JP6276501B2 - 白色発光ダイオード用ボンディングワイヤ - Google Patents
白色発光ダイオード用ボンディングワイヤ Download PDFInfo
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Description
従来、青色LED素子のパッド電極と配線基板上のリード電極とを接続するためのボンディングワイヤには金線が用いられてきたが、99.99質量%以上の高純度の金(Au)は、金(Au)元素自体の反射率が低く、特に450nm近辺のレーザ光などの単色光に対しては反射率が40%になるため、有機シリコン樹脂の光出射面直上からみたときにボンディングワイヤの黒い影ができ、視覚上の白色効率が低下するという問題があった。
しかし、上記のAg−Pd二元合金はフリー・エアー・ボール(FAB)を形成したときの溶融ボールの結晶粒が粗く、特に縦型発光ダイオードに用いた場合にはボンディングループが鋭角であるためワイヤ強度が不足するという問題がある。Ag−Pd−Au三元合金も、また、金(Au)が著しく硬さを増すため、FABを形成したときの溶融ボールの結晶粒が硬くかつ粗く、特に縦型発光ダイオードに用いた場合にはワイヤのしなやかさに欠けるという問題がある。
本発明において、パラジウム(Pd)を0.1〜4.0質量%添加しても、さらに金(Au)を0.01〜2.0質量%添加しても、銀(Ag)中に均一に固溶し、かつ、残りの銀(Ag)が95質量%以上あるので、当該銀合金の青色の反射率にほとんど影響を与えず、450nm近辺の光に対して80%以上の反射率を確保できる。そのため透明な有機シリコン樹脂で取り囲んでも、純金ボンディングワイヤのような黒い影ができることは無い。また、金(Au)をメイン元素(Ag)に対して数%含有させるサブ元素としたときに青色成分が出ないようにするためには、パラジウム(Pd)対金(Au)の比率が2:1〜10:1の範囲内にあることが好ましい。
なお、最終のダイヤモンドダイスの表面性状により純銀表面には数十nmオーダーの微細な傷が発生するが、ワイヤ表面の傷が微細であるため調質熱処理後であってもボンディングワイヤ表面の銀光沢色が保持される。
本発明のAg−Pd−Au三元系合金は、ランタン(La)、カルシウム(Ca)またはユーロピウム(Eu)のうちの少なくとも1種が合計で1〜50質量ppm添加した合金である。これらの微量添加元素は、Ag−Pd−Au三元合金の色を変化させることはないが、ボンディングワイヤの機械的強度を向上する効果がある。特に、本発明のAg−Pd−Au三元系合金はループ角度が鋭角の縦型擬似白色発光ダイオードに用いるのが好適である。Ag−Pd−Au三元合金にランタン(La)、カルシウム(Ca)またはユーロピウム(Eu)の元素を所定範囲内で添加すると、FABの形状を損なうことなくボンディングワイヤのしなやかさを増す。しかし、これらの元素の合計が1質量ppm未満では添加効果が無く、50質量ppmを超えるとFABを形成したときの溶融ボールの結晶粒が硬くなりすぎ、チップ割れを起こす。よって、ランタン(La)、カルシウム(Ca)またはユーロピウム(Eu)のうちの少なくとも1種が合計で1〜50質量ppmの範囲とした。
また、本発明のAg−Pd−Au三元合金またはAg−Pd−Au三元系合金のボンディングワイヤは、縦型擬似白色発光ダイオードでも横型擬似白色発光ダイオードでもボンディング強度があり、1種類のワイヤで擬似白色発光ダイオード用ボンディングワイヤとして用いることができる効果がある。
また、本発明のAg−Pd−Au三元合金またはAg−Pd−Au三元系合金のボンディングワイヤは、ボンディングワイヤの機械的強度に影響を与える金(Au)の添加量が2.0質量%以下なので、FABを形成したときの溶融ボールの結晶粒が硬くなりすぎることも無い。また、本発明のAg−Pd−Au三元合金またはAg−Pd−Au三元系合金のボンディングワイヤは、純度99.9質量%以上のアルミニウム(Al)金属または0.5〜2.0質量%のシリコン(Si)または銅(Cu)および残部純度99.9質量%以上のアルミニウム(Al)合金からなるやわらかいアルミパッドを用いた場合でも、本発明のボンディングワイヤによってチップ割れやパッドめくれが生じることは無い。
本発明における調質熱処理は、金線の場合と同様に、管状炉において、温度およびスピードを調整の上、引張り破断試験機で伸びが4%(通常品)となるように調整するための熱処理である。
各々の合金組成に対し、専用のICチップにワイヤボンダーでボンディングを行い、100点について、ダージ社製の製品名「万能ボンドテスター(BT)(型式4000)」を用い、第一ボンド時の圧着ボールのシェア強度評価を行った。それらの評価結果を表1右欄に示す。
各々の合金組成に対し、専用のICチップ(200/平方インチ)にワイヤボンダーでボンディングを行い、専用のプラスチック樹脂で封止し、電気抵抗測定用サンプルを作製した。そのサンプルを高温放置信頼性評価では175℃の温風乾燥炉内で1000時間放置し、HAST信頼性試験では高度加速寿命試験(HAST)装置内に温度130℃、湿度85%、圧力2.2気圧の条件で1000時間放置後、電気抵抗を測定した。電気抵抗は、ケースレー・インスツルメンツ社製の製品名「ソースメーター(型式2004)」を用い、専用のICソケットおよび専用に構築した自動測定システムで行った。測定方法は、いわゆる直流四端子法により、測定用プローブから隣接する外部リード間(ICチップ上のパッドが短絡した対を選択)に一定電流を流し、プローブ間の電圧を測定した。
電気抵抗は外部リード100対(200ピン)について、それぞれ放置前と放置後に電気抵抗測定を行い電気抵抗の上昇率を評価した。それらの評価結果を表1右欄に示す。
また、表1右欄中、「チップダメージ」は、水酸化ナトリウム水溶液でアルミパッドを溶かした後にチップを実体顕微鏡で観察した結果を示し、傷やクラックが少しでも入っている場合は×とし、傷やクラックがまったくない場合を◎として、それぞれ示す。
また、表1右欄中、「高温放置信頼性」は、175℃で1000時間放置した後、放置前の電気抵抗に対する電気抵抗の上昇率を示し、◎は20%以下、○は50%以下、×は50%超を、それぞれ示す。
また、表1右欄中、「HAST信頼性」は、HAST装置放置前の電気抵抗値に対する放置後の電気抵抗の上昇率を示し、◎は20%以下、○は50%以下、×は50%超を、それぞれ示す。
また、表1右欄中、「反射率」は、450nmの波長における反射率を示し、◎は85%以上、○は80%以上、△は80%未満をそれぞれ示す。
Claims (2)
- 黄色蛍光体配合の有機シリコン樹脂で取り固まれた、ベース基材の銀(Ag)または銀合金層に設置された青色LED素子のパッド電極と配線基板上のリード電極とを接続するためのボンディングワイヤであって、当該ボンディングワイヤが、パラジウム(Pd)が0.1〜4.0質量%、金(Au)が0.05〜0.92質量%、ランタン(La)、カルシウム(Ca)またはユーロピウム(Eu)のうちの少なくとも1種が合計で1〜50質量ppmおよび残部が純度99.999質量%以上の銀(Ag)からなる三元系合金であり、上記青色LED素子上面のパッド電極が純度99.9質量%以上のアルミニウム(Al)金属または0.5〜2.0質量%のシリコン(Si)または銅(Cu)および残部純度99.9質量%以上のアルミニウム(Al)合金であることを特徴とする白色発光ダイオード用ボンディングワイヤ。
- 上記パラジウム(Pd)対金(Au)の比率が2:1〜10:1の範囲内にある請求項1に記載の白色発光ダイオード用ボンディングワイヤ。
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