JP5541399B2 - 熱伝導性シート - Google Patents
熱伝導性シート Download PDFInfo
- Publication number
- JP5541399B2 JP5541399B2 JP2013141235A JP2013141235A JP5541399B2 JP 5541399 B2 JP5541399 B2 JP 5541399B2 JP 2013141235 A JP2013141235 A JP 2013141235A JP 2013141235 A JP2013141235 A JP 2013141235A JP 5541399 B2 JP5541399 B2 JP 5541399B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive sheet
- fibrous filler
- heat conductive
- thickness direction
- fibrous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012765 fibrous filler Substances 0.000 claims description 70
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 16
- 239000004917 carbon fiber Substances 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 12
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 10
- 229920002050 silicone resin Polymers 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002893 slag Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- 238000003825 pressing Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000001125 extrusion Methods 0.000 description 8
- -1 etc.) Substances 0.000 description 7
- 229920002725 thermoplastic elastomer Polymers 0.000 description 7
- 238000007906 compression Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- JXOOCQBAIRXOGG-UHFFFAOYSA-N [B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[Al] Chemical compound [B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[Al] JXOOCQBAIRXOGG-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920006235 chlorinated polyethylene elastomer Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229920005555 halobutyl Polymers 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/02—Polysilicates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
まず、繊維状フィラーをバインダ樹脂に分散させることにより熱伝導性シート形成用組成物を調製する。この調製は、繊維状フィラーとバインダ樹脂と必要に応じて配合される各種添加剤や揮発性溶剤とを公知の手法により均一に混合することにより行うことができる。
<工程(B)>
次に、調製された熱伝導性シート形成用組成物から、押出し成形法又は金型成形法により成形体ブロックを形成する。
次に、形成された成形体ブロックをシート状にスライスする。これにより熱伝導性シートが得られる。スライスにより得られるシートの表面(スライス面)には、繊維状フィラーが露出する。スライスする方法としては特に制限はなく、成形体ブロックの大きさや機械的強度により公知のスライス装置(好ましくは超音波カッタ)の中から適宜選択することができる。成形体ブロックのスライス方向としては、成形方法が押出し成形法である場合には、押出し方向に配向しているものもあるために押出し方向に対して60〜120度、より好ましくは70〜100度の方向である。特に好ましくは90度(垂直)の方向である。
必要により、得られた熱伝導性シートのスライス面をプレスすることができる。これにより熱伝導性シートの表面を平滑化して、発熱体や放熱体への密着性を向上させることができる。また、熱伝導性シートを圧縮して、繊維状フィラー同士の接触の頻度を増大させることができる。これにより、熱伝導性シートの熱抵抗を低減させることが可能となる。プレスの方法としては、平盤と表面が平坦なプレスヘッドとからなる一対のプレス装置を使用することができる。また、ピンチロールでプレスしてもよい。
シリコーンA液(ビニル基を有するオルガノポリシロキサン)と、シリコーンB液(ヒドロジェンシリル基を有するオルガノポリシロキサン)と、アルミナ粒子(平均粒子径3μm)と、球状の窒化アルミニウム(平均粒子径1μm)と、ピッチ系炭素繊維(平均長軸長150μm、平均軸径8μm)とを、表1に示す割合(体積部)で均一に混合することにより熱伝導性シート形成用シリコーン樹脂組成物を調製した。
表1の配合に従って熱伝導性シート形成用シリコーン樹脂組成物を調製すること以外、実施例1と同様の操作により成形体ブロック、更に熱伝導性シートを作成した。更に、熱伝導性シートの厚さ方向に配向していないピッチ系炭素繊維の全ピッチ系炭素繊維中の割合をカウントした。得られた結果を表1に示す。
表1の配合に従い熱伝導性シート形成用シリコーン樹脂組成物を調整し、更に、特開2012−23335号公報の押出し成形法により熱伝導性シートを作成し、ピッチ系炭素繊維が(厚さ方向に)配向しやすいその中央部を切り出した。更に、電子顕微鏡で観察し、厚さ方向に配向していないピッチ系炭素繊維の全ピッチ系炭素繊維中の割合をカウントした。得られた結果を表1に示す。
得られた熱伝導性シートに対し、1kgf/cm2の荷重をかけ、表1の圧縮率となった時点の熱抵抗(K/W)をASTM−D5470に準拠した熱抵抗測定装置を用いて測定した。得られた結果を表1に示す。熱抵抗は0.2(K/W)以下、面積換算した値では0.65(K・cm2/W)以下であることが望まれる。
Claims (7)
- 繊維状フィラーがバインダ樹脂に分散してなる熱伝導性シートであって、
熱伝導性シートの一断面を観察した際、“厚さ方向に配置され且つ所定の長さが確認できる繊維状フィラー”を「厚さ方向に配向している繊維状フィラー」とし、繊維状フィラーの全個数に対する「厚さ方向に配置している繊維状フィラー」の個数の割合(%)を求め、得られた数値(%)を100%から減ずることで求められる数値を、「熱伝導性シートの厚さ方向に配向していない繊維状フィラーの全繊維状フィラー中の割合(%)」と定義したときに、
熱伝導性シートの厚さ方向に配向していない繊維状フィラーの全繊維状フィラー中の割合が、45〜95%である熱伝導性シート。
- 繊維状フィラーの平均径が8〜12μmで、アスペクト比が2〜50である請求項1記載の熱伝導性シート。
- 繊維状フィラーがピッチ系炭素繊維である請求項1又は2記載の熱伝導性シート。
- 繊維状フィラーの熱伝導性シート中の含有量が、16〜40体積%である請求項1〜3のいずれかに記載の熱伝導性シート。
- 非繊維状フィラーを更に含有する請求項1〜4のいずれかに記載の熱伝導性シート。
- 非繊維状フィラーが、球状の酸化アルミニウム又は窒化アルミニウムである請求項1〜5のいずれかに記載の熱伝導性シート。
- バインダ樹脂が、シリコーン樹脂である請求項1〜6のいずれかに記載の熱伝導性シート。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013141235A JP5541399B2 (ja) | 2012-07-07 | 2013-07-05 | 熱伝導性シート |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012153147 | 2012-07-07 | ||
JP2012153147 | 2012-07-07 | ||
JP2013141235A JP5541399B2 (ja) | 2012-07-07 | 2013-07-05 | 熱伝導性シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014033193A JP2014033193A (ja) | 2014-02-20 |
JP5541399B2 true JP5541399B2 (ja) | 2014-07-09 |
Family
ID=49915977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013141235A Active JP5541399B2 (ja) | 2012-07-07 | 2013-07-05 | 熱伝導性シート |
Country Status (8)
Country | Link |
---|---|
US (1) | US10106672B2 (ja) |
EP (2) | EP2871674B1 (ja) |
JP (1) | JP5541399B2 (ja) |
KR (4) | KR20180082635A (ja) |
CN (3) | CN107043538B (ja) |
HK (1) | HK1222406A1 (ja) |
TW (1) | TWI609053B (ja) |
WO (1) | WO2014010520A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105990509A (zh) * | 2015-02-02 | 2016-10-05 | 明安国际企业股份有限公司 | 高导热发光二极体 |
CN105199396A (zh) * | 2015-10-17 | 2015-12-30 | 平湖阿莱德实业有限公司 | 一种硅胶基碳材料取向型导热界面材料及其生产方法 |
CN105633131B (zh) * | 2015-12-31 | 2019-11-29 | 台州市一能科技有限公司 | 一种半导体器件的基板 |
CN106928725A (zh) * | 2015-12-31 | 2017-07-07 | 蓝星有机硅(上海)有限公司 | 导电的可固化的有机硅橡胶 |
KR102567381B1 (ko) | 2016-02-25 | 2023-08-14 | 니폰 제온 가부시키가이샤 | 열 전도 시트 및 그 제조 방법, 및 방열 장치 |
CN109104867A (zh) * | 2016-05-10 | 2018-12-28 | 共和理工学院 | 散热器、用于散热器的填料及其方法 |
JP6753745B2 (ja) * | 2016-09-12 | 2020-09-09 | デクセリアルズ株式会社 | 熱伝導シート、及び半導体装置 |
EP3643753A4 (en) * | 2017-06-23 | 2021-03-24 | Sekisui Chemical Co., Ltd. | RESIN MATERIAL, PROCESS FOR THE PRODUCTION OF RESIN MATERIAL, AND LAMINATE |
CN107286465A (zh) * | 2017-06-28 | 2017-10-24 | 常州莱尚纺织品有限公司 | 一种抗拉导热橡塑复合材料及其制备方法 |
JP2019165173A (ja) * | 2018-03-20 | 2019-09-26 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
US12005676B2 (en) * | 2018-04-18 | 2024-06-11 | Nippon Steel Corporation | Composite of metal and carbon-fiber-reinforced plastic and method for manufacturing composite of metal and carbon-fiber-reinforced plastic |
TWI653911B (zh) | 2018-05-30 | 2019-03-11 | 欣興電子股份有限公司 | 封裝載板 |
CN108766659B (zh) * | 2018-06-08 | 2020-05-12 | 济南马世基智能环保科技有限公司 | 一种散热型电缆 |
CN109266298A (zh) * | 2018-08-08 | 2019-01-25 | 宁德时代电机科技有限公司 | 一种高效导热胶 |
CN111410939B (zh) * | 2020-04-09 | 2021-10-22 | 清华大学深圳国际研究生院 | 导热相变储能片及其制备方法 |
CN111320801B (zh) * | 2020-04-24 | 2022-09-13 | 吉林美高管道系统有限公司 | 一种交联聚乙烯导热管材及其制备方法 |
WO2021230047A1 (ja) * | 2020-05-15 | 2021-11-18 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP7343734B1 (ja) * | 2022-02-22 | 2023-09-12 | デンカ株式会社 | 粉末、粉末の製造方法、及び放熱シート |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4814550B1 (ja) | 1969-09-17 | 1973-05-08 | ||
US4888247A (en) * | 1986-08-27 | 1989-12-19 | General Electric Company | Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite |
US5026748A (en) * | 1990-05-07 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Thermally conductive adhesive |
JPH09283955A (ja) * | 1996-04-10 | 1997-10-31 | Matsushita Electric Works Ltd | 放熱シート |
EP0937744A1 (en) * | 1998-02-18 | 1999-08-25 | Nippon Oil Co. Ltd. | Silicone rubber composite |
JP2001160607A (ja) * | 1999-12-02 | 2001-06-12 | Polymatech Co Ltd | 異方性熱伝導性シート |
JP2002046137A (ja) * | 2000-08-04 | 2002-02-12 | Nippon Graphite Fiber Corp | 熱伝導性シートの製造方法 |
US7027304B2 (en) * | 2001-02-15 | 2006-04-11 | Integral Technologies, Inc. | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
US6926955B2 (en) * | 2002-02-08 | 2005-08-09 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
JP4307798B2 (ja) * | 2002-06-13 | 2009-08-05 | 東洋炭素株式会社 | 放熱材料 |
JP2005347616A (ja) * | 2004-06-04 | 2005-12-15 | Fujitsu Ltd | ヒートスプレッダ、電子装置、およびヒートスプレッダ製造方法 |
EP1820870B1 (en) * | 2004-11-09 | 2009-09-02 | Shimane Prefectual Government | METAL-BASEd CARBON FIBER COMPOSITE MATERIAL AND PRODUCTION METHOD THEREOF |
JP4814550B2 (ja) * | 2005-06-03 | 2011-11-16 | ポリマテック株式会社 | 熱伝導性成形体の製造方法 |
KR101007621B1 (ko) * | 2005-11-30 | 2011-01-12 | 시마네켄 | 미크론 사이즈 및 나노 사이즈의 탄소섬유를 모두 함유하는금속기 복합재료 |
JP4897360B2 (ja) * | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
JP5352893B2 (ja) * | 2008-04-14 | 2013-11-27 | 東洋炭素株式会社 | 炭素繊維炭素複合成形体及び炭素繊維強化炭素複合体材料並びにその製造方法 |
JP4743344B2 (ja) * | 2008-05-23 | 2011-08-10 | 日立化成工業株式会社 | 放熱シート及び放熱装置 |
ES2524476T3 (es) * | 2008-07-31 | 2014-12-09 | Toray Industries, Inc. | Preimpregnado, preforma, producto moldeado y procedimiento de fabricación de un preimpregnado |
JP2011035046A (ja) * | 2009-07-30 | 2011-02-17 | Fujitsu Ltd | シート状構造体及びその製造方法 |
KR101715988B1 (ko) | 2010-06-17 | 2017-03-13 | 데쿠세리아루즈 가부시키가이샤 | 열전도성 시트 및 그 제조 방법 |
JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
-
2013
- 2013-07-05 WO PCT/JP2013/068475 patent/WO2014010520A1/ja active Application Filing
- 2013-07-05 CN CN201610953368.9A patent/CN107043538B/zh active Active
- 2013-07-05 CN CN201510473131.6A patent/CN105482456A/zh active Pending
- 2013-07-05 CN CN201380002849.6A patent/CN103748674A/zh active Pending
- 2013-07-05 KR KR1020187019624A patent/KR20180082635A/ko active Search and Examination
- 2013-07-05 JP JP2013141235A patent/JP5541399B2/ja active Active
- 2013-07-05 EP EP13816143.5A patent/EP2871674B1/en active Active
- 2013-07-05 EP EP20203274.4A patent/EP3790044B1/en active Active
- 2013-07-05 US US14/401,954 patent/US10106672B2/en active Active
- 2013-07-05 KR KR1020147036678A patent/KR20150035783A/ko active Application Filing
- 2013-07-05 TW TW102124310A patent/TWI609053B/zh active
- 2013-07-05 KR KR1020217039336A patent/KR102558979B1/ko active IP Right Grant
- 2013-07-05 KR KR1020207007428A patent/KR20200030637A/ko not_active Application Discontinuation
-
2016
- 2016-09-06 HK HK16110561.0A patent/HK1222406A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR102558979B1 (ko) | 2023-07-25 |
US20150166771A1 (en) | 2015-06-18 |
EP3790044B1 (en) | 2023-10-11 |
WO2014010520A1 (ja) | 2014-01-16 |
KR20180082635A (ko) | 2018-07-18 |
CN107043538B (zh) | 2022-05-27 |
JP2014033193A (ja) | 2014-02-20 |
EP2871674B1 (en) | 2020-12-02 |
US10106672B2 (en) | 2018-10-23 |
KR20150035783A (ko) | 2015-04-07 |
CN107043538A (zh) | 2017-08-15 |
TW201418366A (zh) | 2014-05-16 |
KR20210150605A (ko) | 2021-12-10 |
CN105482456A (zh) | 2016-04-13 |
EP2871674A4 (en) | 2016-02-17 |
TWI609053B (zh) | 2017-12-21 |
EP3790044A1 (en) | 2021-03-10 |
EP2871674A1 (en) | 2015-05-13 |
HK1222406A1 (zh) | 2017-06-30 |
CN103748674A (zh) | 2014-04-23 |
KR20200030637A (ko) | 2020-03-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5541399B2 (ja) | 熱伝導性シート | |
JP5541400B2 (ja) | 熱伝導性シートの製造方法 | |
JP6301978B2 (ja) | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 | |
TW201621256A (zh) | 熱傳導片、熱傳導片之製造方法、散熱構件及半導體裝置 | |
JP6393816B2 (ja) | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140205 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20140205 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20140218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140325 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140408 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140421 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5541399 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |