JP6308592B2 - Euv用ペリクル - Google Patents
Euv用ペリクル Download PDFInfo
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- JP6308592B2 JP6308592B2 JP2015007450A JP2015007450A JP6308592B2 JP 6308592 B2 JP6308592 B2 JP 6308592B2 JP 2015007450 A JP2015007450 A JP 2015007450A JP 2015007450 A JP2015007450 A JP 2015007450A JP 6308592 B2 JP6308592 B2 JP 6308592B2
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- JP
- Japan
- Prior art keywords
- pellicle
- adhesive
- euv
- silicone
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 claims description 61
- 230000001070 adhesive effect Effects 0.000 claims description 58
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 8
- 239000013464 silicone adhesive Substances 0.000 claims description 5
- 238000010998 test method Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 230000004580 weight loss Effects 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000010943 off-gassing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000007687 exposure technique Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- ISQINHMJILFLAQ-UHFFFAOYSA-N argon hydrofluoride Chemical compound F.[Ar] ISQINHMJILFLAQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 241001136616 Methone Species 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- VZPPHXVFMVZRTE-UHFFFAOYSA-N [Kr]F Chemical compound [Kr]F VZPPHXVFMVZRTE-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
ここで、TMLとは、「Total Mass Loss:重量減少値」をいう。
CVCMとは、「Collected Volatile Condensable M
aterials:再凝集物質量比」をいう。
また、本発明の接着剤は、100℃〜200℃の高温に耐える耐熱性を有するものが好ましい。
真空度:7.0×10−5Torr以下
加熱棒温度:125℃
冷却板温度:25℃
試験時間:24時間
ここで、
TMLとは、「Total Mass Loss:重量減少値」をいう。
CVCMとは、「Collected Volatile Condensable Materials:再凝集物質量比」をいう。
<実施例1>
実施例1では、先ず、外形サイズ149mm×122mm×高さ5.8mm、肉厚2mmのアルミニウム合金製ペリクルフレーム24をクリーンルームに搬入し、中性洗剤と純水により、十分に洗浄・乾燥させた。その後、図2に示される接着剤塗布装置2の架台21上にこのペリクルフレーム24を固定した。
実施例2では、接着剤13として、シリコーン系のKE−4908SC−T(信越化学工業株式会社製の製品名)を使用したが、それ以外は、実施例1と同様の方法でペリクル1を作製した。
比較例1では、接着剤13として、エポキシ系のアラルダイトAW−106(日本チバガイギー製の製品名)を使用したが、それ以外は、実施例1と同様の方法でペリクル1を作製した。
比較例2では、接着剤13として、エポキシアクリレート系のオプトダインUV−3100(ダイキン工業株式会社製の製品名)を使用したが、それ以外は、実施例1と同様の方法でペリクル1を作製した。
実施例1、2と比較例1、2で使用した接着剤13のアウトガス発生量を評価した試験条件は、以下の通りである。
[ASTM_E 595−93の試験条件]
真空度:7.0×10−5Torr以下
加熱棒温度:125℃
冷却板温度:25℃
試験時間:24時間
実施例1、2と比較例1、2で作製したペリクル1を150℃雰囲気のオーブン中に24時間静置した後、室温まで冷却し、ペリクル膜11の状態(張りの状態)を確認した。
11 ペリクル膜
12 ペリクルフレーム
13 接着剤
2 接着剤塗布装置
21 架台
22 3軸ロボット
23 シリンジ
24 ペリクルフレーム
25 ニードル
Claims (2)
- EUV露光時に、真空度7.0×10 −5 Torr以下の真空下で、100℃〜200℃の温度に晒されるEUV用ペリクルであって、ペリクル膜がシリコーン系接着剤のみを用いてペリクルフレームに接着されており、前記シリコーン系接着剤のアウトガス量がASTM_E595−93における試験方法において、TML:1.0%以下、CVCM:0.1%以下の条件を満たすことを特徴とするEUV用ペリクル。
ここで、TMLとは、「Total Mass Loss:重量減少値」であり、CVCMとは、「Collected Volatile Condensable Materials:再凝集物質量比」である。 - 前記接着剤は、100℃〜200℃の高温に耐える耐熱性を有することを特徴とする請求項1に記載のEUV用ペリクル。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015007450A JP6308592B2 (ja) | 2014-04-02 | 2015-01-19 | Euv用ペリクル |
KR1020150014228A KR102308440B1 (ko) | 2014-04-02 | 2015-01-29 | 펠리클용 접착제 및 이것을 이용한 펠리클 |
EP15156223.8A EP2927746B1 (en) | 2014-04-02 | 2015-02-24 | A pellicle for lithography |
EP21195196.7A EP3944018A1 (en) | 2014-04-02 | 2015-02-24 | Pellicle for lithography |
US14/645,856 US9341943B2 (en) | 2014-04-02 | 2015-03-12 | Pellicle for lithography |
TW104110598A TWI593770B (zh) | 2014-04-02 | 2015-04-01 | 防塵薄膜組件用接著劑以及使用其的防塵薄膜組件 |
CN201510153493.7A CN104977800B (zh) | 2014-04-02 | 2015-04-02 | 防尘薄膜组件用接着剂以及使用其的防尘薄膜组件 |
HK15111724.3A HK1211089A1 (en) | 2014-04-02 | 2015-11-27 | Adhesive for anti-dust pellicle assembly and anti-dust pellicle assembly employing the same |
KR1020210127144A KR102317381B1 (ko) | 2014-04-02 | 2021-09-27 | 펠리클 프레임 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014075903 | 2014-04-02 | ||
JP2014075903 | 2014-04-02 | ||
JP2015007450A JP6308592B2 (ja) | 2014-04-02 | 2015-01-19 | Euv用ペリクル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015200868A JP2015200868A (ja) | 2015-11-12 |
JP6308592B2 true JP6308592B2 (ja) | 2018-04-11 |
Family
ID=52589254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015007450A Active JP6308592B2 (ja) | 2014-04-02 | 2015-01-19 | Euv用ペリクル |
Country Status (7)
Country | Link |
---|---|
US (1) | US9341943B2 (ja) |
EP (2) | EP2927746B1 (ja) |
JP (1) | JP6308592B2 (ja) |
KR (2) | KR102308440B1 (ja) |
CN (1) | CN104977800B (ja) |
HK (1) | HK1211089A1 (ja) |
TW (1) | TWI593770B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6308592B2 (ja) | 2014-04-02 | 2018-04-11 | 信越化学工業株式会社 | Euv用ペリクル |
JP6669464B2 (ja) * | 2015-10-19 | 2020-03-18 | 信越化学工業株式会社 | Euv用ペリクル |
EP3165964A1 (en) * | 2015-10-29 | 2017-05-10 | Shin-Etsu Chemical Co., Ltd. | An adhesive suitable for a pellicle for euv lithography and a pellicle using the same adhesive |
JP6516665B2 (ja) * | 2015-10-29 | 2019-05-22 | 信越化学工業株式会社 | Euvリソグラフィー用ペリクルに適した接着剤とこれを用いたペリクル |
US9759997B2 (en) * | 2015-12-17 | 2017-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle assembly and method for advanced lithography |
JP6632057B2 (ja) * | 2016-01-07 | 2020-01-15 | 信越化学工業株式会社 | ペリクル |
JP7040427B2 (ja) | 2018-12-03 | 2022-03-23 | 信越化学工業株式会社 | ペリクル、ペリクル付露光原版、露光方法及び半導体の製造方法 |
JPWO2022030499A1 (ja) * | 2020-08-06 | 2022-02-10 |
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2015
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US20150286133A1 (en) | 2015-10-08 |
TWI593770B (zh) | 2017-08-01 |
CN104977800B (zh) | 2019-09-24 |
EP3944018A1 (en) | 2022-01-26 |
KR102308440B1 (ko) | 2021-10-05 |
KR102317381B1 (ko) | 2021-10-26 |
EP2927746B1 (en) | 2021-09-08 |
KR20210123252A (ko) | 2021-10-13 |
EP2927746A2 (en) | 2015-10-07 |
TW201542740A (zh) | 2015-11-16 |
KR20150114885A (ko) | 2015-10-13 |
JP2015200868A (ja) | 2015-11-12 |
HK1211089A1 (en) | 2016-05-13 |
CN104977800A (zh) | 2015-10-14 |
US9341943B2 (en) | 2016-05-17 |
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