JP6341883B2 - 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 - Google Patents

位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 Download PDF

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Publication number
JP6341883B2
JP6341883B2 JP2015116883A JP2015116883A JP6341883B2 JP 6341883 B2 JP6341883 B2 JP 6341883B2 JP 2015116883 A JP2015116883 A JP 2015116883A JP 2015116883 A JP2015116883 A JP 2015116883A JP 6341883 B2 JP6341883 B2 JP 6341883B2
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JP
Japan
Prior art keywords
diffraction grating
pattern
patterns
interval
moire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015116883A
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English (en)
Japanese (ja)
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JP2016027325A (ja
JP2016027325A5 (https=
Inventor
佐藤　浩司
浩司 佐藤
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Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015116883A priority Critical patent/JP6341883B2/ja
Priority to US14/750,193 priority patent/US10337856B2/en
Priority to CN201810939318.4A priority patent/CN109059765B/zh
Priority to CN201810126879.2A priority patent/CN108180836B/zh
Priority to CN201510369385.3A priority patent/CN105222705B/zh
Priority to KR1020150091007A priority patent/KR20160001693A/ko
Publication of JP2016027325A publication Critical patent/JP2016027325A/ja
Publication of JP2016027325A5 publication Critical patent/JP2016027325A5/ja
Priority to KR1020170148768A priority patent/KR101963636B1/ko
Application granted granted Critical
Publication of JP6341883B2 publication Critical patent/JP6341883B2/ja
Priority to KR1020190033057A priority patent/KR102277746B1/ko
Priority to US16/427,406 priority patent/US10989527B2/en
Priority to KR1020200040205A priority patent/KR20200038223A/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Transform (AREA)
JP2015116883A 2014-06-27 2015-06-09 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 Active JP6341883B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2015116883A JP6341883B2 (ja) 2014-06-27 2015-06-09 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US14/750,193 US10337856B2 (en) 2014-06-27 2015-06-25 Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article
CN201810126879.2A CN108180836B (zh) 2014-06-27 2015-06-26 位置检测装置
CN201510369385.3A CN105222705B (zh) 2014-06-27 2015-06-26 位置检测装置、位置检测方法、压印装置及物品的制造方法
KR1020150091007A KR20160001693A (ko) 2014-06-27 2015-06-26 위치 검출 장치, 위치 검출 방법, 임프린트 장치 및 물품의 제조 방법
CN201810939318.4A CN109059765B (zh) 2014-06-27 2015-06-26 位置检测装置
KR1020170148768A KR101963636B1 (ko) 2014-06-27 2017-11-09 위치 검출 장치, 위치 검출 방법, 임프린트 장치 및 물품의 제조 방법
KR1020190033057A KR102277746B1 (ko) 2014-06-27 2019-03-22 위치 검출 장치, 위치 검출 방법, 임프린트 장치 및 물품의 제조 방법
US16/427,406 US10989527B2 (en) 2014-06-27 2019-05-31 Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article
KR1020200040205A KR20200038223A (ko) 2014-06-27 2020-04-02 위치 검출 장치, 위치 검출 방법, 임프린트 장치 및 물품의 제조 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014133245 2014-06-27
JP2014133245 2014-06-27
JP2015116883A JP6341883B2 (ja) 2014-06-27 2015-06-09 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018094728A Division JP6701263B2 (ja) 2014-06-27 2018-05-16 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2016027325A JP2016027325A (ja) 2016-02-18
JP2016027325A5 JP2016027325A5 (https=) 2017-08-31
JP6341883B2 true JP6341883B2 (ja) 2018-06-13

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JP2015116883A Active JP6341883B2 (ja) 2014-06-27 2015-06-09 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法

Country Status (4)

Country Link
US (2) US10337856B2 (https=)
JP (1) JP6341883B2 (https=)
KR (4) KR20160001693A (https=)
CN (3) CN109059765B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018138927A (ja) * 2014-06-27 2018-09-06 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US10337856B2 (en) 2014-06-27 2019-07-02 Canon Kabushiki Kaisha Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article

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JP6884515B2 (ja) * 2016-05-10 2021-06-09 キヤノン株式会社 位置検出方法、インプリント装置及び物品の製造方法
JP6863836B2 (ja) * 2017-06-28 2021-04-21 キオクシア株式会社 ナノインプリント用テンプレート及び集積回路装置の製造方法
JP6937203B2 (ja) * 2017-09-14 2021-09-22 キオクシア株式会社 インプリント装置、インプリント方法および半導体装置の製造方法
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JP7030569B2 (ja) * 2018-03-12 2022-03-07 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
JP7182904B2 (ja) * 2018-05-31 2022-12-05 キヤノン株式会社 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2018138927A (ja) * 2014-06-27 2018-09-06 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US10337856B2 (en) 2014-06-27 2019-07-02 Canon Kabushiki Kaisha Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article
US10989527B2 (en) 2014-06-27 2021-04-27 Canon Kabushiki Kaisha Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article

Also Published As

Publication number Publication date
US20190285403A1 (en) 2019-09-19
CN108180836B (zh) 2021-06-15
US10337856B2 (en) 2019-07-02
KR20170126833A (ko) 2017-11-20
CN105222705B (zh) 2018-08-31
KR102277746B1 (ko) 2021-07-16
CN109059765B (zh) 2021-06-11
US20150377614A1 (en) 2015-12-31
JP2016027325A (ja) 2016-02-18
KR101963636B1 (ko) 2019-04-01
CN108180836A (zh) 2018-06-19
KR20160001693A (ko) 2016-01-06
CN105222705A (zh) 2016-01-06
KR20190034178A (ko) 2019-04-01
KR20200038223A (ko) 2020-04-10
CN109059765A (zh) 2018-12-21
US10989527B2 (en) 2021-04-27

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