JP6320031B2 - フレキシブル銅張積層板 - Google Patents

フレキシブル銅張積層板 Download PDF

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Publication number
JP6320031B2
JP6320031B2 JP2013267806A JP2013267806A JP6320031B2 JP 6320031 B2 JP6320031 B2 JP 6320031B2 JP 2013267806 A JP2013267806 A JP 2013267806A JP 2013267806 A JP2013267806 A JP 2013267806A JP 6320031 B2 JP6320031 B2 JP 6320031B2
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Japan
Prior art keywords
polyimide layer
copper
copper foil
clad laminate
thickness
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JP2013267806A
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English (en)
Japanese (ja)
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JP2014141083A (ja
JP2014141083A5 (https=
Inventor
利之 中林
利之 中林
桜子 重松
桜子 重松
伸悦 藤元
伸悦 藤元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2013267806A priority Critical patent/JP6320031B2/ja
Publication of JP2014141083A publication Critical patent/JP2014141083A/ja
Publication of JP2014141083A5 publication Critical patent/JP2014141083A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2013267806A 2012-12-28 2013-12-25 フレキシブル銅張積層板 Active JP6320031B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013267806A JP6320031B2 (ja) 2012-12-28 2013-12-25 フレキシブル銅張積層板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012288127 2012-12-28
JP2012288127 2012-12-28
JP2013267806A JP6320031B2 (ja) 2012-12-28 2013-12-25 フレキシブル銅張積層板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018071458A Division JP6534471B2 (ja) 2012-12-28 2018-04-03 フレキシブル回路基板

Publications (3)

Publication Number Publication Date
JP2014141083A JP2014141083A (ja) 2014-08-07
JP2014141083A5 JP2014141083A5 (https=) 2017-04-20
JP6320031B2 true JP6320031B2 (ja) 2018-05-09

Family

ID=51042338

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013267806A Active JP6320031B2 (ja) 2012-12-28 2013-12-25 フレキシブル銅張積層板
JP2018071458A Active JP6534471B2 (ja) 2012-12-28 2018-04-03 フレキシブル回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018071458A Active JP6534471B2 (ja) 2012-12-28 2018-04-03 フレキシブル回路基板

Country Status (4)

Country Link
JP (2) JP6320031B2 (https=)
KR (2) KR102092419B1 (https=)
CN (1) CN103917042B (https=)
TW (1) TWI587756B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5968380B2 (ja) * 2014-08-16 2016-08-10 ユアサシステム機器株式会社 折り曲げ試験機
JP6360760B2 (ja) * 2014-09-19 2018-07-18 新日鉄住金化学株式会社 銅張積層板及び回路基板
JP6436809B2 (ja) * 2015-02-09 2018-12-12 日鉄ケミカル＆マテリアル株式会社 フレキシブル回路基板及び電子機器
WO2016104347A1 (ja) 2014-12-22 2016-06-30 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
WO2016159104A1 (ja) * 2015-03-31 2016-10-06 株式会社カネカ 多層ポリイミドフィルム、フレキシブル金属箔積層体、フレキシブル金属箔積層体の製造方法およびリジッドフレキシブル配線板の製造方法
CN106856646A (zh) * 2016-11-13 2017-06-16 惠州市大亚湾科翔科技电路板有限公司 一种柔性覆金属叠板
JP2019126982A (ja) * 2018-01-25 2019-08-01 宇部エクシモ株式会社 金属積層体、メスコネクタ、オスコネクタ及びコネクタ構造
CN110570768B (zh) * 2019-09-11 2022-08-09 Oppo（重庆）智能科技有限公司 折叠基板、折叠屏和电子设备
JP7357815B1 (ja) 2023-03-29 2023-10-06 住友化学株式会社 積層フィルム
JP7336614B1 (ja) 2023-03-29 2023-08-31 住友化学株式会社 積層フィルム
CN117250207B (zh) * 2023-11-17 2024-01-30 四川睿杰鑫电子股份有限公司 一种柔性电路板检测装置及检查方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4309466A (en) * 1979-12-17 1982-01-05 Champion International Corporation Flexible laminated packaging material comprising metallized intermediate layer
JPS63290735A (ja) * 1987-05-22 1988-11-28 Matsushita Electric Works Ltd フレキシブル積層板
JPH04264792A (ja) * 1991-02-19 1992-09-21 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
CN2216318Y (zh) * 1994-11-24 1995-12-27 刘宝申 聚酯薄膜柔性覆铜箔板和覆膜线路板
JP3490940B2 (ja) * 1999-11-02 2004-01-26 ソニーケミカル株式会社 回路板の製造方法
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP4443977B2 (ja) * 2004-03-30 2010-03-31 新日鐵化学株式会社 フレキシブル銅張積層板及びその製造方法
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
JP2007208087A (ja) 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
JP2007273766A (ja) * 2006-03-31 2007-10-18 Nippon Steel Chem Co Ltd 配線基板用積層体
JP2008098613A (ja) * 2006-09-12 2008-04-24 Sumitomo Bakelite Co Ltd フレキシブルプリント回路板
JP5031639B2 (ja) * 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
JP2011166078A (ja) * 2010-02-15 2011-08-25 Fujikura Ltd フレキシブルプリント配線板
JP2012006200A (ja) * 2010-06-23 2012-01-12 Asahi Kasei E-Materials Corp ポリイミド金属積層体、及びそれを用いたプリント配線板
JP5858915B2 (ja) * 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話
US9408296B2 (en) * 2010-12-28 2016-08-02 Mitsui Chemicals Tohcello, Inc. Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
JP5865759B2 (ja) * 2011-03-31 2016-02-17 新日鉄住金化学株式会社 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法
TWI599277B (zh) * 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板

Also Published As

Publication number Publication date
TW201440586A (zh) 2014-10-16
JP2018139295A (ja) 2018-09-06
JP6534471B2 (ja) 2019-06-26
KR102092419B1 (ko) 2020-03-23
TWI587756B (zh) 2017-06-11
CN103917042A (zh) 2014-07-09
JP2014141083A (ja) 2014-08-07
CN103917042B (zh) 2018-03-30
KR20200015643A (ko) 2020-02-12
KR20140086899A (ko) 2014-07-08

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