JP5541400B2 - 熱伝導性シートの製造方法 - Google Patents
熱伝導性シートの製造方法 Download PDFInfo
- Publication number
- JP5541400B2 JP5541400B2 JP2013141259A JP2013141259A JP5541400B2 JP 5541400 B2 JP5541400 B2 JP 5541400B2 JP 2013141259 A JP2013141259 A JP 2013141259A JP 2013141259 A JP2013141259 A JP 2013141259A JP 5541400 B2 JP5541400 B2 JP 5541400B2
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- Prior art keywords
- sheet
- conductive sheet
- manufacturing
- pressing
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/4878—Mechanical treatment, e.g. deforming
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C48/25—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
工程(A)
繊維状フィラーをバインダ樹脂に分散させることにより熱伝導性シート形成用組成物を調製する工程;
工程(B)
調製された熱伝導性シート形成用組成物から、押出し成形法又は金型成形法により成形体ブロックを形成する工程;
工程(C)
形成された成形体ブロックをシート状にスライスする工程;及び
工程(D)
得られたシートのスライス面をプレスする工程
を有する製造方法を提供する。
まず、繊維状フィラーをバインダ樹脂に分散させることにより熱伝導性シート形成用組成物を調製する。
次に、調製された熱伝導性シート形成用組成物から、押出し成形法又は金型成形法により成形体ブロックを形成する。
次に、形成された成形体ブロックをシート状にスライスする。スライスにより得られるシートの表面(スライス面)には、繊維上フィラーが露出する。スライスする方法としては特に制限はなく、成形体ブロックの大きさや機械的強度により公知のスライス装置(好ましくは超音波カッタ)の中から適宜選択することができる。成形体ブロックのスライス方向としては、成形方法が押出し成形方法である場合には、押出し方向に配向しているものもあるために押出し方向に対して60〜120度、より好ましくは70〜100度の方向である。特に好ましくは90度(垂直)の方向である。
次に、得られたシートのスライス面をプレスする。これにより熱伝導性シートが得られる。プレスの方法としては、平盤と表面が平坦なプレスヘッドとからなる一対のプレス装置を使用することができる。また、ピンチロールでプレスしてもよい。
シリコーンA液(ビニル基を有するオルガノポリシロキサン)17体積%と、シリコーンB液(ヒドロジェンシリル基を有するオルガノポリシロキサン)16体積%と、アルミナ粒子(平均粒子径3μm)22体積%と、球状の窒化アルミニウム(平均粒子径1μm)22体積%と、ピッチ系炭素繊維(平均長軸長150μm、平均軸径8μm)23体積%とを均一に混合することにより熱伝導性シート形成用シリコーン樹脂組成物を調製した。質量部で換算すると、シリコーン樹脂100質量部に対し、ピッチ系炭素繊維153質量部を混合して熱伝導性シート形成用シリコーン樹脂組成物を調製した。
実施例の成形体ブロックのスライス厚、プレス条件(圧力、温度)を表1に示すように変更すること以外、実施例1と同様の操作で熱伝導性シートを得た。また、プレス後のシート厚と圧縮率とを表1に示す。
プレスを行わないこと以外は、実施例1と同様の操作で熱伝導性シートを得た。
実施例の成形体ブロックのスライス厚、プレス条件(圧力、温度)、ピッチ系炭素繊維の平均長軸長(μm)と平均軸径(μm)とを表1に示すように変更し、また、プレス時にスペーサー(作成したいシートの厚みと同じ厚みを有する25cm角のステンレススチール板に10cm角の穴を4箇所設けたもの)を使用し、更に、実施例46、47についてはシリコーン樹脂100質量部に炭素繊維240質量部を混合し、実施例48〜51についてはシリコーン樹脂100質量部に炭素繊維150質量部を混合すること以外、実施例1と同様の操作で熱伝導性シートを得た。プレス前後のシート厚と圧縮率とを表1に示す。
得られた熱伝導性シートに対し、シートにかかる圧力を表1に示す数値とした上で、それぞれの熱抵抗[(K/W)並びに(K・cm2/W)]をASTM−D5470に準拠した熱抵抗測定装置を用いて測定した。得られた結果を表1に示す。実用上、熱抵抗は、プレス前のシート厚が0.1mm以上0.2mm未満のときには0.4K/W(1.256(K・cm2/W))以下、シート厚が0.2mm以上0.6mm未満のときには0.130K/W(0.41(K・cm2/W))以下、シート厚が0.6mm以上1.0mm未満のときには0.140K/W(0.44(K・cm2/W))以下、シート厚が1.0mm以上3.0mm未満のときには0.5K/W(1.57(K・cm2/W))以下であることが望まれる。
Claims (13)
- 熱伝導性シートの製造方法であって、以下の工程(A)〜(D):
工程(A)
繊維状フィラーをバインダ樹脂に分散させることにより熱伝導性シート形成用組成物を調製する工程;
工程(B)
調製された熱伝導性シート形成用組成物から、押出し成形法又は金型成形法により成形体ブロックを形成する工程;
工程(C)
形成された成形体ブロックをシート状にスライスする工程;及び
工程(D)
得られたシートのスライス面をプレスする工程
を有する製造方法。 - 工程(A)における繊維状フィラーとして、平均径が8〜12μmで、アスペクト比が2〜50の炭素繊維、金属繊維、ガラス繊維又はセラミックス繊維を使用する請求項1記載の製造方法。
- 工程(A)におけるバインダ樹脂が、シリコーン樹脂である請求項1又は2記載の製造方法。
- 熱伝導性シート形成用組成物中の繊維状フィラーの含有量が、バインダ樹脂100質量部に対し120〜300質量部である請求項1〜3のいずれかに記載の製造方法。
- 工程(C)において、押出し成形法により形成された成形体ブロックのスライスの方向が、押出し方向に対し60〜120度である請求項1〜4のいずれかに記載の製造方法。
- 工程(D)において、シートにかかる圧力が1〜8kgf/cm2となるようにプレスする請求項1〜5のいずれかに記載の製造方法。
- 工程(D)において、スペーサーを使用した場合、0.1〜30MPaの設定圧力でプレスする請求項1〜5のいずれかに記載の製造方法。
- 工程(D)において、プレスをバインダ樹脂のガラス転移温度以上に加熱しながら行う請求項1〜7のいずれかに記載の製造方法。
- 工程(D)において、シートの圧縮率が2〜15%となるようにプレスを行う請求項1〜8のいずれかに記載の製造方法。
- 工程(D)において、プレス後にシートの表面光沢度(グロス値)が0.1以上となるようにプレスを行う請求項1〜9のいずれかに記載の製造方法。
- 請求項1〜10のいずれかに記載の製造方法により得られた熱伝導性シート。
- 繊維状フィラーの配向ランダム率が、55〜95%である請求項11記載の熱伝導性シート。
- 発熱体と放熱体と、それらの間に配された請求項11または12記載の熱伝導性シートとからなるサーマルデバイス。
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