公司 | 一种半导体用键合银合金丝及其制造方法 |
CN105772522A (zh) * | 2014-12-23 | 2016-07-20 | 福建盈盛号金银饰品有限公司 | 银纸编纺工艺及生产设备 |
CN104593634A (zh) * | 2014-12-31 | 2015-05-06 | 北京达博有色金属焊料有限责任公司 | 一种化学镀金钯键合银合金丝及其制备方法 |
CN104637711A (zh) * | 2015-01-27 | 2015-05-20 | 上海银点电子科技有限公司 | 一种铆钉触点加工工艺 |
CN104637711B (zh) * | 2015-01-27 | 2018-05-11 | 上海银点电子科技有限公司 | 一种铆钉触点加工工艺 |
US10610976B2 (en) | 2015-06-15 | 2020-04-07 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
KR101777995B1 (ko) * | 2015-06-15 | 2017-09-12 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
KR101925236B1 (ko) * | 2015-06-15 | 2018-12-04 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
US10137534B2 (en) | 2015-06-15 | 2018-11-27 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
US10414002B2 (en) | 2015-06-15 | 2019-09-17 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
US10737356B2 (en) | 2015-06-15 | 2020-08-11 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
US10468370B2 (en) | 2015-07-23 | 2019-11-05 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
TWI596219B (zh) * | 2015-08-03 | 2017-08-21 | 陳江沂 | 銀合金材料與銀合金線 |
KR20180029946A (ko) * | 2015-08-12 | 2018-03-21 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
US10121758B2 (en) | 2015-08-12 | 2018-11-06 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
US9887172B2 (en) | 2015-08-12 | 2018-02-06 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
KR101758038B1 (ko) * | 2015-08-12 | 2017-07-13 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
KR102183517B1 (ko) * | 2015-08-12 | 2020-11-26 | 닛데쓰마이크로메탈가부시키가이샤 | 반도체 장치용 본딩 와이어 |
CN105470228A (zh) * | 2015-12-05 | 2016-04-06 | 烟台一诺半导体材料有限公司 | 一种绝缘覆膜抗腐蚀合金键合丝及其制备方法 |
CN105470228B (zh) * | 2015-12-05 | 2018-10-23 | 烟台一诺半导体材料有限公司 | 一种绝缘覆膜抗腐蚀合金键合丝及其制备方法 |
CN105543532A (zh) * | 2016-02-18 | 2016-05-04 | 安徽华晶微电子材料科技有限公司 | 一种极微细键合混合合金丝及其制作方法 |
CN105671355A (zh) * | 2016-04-15 | 2016-06-15 | 浙江佳博科技股份有限公司 | 一种低成本合金键合丝及其制备方法与应用 |
CN108130445A (zh) * | 2016-12-01 | 2018-06-08 | 领宙私人有限公司 | 抗失泽银合金及其制品和制品的制造方法 |
CN106757281B (zh) * | 2016-12-29 | 2019-04-09 | 广东工业大学 | 一种保护剂组合物和抗腐蚀键合丝及其制备方法 |
CN106757281A (zh) * | 2016-12-29 | 2017-05-31 | 广东工业大学 | 一种保护剂组合物和抗腐蚀键合丝及其制备方法 |
CN107653400A (zh) * | 2017-09-05 | 2018-02-02 | 钱友静 | 一种用于书画表面装饰的银箔 |
CN112143931A (zh) * | 2020-09-18 | 2020-12-29 | 国金黄金股份有限公司 | 一种低导热银材料及其制备方法、银器 |
CN112143931B (zh) * | 2020-09-18 | 2022-03-11 | 国金黄金股份有限公司 | 一种低导热银材料及其制备方法、银器 |
CN112342426A (zh) * | 2020-11-10 | 2021-02-09 | 汕头市骏码凯撒有限公司 | 新型银合金键合丝及其制造方法 |
CN113045920A (zh) * | 2021-05-13 | 2021-06-29 | 深圳中宝新材科技有限公司 | 一种抗氧化键合铜丝及其制备方法 |
CN113241303A (zh) * | 2021-05-19 | 2021-08-10 | 合肥矽格玛应用材料有限公司 | 封装键合铂金丝及其制备方法 |
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