CN106480480B - 镀覆装置、镀覆方法 - Google Patents

镀覆装置、镀覆方法 Download PDF

Info

Publication number
CN106480480B
CN106480480B CN201610710826.6A CN201610710826A CN106480480B CN 106480480 B CN106480480 B CN 106480480B CN 201610710826 A CN201610710826 A CN 201610710826A CN 106480480 B CN106480480 B CN 106480480B
Authority
CN
China
Prior art keywords
substrate
power supply
plating
current
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610710826.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN106480480A (zh
Inventor
岭润子
中田勉
矢作光敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to CN202010257887.8A priority Critical patent/CN111304715B/zh
Publication of CN106480480A publication Critical patent/CN106480480A/zh
Application granted granted Critical
Publication of CN106480480B publication Critical patent/CN106480480B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201610710826.6A 2015-08-28 2016-08-23 镀覆装置、镀覆方法 Active CN106480480B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010257887.8A CN111304715B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-168969 2015-08-28
JP2015168969A JP6317299B2 (ja) 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202010257887.8A Division CN111304715B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

Publications (2)

Publication Number Publication Date
CN106480480A CN106480480A (zh) 2017-03-08
CN106480480B true CN106480480B (zh) 2020-05-05

Family

ID=58098210

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610710826.6A Active CN106480480B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法
CN202010257887.8A Active CN111304715B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202010257887.8A Active CN111304715B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

Country Status (6)

Country Link
US (2) US10316426B2 (https=)
JP (2) JP6317299B2 (https=)
KR (1) KR102483669B1 (https=)
CN (2) CN106480480B (https=)
SG (1) SG10201607132XA (https=)
TW (1) TWI687555B (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3589704B1 (en) 2017-03-03 2025-05-14 Harland Medical Systems, Inc. Coating composition comprised of a hydrophilic crosslinker, a hydrophobic crosslinker and optionally a hydrogel and methods of making and using the same
JP6859150B2 (ja) * 2017-03-22 2021-04-14 株式会社荏原製作所 めっき装置及びめっき槽構成の決定方法
WO2019003891A1 (ja) * 2017-06-28 2019-01-03 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6891060B2 (ja) * 2017-07-11 2021-06-18 株式会社荏原製作所 レギュレーションプレート、アノードホルダ、及び基板ホルダ
US10875048B2 (en) * 2017-09-05 2020-12-29 Harland Medical Systems, Inc Coating apparatus with an automatic fluid level system, and methods of using the same
WO2019078064A1 (ja) * 2017-10-20 2019-04-25 アルメックスＰｅ株式会社 表面処理装置
JP6975650B2 (ja) * 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
JP6993288B2 (ja) * 2018-05-07 2022-01-13 株式会社荏原製作所 めっき装置
JP7182911B2 (ja) * 2018-06-21 2022-12-05 株式会社荏原製作所 めっき装置、及びめっき方法
KR102111304B1 (ko) * 2018-08-09 2020-05-18 (주)선우하이테크 정전류 제어기능을 갖는 전기 도금 시스템 및 방법
CN108754590A (zh) * 2018-08-22 2018-11-06 深圳市创智成功科技有限公司 导电环、基于其的供电装置及基于供电装置的电镀治具
TWI728668B (zh) * 2019-01-31 2021-05-21 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
JP7079224B2 (ja) * 2019-06-14 2022-06-01 株式会社荏原製作所 めっき方法、めっき装置、プログラムを記憶する不揮発性の記憶媒体
JP7256708B2 (ja) 2019-07-09 2023-04-12 株式会社荏原製作所 めっき装置
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
TWI722555B (zh) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 電鍍治具
JP7296832B2 (ja) * 2019-09-10 2023-06-23 株式会社荏原製作所 めっき装置
CN115003865B (zh) * 2020-12-28 2024-05-31 株式会社荏原制作所 基板的接液方法和镀覆装置
KR102404457B1 (ko) * 2021-01-20 2022-06-07 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판의 막 두께 측정 방법
CN114959842B (zh) * 2021-02-18 2024-06-07 日月光半导体制造股份有限公司 电镀装置及制造封装结构的方法
CN116324045B (zh) * 2021-03-03 2023-12-08 株式会社荏原制作所 基板保持器、镀覆装置以及镀覆装置的制造方法
CN114729467A (zh) * 2021-06-17 2022-07-08 株式会社荏原制作所 电阻体及镀覆装置
KR102565864B1 (ko) * 2021-06-18 2023-08-10 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 방법
JP7081063B1 (ja) * 2021-10-18 2022-06-06 株式会社荏原製作所 めっき方法及びめっき装置
JP7078811B1 (ja) * 2021-10-28 2022-05-31 株式会社荏原製作所 めっき装置
JP7626695B2 (ja) * 2021-12-28 2025-02-04 株式会社荏原製作所 めっき装置およびめっき方法
KR102731061B1 (ko) * 2022-06-27 2024-11-18 가부시키가이샤 에바라 세이사꾸쇼 도금 장치, 및 도금 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102851722A (zh) * 2011-06-30 2013-01-02 Almexpe株式会社 表面处理装置及工件保持夹具
JP2015151577A (ja) * 2014-02-14 2015-08-24 株式会社Ｊｃｕ 基板めっき治具

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101189A (ja) * 1988-10-05 1990-04-12 L Daburu Ii:Kk 精密電気めっき方法及びその装置
JPH0329876A (ja) 1989-06-28 1991-02-07 Nec Corp 電波監視装置
JPH05239698A (ja) * 1992-02-28 1993-09-17 Nec Corp 電気めっき方法
JPH09125294A (ja) 1995-11-02 1997-05-13 Mitsubishi Electric Corp 表面処理装置
EP1018568A4 (en) * 1998-07-10 2006-05-31 Ebara Corp VENEER DEVICE
JP4179707B2 (ja) * 1999-06-15 2008-11-12 荏原ユージライト株式会社 プリント基板保持用治具及びめっき装置
JP2001234397A (ja) * 2000-02-24 2001-08-31 Matsushita Electric Works Ltd 電気メッキ用冶具
JP4136830B2 (ja) 2003-07-10 2008-08-20 株式会社荏原製作所 めっき装置
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
JP2010209440A (ja) * 2009-03-12 2010-09-24 Sumitomo Bakelite Co Ltd メッキ用治具
JP2011127172A (ja) * 2009-12-17 2011-06-30 Nitto Denko Corp めっき装置および配線回路基板の製造方法
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor
JP5898540B2 (ja) * 2012-03-22 2016-04-06 アルメックスＰｅ株式会社 ワーク保持治具及び表面処理装置
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
CN102560586A (zh) * 2012-02-08 2012-07-11 南通富士通微电子股份有限公司 电镀方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102851722A (zh) * 2011-06-30 2013-01-02 Almexpe株式会社 表面处理装置及工件保持夹具
CN104532331A (zh) * 2011-06-30 2015-04-22 Almexpe株式会社 表面处理装置及工件保持夹具
CN104651910A (zh) * 2011-06-30 2015-05-27 Almexpe株式会社 表面处理装置及工件保持夹具
CN104674328A (zh) * 2011-06-30 2015-06-03 Almexpe株式会社 表面处理装置及工件保持夹具
JP2015151577A (ja) * 2014-02-14 2015-08-24 株式会社Ｊｃｕ 基板めっき治具

Also Published As

Publication number Publication date
TWI687555B (zh) 2020-03-11
JP2018090911A (ja) 2018-06-14
SG10201607132XA (en) 2017-03-30
TW201708623A (zh) 2017-03-01
CN111304715B (zh) 2021-01-26
JP6317299B2 (ja) 2018-04-25
CN111304715A (zh) 2020-06-19
CN106480480A (zh) 2017-03-08
US20170058423A1 (en) 2017-03-02
US20190249326A1 (en) 2019-08-15
US10316426B2 (en) 2019-06-11
US10513795B2 (en) 2019-12-24
JP6488041B2 (ja) 2019-03-20
KR102483669B1 (ko) 2023-01-02
KR20170026112A (ko) 2017-03-08
JP2017043815A (ja) 2017-03-02

Similar Documents

Publication Publication Date Title
CN106480480B (zh) 镀覆装置、镀覆方法
US11066755B2 (en) Plating apparatus and plating method
CN110184639B (zh) 电镀装置
CN118103553B (zh) 镀覆装置及镀覆方法
US10316425B2 (en) Substrate holder, plating apparatus, and plating method
TW202021034A (zh) 使基板保持器保持基板的方法
JP5400408B2 (ja) アノードホルダ用通電部材およびアノードホルダ
KR102279435B1 (ko) 기판의 제조 방법 및 기판
US11542629B2 (en) Method of plating, apparatus for plating, and non-volatile storage medium that stores program
US20180282895A1 (en) Plating method
TWI805746B (zh) 鍍覆裝置
US10508354B2 (en) Feeder capable of feeding anode and plating apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant