MY179434A - Bonding wire - Google Patents

Bonding wire

Info

Publication number
MY179434A
MY179434A MYPI2018703140A MYPI2018703140A MY179434A MY 179434 A MY179434 A MY 179434A MY PI2018703140 A MYPI2018703140 A MY PI2018703140A MY PI2018703140 A MYPI2018703140 A MY PI2018703140A MY 179434 A MY179434 A MY 179434A
Authority
MY
Malaysia
Prior art keywords
bonding wire
mass
less
mass ppm
content
Prior art date
Application number
MYPI2018703140A
Inventor
Doi Satoko
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of MY179434A publication Critical patent/MY179434A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

The present invention relates to a bonding wire containing Ag as a main component. Provided is a bonding wire exhibiting high optical reflectance, excellent wire drawability, excellent FAB formability, and excellent heat resistance. The total content of one or two elements selected from Au and Pd is 0.5 mass % or more and 1.0 mass % or less, a Ca content is 50 mass ppm or more and 100 mass ppm or less, and a balance contains Ag.
MYPI2018703140A 2016-03-11 2017-02-09 Bonding wire MY179434A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016048738 2016-03-11

Publications (1)

Publication Number Publication Date
MY179434A true MY179434A (en) 2020-11-06

Family

ID=59790333

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703140A MY179434A (en) 2016-03-11 2017-02-09 Bonding wire

Country Status (6)

Country Link
JP (1) JP6359789B2 (en)
KR (1) KR102455208B1 (en)
CN (1) CN108701622B (en)
MY (1) MY179434A (en)
TW (1) TWI679290B (en)
WO (1) WO2017154453A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020218968A1 (en) * 2019-04-26 2020-10-29 Heraeus Materials Singapore Pte. Ltd. Coated wire
CN116325102A (en) * 2021-01-26 2023-06-23 株式会社新川 Wire bonding apparatus, method for controlling wire bonding apparatus, and program for controlling wire bonding apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5064577B2 (en) 2011-01-20 2012-10-31 タツタ電線株式会社 Ball bonding wire
KR101323246B1 (en) * 2011-11-21 2013-10-30 헤레우스 머티어리얼즈 테크놀로지 게엠베하 운트 코 카게 Bonding wire for semiconductor devices, and the manufacturing method, and light emitting diode package including the bonding wire for semiconductor devices
JP5165810B1 (en) * 2012-09-12 2013-03-21 田中電子工業株式会社 Silver gold palladium alloy bump wire
JP5671512B2 (en) 2012-11-07 2015-02-18 タツタ電線株式会社 Bonding wire
JP6276501B2 (en) 2012-12-07 2018-02-07 田中電子工業株式会社 Bonding wire for white light emitting diode
JP5529992B1 (en) * 2013-03-14 2014-06-25 タツタ電線株式会社 Bonding wire
JP6343197B2 (en) 2014-07-16 2018-06-13 タツタ電線株式会社 Bonding wire

Also Published As

Publication number Publication date
JP6359789B2 (en) 2018-07-18
KR102455208B1 (en) 2022-10-14
KR20180123472A (en) 2018-11-16
CN108701622B (en) 2021-12-10
CN108701622A (en) 2018-10-23
JPWO2017154453A1 (en) 2018-08-09
WO2017154453A1 (en) 2017-09-14
TWI679290B (en) 2019-12-11
TW201800585A (en) 2018-01-01

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