JP5772338B2 - 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線 - Google Patents
軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線 Download PDFInfo
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Description
(軟質希薄銅合金材料の構成)
(1)添加元素について
本発明に係る軟質希薄銅合金材料は、Ti、Mg、Zr、Nb、Ca、V、Ni、Mn、及びCrからなる群から選択された添加元素を含み、残部が銅および不可避的不純物からなる。
(2)組成比率について
添加元素として、Ti、Ca、V、Ni、Mn及びCrの1種又は2種以上の合計の含有量は4〜55massppm、より10〜20massppmが好ましく、Mgの含有量は2〜30massppm、より5〜10massppmが好ましく、Zr、Nbの含有量は8〜100massppm、より20〜40massppmが好ましい。
(3)結晶組織について
本発明に係る軟質希薄銅合金線及び軟質希薄銅合金板は、結晶組織が線又は板表面から銅導体の内部に向けて線径又は板厚の20%の深さまでの平均結晶粒サイズが20μm以下である。好ましくは、その表面から内部に向けて線径又は板厚に対して5〜20%表層の平均結晶粒サイズが5〜15μmであり、その内部の平均結晶粒サイズが50〜100μmである。
(4)分散している物質について
軟質希薄銅合金材料内に分散している分散粒子のサイズは小さいことが好ましく、また、軟質希薄銅合金材料内に分散粒子が多く分散していることが好ましい。その理由は、分散粒子は、硫黄の析出サイトとしての機能を有するからであり、析出サイトとしてはサイズが小さく、数が多いことが要求されるからである。
(5)軟質希薄銅合金材料の硬さ、伸び及び引張強さについて
本発明に係る軟質希薄銅合金材料には、引張り強さと伸び率のバランスに優れることが求められる。この理由として、例えば、伸び率の値が同じ導体である場合、引張強さが高いことにより、屈曲やねじりなどの応力付加による断線の発生を低く抑えることができるからである。更に、引張強さと伸びに加え、やわらかさを兼ね備えた軟質希薄銅合金材料を、例えばボンディングワイヤに適用した場合、ボンディングパッドとしてのAl配線膜や、或いはその下のSi半導体チップにダメージを小さく抑えることができ、更に、ワイヤ自体の引張強さや伸びが大きいと、適正なワイヤーループを保持することが容易となったり、ボンディング接続部におけるボールとワイヤ境界のネック切れ不良や、ボンディングの際に、ボンディング部へワイヤを供給するときのワイヤ切れ不良などの発生を抑制することができるためである。
(軟質希薄銅合金材料の製造方法)
本発明に係る軟質希薄銅合金線、軟質希薄銅合金板の製造方法は以下のとおりである。例として、Tiを添加元素に選択した場合を説明する。
実験材として、低酸素銅(酸素濃度7massppm〜8mass ppm、硫黄濃度5mass ppm)に、チタン濃度13mass ppmを含有するφ8mmの銅線(ワイヤロッド、加工度99.3%)を作製した。φ8mmの銅線は、SCR連続鋳造圧延法(South Continuous Rod System)により、熱間圧延加工が施され作製されたものである。Tiは、シャフト炉で溶解された銅溶湯を還元ガス雰囲気で樋に流し、樋に流した銅溶湯を同じ還元ガス雰囲気の鋳造ポットに導き、この鋳造ポットにて、Tiを添加した後、ノズルを通して鋳造輪と無端ベルトとの間に形成される鋳型にて鋳塊ロッドを作成した。この鋳塊ロッドを熱間圧延加工してφ8mmの銅線を作成した。次に、各実験材に冷間伸線加工を施した。これにより、φ2.6mmサイズの軟質希薄銅合金線を作製し、その特性を検証した。
[軟質希薄銅合金線の軟質特性について]
表1は、無酸素銅線を用いた比較材1と、低酸素銅に13mass ppmのTiを含有した軟質希薄銅合金線を用いた実施材1とを、異なる焼鈍温度で1時間の焼鈍を施したもののビッカース硬さ(Hv)を検証した表である。表1によると、焼鈍温度が400℃のときに比較材1と実施材1とのビッカース硬さ(Hv)は同等レベルとなり、焼鈍温度が600℃でも同等のビッカース硬さ(Hv)を示している。このことから、本発明の軟質希薄銅合金線は十分な軟質特性を有するとともに、無酸素銅線と比較しても、特に焼鈍温度が400℃を超える領域においては優れた軟質特性を備えていることがわかる。
2.6mm径である実施材1、比較材1の表層における平均結晶粒サイズを測定した。ここに、表層における平均結晶粒サイズの測定方法は、図1に示すように、2.6mm径の径方向断面の表面から深さ方向に10μm間隔で50μmの深さまでのところの長さ10mmの線上の範囲での結晶粒サイズを測定した夫々の実測値を平均した値を表層における平均結晶粒サイズとした。
[軟質希薄銅合金線の伸び特性と結晶構造との関係について]
図2は、2.6mm径の無酸素銅線を用いた比較材1と2.6mm径の低酸素銅(酸素濃度7mass ppm〜8mass ppm、硫黄濃度5mass ppm)に13mass ppmのTiを添加した軟質希薄銅合金線を用いた実施材1を試料とし、異なる焼鈍温度で1時間の焼鈍を施したものの伸び(%)の値の推移を検証したグラフである。図2に示す丸記号は実施材1を示し、四角記号は比較材1を示す。
φ2.6mmサイズの銅線を作製するところまでは、上述した軟質希薄銅合金材料の実施例1と同様である。これをφ0.9mmまで伸線加工を施し、通電アニーラにて一旦焼鈍した後、φ0.05mmまで伸線した。
(銅導体の軟質特性及び伸び、引張強さ)
図6は、無酸素銅線を用いた比較材2に係るワイヤロッドと、低酸素銅に13mass ppmのTiを含有させた軟質希薄銅合金線から作製した実施例2に係るワイヤロッドとについて、φ0.9mm(なまし材)からφ0.05mmまで伸線加工をし、通電アニーラによる焼鈍(電圧21〜33V、巻き取り速度500m/min)をしたあとの断面硬さ(Hv)及び機械的特性(引張強さ、伸び率)を測定した結果である。
(0.05mm径の軟質希薄銅合金線の結晶構造について)
図9は、比較材2の幅方向の断面組織を示し、図10は、実施材2の幅方向の断面組織を示す。図9に示すように、比較材2の結晶構造は、表面部から中央部にかけて全体的に大きさの等しい結晶粒が均一に並んでいることが分かる。一方、実施材2の結晶構造は、全体的に結晶粒の大きさがまばらであり、試料の断面方向の表面付近に薄く形成されている層における結晶粒サイズが内部の結晶粒サイズに比べて極めて小さくなっている。
図12は、実施材1と同様の組成であり、0.26mm径の線材に対して焼鈍温度600℃で1時間の焼鈍を施したものを用いた実施材3の線の幅方向の断面組織の断面写真を表したものであり、図13は、比較材1と同様の組成であり、0.26mm径の線材に対して焼鈍温度600℃で1時間の焼鈍を施したものを用いた比較材3の線の幅方向の断面組織の断面写真を表したものである。
図14は、実施材4の試料の幅方向の断面組織の写真を表したものであり、図15は、比較材4の幅方向の断面組織の写真を表したものである。
Claims (5)
- 4mass ppm〜55mass ppmのTiである添加元素と、2mass ppm〜12mass ppmの硫黄と、2mass ppmを超え30mass ppm以下の酸素とを含み、残部が銅であり、1100℃以上1320℃以下の溶銅温度で溶湯にした銅溶湯に前記Tiを添加し、前記Tiが添加された銅溶湯からワイヤロッドを作製した後、最初の圧延ロールでの温度を880℃以下、最終圧延ロールでの温度を550℃以上に制御して前記ワイヤロッドに熱間圧延加工を施す工程を経て製造された軟質希薄銅合金材料からなる軟質希薄銅合金線の表面から内部に向けて少なくとも線径の20%の深さまでの平均結晶粒サイズが20μm以下であり、引張り強さが210MPa以上、伸び率が15%以上及びビッカース硬さが65Hv以下であることを特徴とする軟質希薄銅合金線。
- 請求項1において、導電率が98%IACS以上であることを特徴とする軟質希薄銅合金線。
- 4mass ppm〜55mass ppmのTiである添加元素と、2mass ppm〜12mass ppmの硫黄と、2mass ppmを超え30mass ppm以下の酸素とを含み、残部が銅であり、1100℃以上1320℃以下の溶銅温度で溶湯にした銅溶湯に前記Tiを添加し、前記Tiが添加された銅溶湯からワイヤロッドを作製した後、最初の圧延ロールでの温度を880℃以下、最終圧延ロールでの温度を550℃以上に制御して前記ワイヤロッドに熱間圧延加工を施す工程を経て製造された軟質希薄銅合金材料からなる軟質希薄銅合金板の表面から内部に向けて少なくとも板厚の20%の深さまでの平均結晶粒サイズが20μm以下であり、引張り強さが210MPa以上、伸び率が15%以上及びビッカース硬さが65Hv以下であることを特徴とする軟質希薄銅合金板。
- 請求項3において、導電率が98%IACS以上であることを特徴とする軟質希薄銅合金板。
- 請求項1又は2に記載の軟質希薄銅合金線を複数本撚り合わせて形成したことを特徴とする軟質希薄銅合金撚線。
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US13/553,762 US20130022831A1 (en) | 2011-07-21 | 2012-07-19 | Soft dilute copper alloy wire, soft dilute copper alloy plate and soft dilute copper alloy stranded wire |
CN201210252581.9A CN102890976B (zh) | 2011-07-21 | 2012-07-20 | 软质低浓度铜合金线、软质低浓度铜合金板及软质低浓度铜合金捻线 |
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JP5077416B2 (ja) * | 2010-02-08 | 2012-11-21 | 日立電線株式会社 | 軟質希薄銅合金材料、軟質希薄銅合金線、軟質希薄銅合金板、軟質希薄銅合金撚線およびこれらを用いたケーブル、同軸ケーブルおよび複合ケーブル |
JP5589753B2 (ja) * | 2010-10-20 | 2014-09-17 | 日立金属株式会社 | 溶接部材、及びその製造方法 |
JP5589756B2 (ja) * | 2010-10-20 | 2014-09-17 | 日立金属株式会社 | フレキシブルフラットケーブル及びその製造方法 |
JP5589754B2 (ja) | 2010-10-20 | 2014-09-17 | 日立金属株式会社 | 希薄銅合金材料、及び耐水素脆化特性に優れた希薄銅合金材料の製造方法 |
US20130042949A1 (en) * | 2011-08-17 | 2013-02-21 | Hitachi Cable, Ltd. | Method of manufacturing soft-dilute-copper-alloy-material |
CN104810111A (zh) * | 2015-04-23 | 2015-07-29 | 德州学院 | 信号传输用电缆线芯 |
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US7946022B2 (en) * | 2005-07-05 | 2011-05-24 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic machinery and tools and method of producing the same |
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