HK1211089A1 - Adhesive for anti-dust pellicle assembly and anti-dust pellicle assembly employing the same - Google Patents

Adhesive for anti-dust pellicle assembly and anti-dust pellicle assembly employing the same

Info

Publication number
HK1211089A1
HK1211089A1 HK15111724.3A HK15111724A HK1211089A1 HK 1211089 A1 HK1211089 A1 HK 1211089A1 HK 15111724 A HK15111724 A HK 15111724A HK 1211089 A1 HK1211089 A1 HK 1211089A1
Authority
HK
Hong Kong
Prior art keywords
dust
pellicle assembly
adhesive
same
employing
Prior art date
Application number
HK15111724.3A
Other languages
English (en)
Chinese (zh)
Inventor
堀越淳
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of HK1211089A1 publication Critical patent/HK1211089A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
HK15111724.3A 2014-04-02 2015-11-27 Adhesive for anti-dust pellicle assembly and anti-dust pellicle assembly employing the same HK1211089A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014075903 2014-04-02
JP2015007450A JP6308592B2 (ja) 2014-04-02 2015-01-19 Ｅｕｖ用ペリクル

Publications (1)

Publication Number Publication Date
HK1211089A1 true HK1211089A1 (en) 2016-05-13

Family

ID=52589254

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15111724.3A HK1211089A1 (en) 2014-04-02 2015-11-27 Adhesive for anti-dust pellicle assembly and anti-dust pellicle assembly employing the same

Country Status (7)

Country Link
US (1) US9341943B2 (ja)
EP (2) EP2927746B1 (ja)
JP (1) JP6308592B2 (ja)
KR (2) KR102308440B1 (ja)
CN (1) CN104977800B (ja)
HK (1) HK1211089A1 (ja)
TW (1) TWI593770B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6308592B2 (ja) 2014-04-02 2018-04-11 信越化学工業株式会社 Ｅｕｖ用ペリクル
JP6669464B2 (ja) * 2015-10-19 2020-03-18 信越化学工業株式会社 Ｅｕｖ用ペリクル
EP3165964A1 (en) 2015-10-29 2017-05-10 Shin-Etsu Chemical Co., Ltd. An adhesive suitable for a pellicle for euv lithography and a pellicle using the same adhesive
JP6516665B2 (ja) * 2015-10-29 2019-05-22 信越化学工業株式会社 Ｅｕｖリソグラフィー用ペリクルに適した接着剤とこれを用いたペリクル
US9759997B2 (en) * 2015-12-17 2017-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle assembly and method for advanced lithography
JP6632057B2 (ja) * 2016-01-07 2020-01-15 信越化学工業株式会社 ペリクル
JP7040427B2 (ja) * 2018-12-03 2022-03-23 信越化学工業株式会社 ペリクル、ペリクル付露光原版、露光方法及び半導体の製造方法
KR20230014781A (ko) * 2020-08-06 2023-01-30 미쯔이가가꾸가부시끼가이샤 펠리클, 노광 원판, 노광 장치, 펠리클의 제조 방법 및 반도체 장치의 제조 방법

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219023A (ja) 1982-06-15 1983-12-20 Daicel Chem Ind Ltd 樹脂薄膜の製造方法
JPS6327707A (ja) 1986-07-21 1988-02-05 Matsushita Electric Ind Co Ltd 双曲面鏡検査装置
JP2603384B2 (ja) * 1991-10-15 1997-04-23 信越化学工業株式会社 リソグラフィー用ペリクル
US5597648A (en) * 1991-10-18 1997-01-28 Dow Corning Corporation Low-volatility pressure sensitive adhesives
JP4330729B2 (ja) * 1999-10-06 2009-09-16 旭化成イーマテリアルズ株式会社 耐紫外線性ペリクル
US6623893B1 (en) 2001-01-26 2003-09-23 Advanced Micro Devices, Inc. Pellicle for use in EUV lithography and a method of making such a pellicle
JP3679780B2 (ja) * 2002-06-05 2005-08-03 株式会社荒井製作所 ローラ
TW200422793A (en) * 2002-11-15 2004-11-01 Mitsui Chemicals Inc Pellicle with small gas production amount
KR101067257B1 (ko) * 2003-03-17 2011-09-27 다우 코닝 코포레이션 고온 점착 강도가 개선된 무용매 실리콘 감압성 접착제
JP2005109159A (ja) * 2003-09-30 2005-04-21 Toto Ltd トランス及びトランスの製造方法
JP2007333910A (ja) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd ペリクル
US7767985B2 (en) * 2006-12-26 2010-08-03 Globalfoundries Inc. EUV pellicle and method for fabricating semiconductor dies using same
US8480826B2 (en) * 2007-04-18 2013-07-09 The United States Of America As Represented By The Administrator Of The National Aeronautics Space Administration Specular coatings for composite structures
JP4934099B2 (ja) * 2008-05-22 2012-05-16 信越化学工業株式会社 ペリクルおよびペリクルの製造方法
JP4919098B2 (ja) * 2008-06-26 2012-04-18 信越化学工業株式会社 有機過酸化物硬化型シリコーン粘着剤組成物及び粘着テープ
JP5411666B2 (ja) * 2009-11-19 2014-02-12 信越化学工業株式会社 リソグラフィ用ペリクル
JP4975838B2 (ja) * 2010-02-23 2012-07-11 株式会社東芝 マスク洗浄方法、マスク洗浄装置及びペリクル
JP5189614B2 (ja) * 2010-03-29 2013-04-24 信越化学工業株式会社 ペリクル及びその取り付け方法、並びにペリクル付マスク及びマスク
JP5285185B2 (ja) 2010-04-02 2013-09-11 信越化学工業株式会社 フォトマスクユニット及びその製造方法
TWI525385B (zh) * 2011-05-18 2016-03-11 Asahi Kasei E Materials Corp A protective film for an adhesive film, a mask for a protective film, and a method for manufacturing a semiconductor element
JP2013057861A (ja) * 2011-09-09 2013-03-28 Shin Etsu Chem Co Ltd リソグラフィ用ペリクルおよびその製造方法
JP5511924B2 (ja) 2012-10-04 2014-06-04 三菱電機株式会社 充電制御装置
JP2015007450A (ja) 2013-06-25 2015-01-15 アキレス株式会社 ２重に真空包装された真空断熱材
JP6308592B2 (ja) 2014-04-02 2018-04-11 信越化学工業株式会社 Ｅｕｖ用ペリクル

Also Published As

Publication number Publication date
CN104977800B (zh) 2019-09-24
EP2927746A3 (en) 2015-12-23
TWI593770B (zh) 2017-08-01
KR102308440B1 (ko) 2021-10-05
KR20150114885A (ko) 2015-10-13
KR102317381B1 (ko) 2021-10-26
US20150286133A1 (en) 2015-10-08
US9341943B2 (en) 2016-05-17
KR20210123252A (ko) 2021-10-13
CN104977800A (zh) 2015-10-14
EP2927746A2 (en) 2015-10-07
EP2927746B1 (en) 2021-09-08
EP3944018A1 (en) 2022-01-26
JP2015200868A (ja) 2015-11-12
TW201542740A (zh) 2015-11-16
JP6308592B2 (ja) 2018-04-11

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