KR102092419B1 - 플렉시블 동장 적층판 - Google Patents

플렉시블 동장 적층판 Download PDF

Info

Publication number
KR102092419B1
KR102092419B1 KR1020130165053A KR20130165053A KR102092419B1 KR 102092419 B1 KR102092419 B1 KR 102092419B1 KR 1020130165053 A KR1020130165053 A KR 1020130165053A KR 20130165053 A KR20130165053 A KR 20130165053A KR 102092419 B1 KR102092419 B1 KR 102092419B1
Authority
KR
South Korea
Prior art keywords
copper
polyimide layer
copper foil
clad laminate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020130165053A
Other languages
English (en)
Korean (ko)
Other versions
KR20140086899A (ko
Inventor
도시유끼 나까바야시
사꾸라꼬 시게마쯔
신에쯔 후지모또
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20140086899A publication Critical patent/KR20140086899A/ko
Application granted granted Critical
Publication of KR102092419B1 publication Critical patent/KR102092419B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020130165053A 2012-12-28 2013-12-27 플렉시블 동장 적층판 Active KR102092419B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012288127 2012-12-28
JPJP-P-2012-288127 2012-12-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200009653A Division KR20200015643A (ko) 2012-12-28 2020-01-28 플렉시블 회로 기판

Publications (2)

Publication Number Publication Date
KR20140086899A KR20140086899A (ko) 2014-07-08
KR102092419B1 true KR102092419B1 (ko) 2020-03-23

Family

ID=51042338

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130165053A Active KR102092419B1 (ko) 2012-12-28 2013-12-27 플렉시블 동장 적층판
KR1020200009653A Ceased KR20200015643A (ko) 2012-12-28 2020-01-28 플렉시블 회로 기판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020200009653A Ceased KR20200015643A (ko) 2012-12-28 2020-01-28 플렉시블 회로 기판

Country Status (4)

Country Link
JP (2) JP6320031B2 (https=)
KR (2) KR102092419B1 (https=)
CN (1) CN103917042B (https=)
TW (1) TWI587756B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5968380B2 (ja) * 2014-08-16 2016-08-10 ユアサシステム機器株式会社 折り曲げ試験機
JP6360760B2 (ja) * 2014-09-19 2018-07-18 新日鉄住金化学株式会社 銅張積層板及び回路基板
JP6436809B2 (ja) * 2015-02-09 2018-12-12 日鉄ケミカル＆マテリアル株式会社 フレキシブル回路基板及び電子機器
WO2016104347A1 (ja) 2014-12-22 2016-06-30 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
WO2016159104A1 (ja) * 2015-03-31 2016-10-06 株式会社カネカ 多層ポリイミドフィルム、フレキシブル金属箔積層体、フレキシブル金属箔積層体の製造方法およびリジッドフレキシブル配線板の製造方法
CN106856646A (zh) * 2016-11-13 2017-06-16 惠州市大亚湾科翔科技电路板有限公司 一种柔性覆金属叠板
JP2019126982A (ja) * 2018-01-25 2019-08-01 宇部エクシモ株式会社 金属積層体、メスコネクタ、オスコネクタ及びコネクタ構造
CN110570768B (zh) * 2019-09-11 2022-08-09 Oppo（重庆）智能科技有限公司 折叠基板、折叠屏和电子设备
JP7357815B1 (ja) 2023-03-29 2023-10-06 住友化学株式会社 積層フィルム
JP7336614B1 (ja) 2023-03-29 2023-08-31 住友化学株式会社 積層フィルム
CN117250207B (zh) * 2023-11-17 2024-01-30 四川睿杰鑫电子股份有限公司 一种柔性电路板检测装置及检查方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273766A (ja) * 2006-03-31 2007-10-18 Nippon Steel Chem Co Ltd 配線基板用積層体
WO2012020677A1 (ja) * 2010-08-09 2012-02-16 新日鐵化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4309466A (en) * 1979-12-17 1982-01-05 Champion International Corporation Flexible laminated packaging material comprising metallized intermediate layer
JPS63290735A (ja) * 1987-05-22 1988-11-28 Matsushita Electric Works Ltd フレキシブル積層板
JPH04264792A (ja) * 1991-02-19 1992-09-21 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
CN2216318Y (zh) * 1994-11-24 1995-12-27 刘宝申 聚酯薄膜柔性覆铜箔板和覆膜线路板
JP3490940B2 (ja) * 1999-11-02 2004-01-26 ソニーケミカル株式会社 回路板の製造方法
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP4443977B2 (ja) * 2004-03-30 2010-03-31 新日鐵化学株式会社 フレキシブル銅張積層板及びその製造方法
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
JP2007208087A (ja) 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
JP2008098613A (ja) * 2006-09-12 2008-04-24 Sumitomo Bakelite Co Ltd フレキシブルプリント回路板
JP5031639B2 (ja) * 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
JP2011166078A (ja) * 2010-02-15 2011-08-25 Fujikura Ltd フレキシブルプリント配線板
JP2012006200A (ja) * 2010-06-23 2012-01-12 Asahi Kasei E-Materials Corp ポリイミド金属積層体、及びそれを用いたプリント配線板
US9408296B2 (en) * 2010-12-28 2016-08-02 Mitsui Chemicals Tohcello, Inc. Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
JP5865759B2 (ja) * 2011-03-31 2016-02-17 新日鉄住金化学株式会社 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法
TWI599277B (zh) * 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273766A (ja) * 2006-03-31 2007-10-18 Nippon Steel Chem Co Ltd 配線基板用積層体
WO2012020677A1 (ja) * 2010-08-09 2012-02-16 新日鐵化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話

Also Published As

Publication number Publication date
TW201440586A (zh) 2014-10-16
JP2018139295A (ja) 2018-09-06
JP6534471B2 (ja) 2019-06-26
JP6320031B2 (ja) 2018-05-09
TWI587756B (zh) 2017-06-11
CN103917042A (zh) 2014-07-09
JP2014141083A (ja) 2014-08-07
CN103917042B (zh) 2018-03-30
KR20200015643A (ko) 2020-02-12
KR20140086899A (ko) 2014-07-08

Similar Documents

Publication Publication Date Title
KR102092419B1 (ko) 플렉시블 동장 적층판
KR102319574B1 (ko) 플렉시블 구리 피복 적층판의 제조 방법
KR102045089B1 (ko) 플렉시블 동장 적층판
JP2014141083A5 (https=)
JP5689277B2 (ja) フレキシブル回路基板及び多層回路基板
JP2010125793A (ja) ２層両面フレキシブル金属積層板及びその製造方法
CN104754864B (zh) 挠性覆铜积层板及挠性电路基板
JP2015088631A (ja) フレキシブル銅張積層板、フレキシブル回路基板及びその使用方法
KR102921850B1 (ko) 폴리이미드 필름, 금속 피복 적층판 및 플렉시블 회로 기판
JP5689284B2 (ja) フレキシブル両面銅張積層板の製造方法
CN105472880B (zh) 挠性电路基板及电子设备
KR101546393B1 (ko) 플렉시블 금속장 적층판 및 그 제조 방법
JP2021009997A5 (https=)
JP2015070237A (ja) フレキシブル銅張積層板及びフレキシブル回路基板
JP2007273766A (ja) 配線基板用積層体
JP4694142B2 (ja) フレキシブルプリント配線板用基板の製造方法
JP6461540B2 (ja) フレキシブル回路基板、その使用方法及び電子機器

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20131227

PG1501 Laying open of application
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180622

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20131227

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190722

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20191227

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20190722

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
A107 Divisional application of patent
AMND Amendment
PA0107 Divisional application

Comment text: Divisional Application of Patent

Patent event date: 20200128

Patent event code: PA01071R01D

PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20191227

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20190909

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20180622

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20200227

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20200128

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20191227

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20190909

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20180622

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200317

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200317

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20230222

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20240220

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20250218

Start annual number: 6

End annual number: 6