JP6317299B2 - めっき装置、めっき方法、及び基板ホルダ - Google Patents

めっき装置、めっき方法、及び基板ホルダ Download PDF

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Publication number
JP6317299B2
JP6317299B2 JP2015168969A JP2015168969A JP6317299B2 JP 6317299 B2 JP6317299 B2 JP 6317299B2 JP 2015168969 A JP2015168969 A JP 2015168969A JP 2015168969 A JP2015168969 A JP 2015168969A JP 6317299 B2 JP6317299 B2 JP 6317299B2
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JP
Japan
Prior art keywords
power supply
current
plating
substrate
supply member
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Active
Application number
JP2015168969A
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English (en)
Japanese (ja)
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JP2017043815A5 (https=
JP2017043815A (ja
Inventor
潤子 嶺
潤子 嶺
中田　勉
勉 中田
光敏 矢作
光敏 矢作
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Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2015168969A priority Critical patent/JP6317299B2/ja
Priority to TW105119892A priority patent/TWI687555B/zh
Priority to KR1020160084669A priority patent/KR102483669B1/ko
Priority to CN202010257887.8A priority patent/CN111304715B/zh
Priority to CN201610710826.6A priority patent/CN106480480B/zh
Priority to US15/248,248 priority patent/US10316426B2/en
Priority to SG10201607132XA priority patent/SG10201607132XA/en
Publication of JP2017043815A publication Critical patent/JP2017043815A/ja
Publication of JP2017043815A5 publication Critical patent/JP2017043815A5/ja
Priority to JP2018057786A priority patent/JP6488041B2/ja
Application granted granted Critical
Publication of JP6317299B2 publication Critical patent/JP6317299B2/ja
Priority to US16/396,384 priority patent/US10513795B2/en
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2015168969A 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ Active JP6317299B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2015168969A JP6317299B2 (ja) 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ
TW105119892A TWI687555B (zh) 2015-08-28 2016-06-24 鍍覆裝置、鍍覆方法、及基板固持器
KR1020160084669A KR102483669B1 (ko) 2015-08-28 2016-07-05 도금 장치, 도금 방법 및 기판 홀더
CN201610710826.6A CN106480480B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法
CN202010257887.8A CN111304715B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法
SG10201607132XA SG10201607132XA (en) 2015-08-28 2016-08-26 Plating Apparatus, Plating Method, And Substrate Holder
US15/248,248 US10316426B2 (en) 2015-08-28 2016-08-26 Plating apparatus, plating method, and substrate holder
JP2018057786A JP6488041B2 (ja) 2015-08-28 2018-03-26 めっき装置、めっき方法、及び基板ホルダ
US16/396,384 US10513795B2 (en) 2015-08-28 2019-04-26 Plating apparatus, plating method, and substrate holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015168969A JP6317299B2 (ja) 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018057786A Division JP6488041B2 (ja) 2015-08-28 2018-03-26 めっき装置、めっき方法、及び基板ホルダ

Publications (3)

Publication Number Publication Date
JP2017043815A JP2017043815A (ja) 2017-03-02
JP2017043815A5 JP2017043815A5 (https=) 2018-02-01
JP6317299B2 true JP6317299B2 (ja) 2018-04-25

Family

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JP2015168969A Active JP6317299B2 (ja) 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ
JP2018057786A Active JP6488041B2 (ja) 2015-08-28 2018-03-26 めっき装置、めっき方法、及び基板ホルダ

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JP2018057786A Active JP6488041B2 (ja) 2015-08-28 2018-03-26 めっき装置、めっき方法、及び基板ホルダ

Country Status (6)

Country Link
US (2) US10316426B2 (https=)
JP (2) JP6317299B2 (https=)
KR (1) KR102483669B1 (https=)
CN (2) CN106480480B (https=)
SG (1) SG10201607132XA (https=)
TW (1) TWI687555B (https=)

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JP6859150B2 (ja) * 2017-03-22 2021-04-14 株式会社荏原製作所 めっき装置及びめっき槽構成の決定方法
WO2019003891A1 (ja) * 2017-06-28 2019-01-03 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6891060B2 (ja) * 2017-07-11 2021-06-18 株式会社荏原製作所 レギュレーションプレート、アノードホルダ、及び基板ホルダ
US10875048B2 (en) * 2017-09-05 2020-12-29 Harland Medical Systems, Inc Coating apparatus with an automatic fluid level system, and methods of using the same
WO2019078064A1 (ja) * 2017-10-20 2019-04-25 アルメックスＰｅ株式会社 表面処理装置
JP6975650B2 (ja) * 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
JP6993288B2 (ja) * 2018-05-07 2022-01-13 株式会社荏原製作所 めっき装置
JP7182911B2 (ja) * 2018-06-21 2022-12-05 株式会社荏原製作所 めっき装置、及びめっき方法
KR102111304B1 (ko) * 2018-08-09 2020-05-18 (주)선우하이테크 정전류 제어기능을 갖는 전기 도금 시스템 및 방법
CN108754590A (zh) * 2018-08-22 2018-11-06 深圳市创智成功科技有限公司 导电环、基于其的供电装置及基于供电装置的电镀治具
TWI728668B (zh) * 2019-01-31 2021-05-21 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
JP7079224B2 (ja) * 2019-06-14 2022-06-01 株式会社荏原製作所 めっき方法、めっき装置、プログラムを記憶する不揮発性の記憶媒体
JP7256708B2 (ja) 2019-07-09 2023-04-12 株式会社荏原製作所 めっき装置
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
TWI722555B (zh) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 電鍍治具
JP7296832B2 (ja) * 2019-09-10 2023-06-23 株式会社荏原製作所 めっき装置
CN115003865B (zh) * 2020-12-28 2024-05-31 株式会社荏原制作所 基板的接液方法和镀覆装置
KR102404457B1 (ko) * 2021-01-20 2022-06-07 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판의 막 두께 측정 방법
CN114959842B (zh) * 2021-02-18 2024-06-07 日月光半导体制造股份有限公司 电镀装置及制造封装结构的方法
CN116324045B (zh) * 2021-03-03 2023-12-08 株式会社荏原制作所 基板保持器、镀覆装置以及镀覆装置的制造方法
CN114729467A (zh) * 2021-06-17 2022-07-08 株式会社荏原制作所 电阻体及镀覆装置
KR102565864B1 (ko) * 2021-06-18 2023-08-10 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 방법
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Also Published As

Publication number Publication date
TWI687555B (zh) 2020-03-11
JP2018090911A (ja) 2018-06-14
SG10201607132XA (en) 2017-03-30
TW201708623A (zh) 2017-03-01
CN106480480B (zh) 2020-05-05
CN111304715B (zh) 2021-01-26
CN111304715A (zh) 2020-06-19
CN106480480A (zh) 2017-03-08
US20170058423A1 (en) 2017-03-02
US20190249326A1 (en) 2019-08-15
US10316426B2 (en) 2019-06-11
US10513795B2 (en) 2019-12-24
JP6488041B2 (ja) 2019-03-20
KR102483669B1 (ko) 2023-01-02
KR20170026112A (ko) 2017-03-08
JP2017043815A (ja) 2017-03-02

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