JP6301978B2 - 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 - Google Patents
熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 Download PDFInfo
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- JP6301978B2 JP6301978B2 JP2016012663A JP2016012663A JP6301978B2 JP 6301978 B2 JP6301978 B2 JP 6301978B2 JP 2016012663 A JP2016012663 A JP 2016012663A JP 2016012663 A JP2016012663 A JP 2016012663A JP 6301978 B2 JP6301978 B2 JP 6301978B2
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/166—Material
- H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/16738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/16747—Copper [Cu] as principal constituent
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| JP2016012663A JP6301978B2 (ja) | 2016-01-26 | 2016-01-26 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
| CN201780006145.4A CN108463882B (zh) | 2016-01-26 | 2017-01-13 | 导热片、导热片的制造方法、散热构件和半导体装置 |
| US16/072,334 US10526519B2 (en) | 2016-01-26 | 2017-01-13 | Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device |
| KR1020187009825A KR102075893B1 (ko) | 2016-01-26 | 2017-01-13 | 열전도 시트, 열전도 시트의 제조 방법, 방열 부재 및 반도체 장치 |
| KR1020207016571A KR102151931B1 (ko) | 2016-01-26 | 2017-01-13 | 열전도 시트, 열전도 시트의 제조 방법, 방열 부재 및 반도체 장치 |
| PCT/JP2017/001122 WO2017130755A1 (ja) | 2016-01-26 | 2017-01-13 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
| KR1020197030256A KR20190120421A (ko) | 2016-01-26 | 2017-01-13 | 열전도 시트, 열전도 시트의 제조 방법, 방열 부재 및 반도체 장치 |
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| US11124625B2 (en) * | 2017-05-12 | 2021-09-21 | Dow Silicones Corporation | Polymer composites of high dielectric constant and low dielectric dissipation |
| WO2019004150A1 (ja) * | 2017-06-27 | 2019-01-03 | 積水ポリマテック株式会社 | 熱伝導性シート |
| KR102540533B1 (ko) * | 2018-06-01 | 2023-06-07 | 현대자동차주식회사 | 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품 |
| JP2020116873A (ja) | 2019-01-25 | 2020-08-06 | デクセリアルズ株式会社 | 熱伝導性シートの製造方法 |
| TWI896542B (zh) | 2019-07-23 | 2025-09-11 | 德商漢高股份有限及兩合公司 | 高熱通量多元件總成之熱管理 |
| CN110625877B (zh) * | 2019-09-05 | 2021-06-08 | 上海阿莱德实业股份有限公司 | 一种导热界面材料的制备方法 |
| CN114341273B (zh) * | 2019-09-30 | 2024-05-03 | 积水保力马科技株式会社 | 导热性片和其制造方法 |
| KR102280275B1 (ko) | 2019-11-22 | 2021-07-21 | 더원씨엔티(주) | 탄소복합 방열소재 및 그 제조방법 |
| KR102384315B1 (ko) | 2019-11-25 | 2022-04-07 | 재단법인 한국탄소산업진흥원 | 열가소성수지 기반 열전도성 마스터배치의 제조방법 및 그를 이용한 방열복합소재 |
| JP7458775B2 (ja) * | 2019-12-24 | 2024-04-01 | デクセリアルズ株式会社 | 熱伝導性成形体の製造方法 |
| EP3965150A4 (en) * | 2020-05-15 | 2022-08-31 | Dexerials Corporation | THERMO-CONDUCTIVE SHEET AND METHOD OF MANUFACTURING IT |
| WO2021241249A1 (ja) * | 2020-05-28 | 2021-12-02 | デクセリアルズ株式会社 | 熱伝導シート及びその製造方法、並びに放熱構造体及び電子機器 |
| JP2022064582A (ja) * | 2020-10-14 | 2022-04-26 | 矢崎総業株式会社 | 熱伝導シート、電子機器及び車載装置 |
| WO2022168729A1 (ja) * | 2021-02-03 | 2022-08-11 | デクセリアルズ株式会社 | 熱伝導性シート積層体及びこれを用いた電子機器 |
| JP6983345B1 (ja) * | 2021-02-18 | 2021-12-17 | デクセリアルズ株式会社 | 熱伝導性シート、および電子機器 |
| CN113150558B (zh) | 2021-05-12 | 2021-11-26 | 广东思泉新材料股份有限公司 | 一种定向导热片及其制备方法、及半导体散热装置 |
| US11615999B1 (en) | 2022-07-22 | 2023-03-28 | GuangDong Suqun New Material Co., Ltd | Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device |
| KR102842960B1 (ko) * | 2023-09-11 | 2025-08-06 | 재단법인대구경북과학기술원 | 저자기장을 이용하여 배향이 가능한 열전도성 시트 및 이의 제조방법 |
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| JPS5660324A (en) | 1979-10-23 | 1981-05-25 | Matsushita Electric Ind Co Ltd | Infrared ray detector |
| JPS5671266A (en) | 1979-11-15 | 1981-06-13 | Jeol Ltd | Scanning electron microscope |
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| JP2001315244A (ja) | 2000-05-01 | 2001-11-13 | Jsr Corp | 熱伝導性シート、その製造方法およびその熱伝導性シートを用いた放熱構造 |
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| JP2002088249A (ja) | 2000-09-12 | 2002-03-27 | Polymatech Co Ltd | 熱伝導性高分子組成物及び熱伝導性成形体 |
| US6597575B1 (en) * | 2002-01-04 | 2003-07-22 | Intel Corporation | Electronic packages having good reliability comprising low modulus thermal interface materials |
| JP2005054094A (ja) | 2003-08-06 | 2005-03-03 | Bridgestone Corp | 熱伝導性樹脂材料 |
| JP4791146B2 (ja) | 2005-11-01 | 2011-10-12 | ポリマテック株式会社 | 熱伝導性部材およびその製造方法 |
| JP4897360B2 (ja) * | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
| JP2008266586A (ja) * | 2007-03-27 | 2008-11-06 | Toyoda Gosei Co Ltd | 低電気伝導性高放熱性高分子材料及び成形体 |
| JP5146256B2 (ja) * | 2008-03-18 | 2013-02-20 | 富士通株式会社 | シート状構造体及びその製造方法、並びに電子機器及びその製造方法 |
| US8465666B2 (en) * | 2009-02-25 | 2013-06-18 | Panasonic Corporation | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
| JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
| JP5671266B2 (ja) * | 2010-06-17 | 2015-02-18 | デクセリアルズ株式会社 | 熱伝導性シート |
| TWI610407B (zh) | 2010-06-17 | 2018-01-01 | 迪睿合股份有限公司 | 導熱片及其製造方法 |
| JP5760397B2 (ja) * | 2010-11-15 | 2015-08-12 | 日立化成株式会社 | 熱伝導シート、熱伝導シートの製造方法、及び放熱装置 |
| JP5699556B2 (ja) * | 2010-11-15 | 2015-04-15 | 日立化成株式会社 | 熱伝導シート、熱伝導シートの製造方法、及び放熱装置 |
| JP5660324B2 (ja) | 2011-06-20 | 2015-01-28 | 株式会社豊田中央研究所 | 樹脂組成物およびその製造方法 |
| JP5779693B2 (ja) | 2013-06-27 | 2015-09-16 | デクセリアルズ株式会社 | 熱伝導性シート、及びその製造方法、並びに半導体装置 |
| JP5766335B2 (ja) | 2013-07-01 | 2015-08-19 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び放熱部材 |
| JP5752299B2 (ja) | 2013-07-01 | 2015-07-22 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び放熱部材 |
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| CN108463882B (zh) | 2022-05-13 |
| US10526519B2 (en) | 2020-01-07 |
| WO2017130755A1 (ja) | 2017-08-03 |
| KR102075893B1 (ko) | 2020-02-11 |
| KR102151931B1 (ko) | 2020-09-04 |
| JP2017135211A (ja) | 2017-08-03 |
| KR20180050392A (ko) | 2018-05-14 |
| KR20190120421A (ko) | 2019-10-23 |
| CN108463882A (zh) | 2018-08-28 |
| KR20200070435A (ko) | 2020-06-17 |
| US20190055443A1 (en) | 2019-02-21 |
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