HK1196630A1 - Method for producing thermally conductive sheet - Google Patents
Method for producing thermally conductive sheetInfo
- Publication number
- HK1196630A1 HK1196630A1 HK14110001.0A HK14110001A HK1196630A1 HK 1196630 A1 HK1196630 A1 HK 1196630A1 HK 14110001 A HK14110001 A HK 14110001A HK 1196630 A1 HK1196630 A1 HK 1196630A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- thermally conductive
- conductive sheet
- producing thermally
- producing
- sheet
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0011—Combinations of extrusion moulding with other shaping operations combined with compression moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2793/00—Shaping techniques involving a cutting or machining operation
- B29C2793/0027—Cutting off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/267—Intermediate treatments, e.g. relaxation, annealing or decompression step for the melt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2505/00—Use of metals, their alloys or their compounds, as filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2507/00—Use of elements other than metals as filler
- B29K2507/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Combustion & Propulsion (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012153146 | 2012-07-07 | ||
PCT/JP2013/068478 WO2014010521A1 (ja) | 2012-07-07 | 2013-07-05 | 熱伝導性シートの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1196630A1 true HK1196630A1 (en) | 2014-12-19 |
Family
ID=49915978
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14105718.4A HK1192575A1 (zh) | 2012-07-07 | 2014-06-17 | 導熱性片材的製備方法 |
HK14110001.0A HK1196630A1 (en) | 2012-07-07 | 2014-10-08 | Method for producing thermally conductive sheet |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14105718.4A HK1192575A1 (zh) | 2012-07-07 | 2014-06-17 | 導熱性片材的製備方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10336929B2 (xx) |
EP (4) | EP2871205B1 (xx) |
JP (2) | JP5541400B2 (xx) |
CN (2) | CN103748146B (xx) |
HK (2) | HK1192575A1 (xx) |
TW (7) | TWI486387B (xx) |
WO (2) | WO2014010521A1 (xx) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6295238B2 (ja) * | 2014-10-31 | 2018-03-14 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
WO2016068157A1 (ja) * | 2014-10-31 | 2016-05-06 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
JP6178389B2 (ja) * | 2014-12-25 | 2017-08-09 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び半導体装置 |
CN104918468B (zh) * | 2015-06-29 | 2018-06-19 | 华为技术有限公司 | 导热片和电子设备 |
CN105427950A (zh) * | 2015-12-29 | 2016-03-23 | 四川省众能新材料技术开发有限公司 | 一种用于融冰型导线的碳纤维芯棒及其制造方法 |
CN106928725A (zh) * | 2015-12-31 | 2017-07-07 | 蓝星有机硅(上海)有限公司 | 导电的可固化的有机硅橡胶 |
WO2017122817A1 (ja) | 2016-01-14 | 2017-07-20 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
JP6259064B2 (ja) * | 2016-01-14 | 2018-01-10 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
CN107022196A (zh) * | 2016-02-02 | 2017-08-08 | 中兴通讯股份有限公司 | 导热材料、其制备方法及导热件 |
JP6930523B2 (ja) * | 2016-02-25 | 2021-09-01 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法、ならびに放熱装置 |
KR20180116261A (ko) * | 2016-02-25 | 2018-10-24 | 니폰 제온 가부시키가이샤 | 열전도 시트 및 그 제조 방법, 그리고 방열 장치 |
WO2017187940A1 (ja) * | 2016-04-28 | 2017-11-02 | ポリマテック・ジャパン株式会社 | 熱伝導性組成物、熱伝導性シート、および熱伝導性シートの製造方法 |
JP6866610B2 (ja) * | 2016-10-21 | 2021-04-28 | 日本ゼオン株式会社 | 熱伝導シートの製造方法 |
JP6900693B2 (ja) * | 2017-02-07 | 2021-07-07 | 日本ゼオン株式会社 | 熱伝導シート |
US20190037949A1 (en) * | 2017-08-04 | 2019-02-07 | Frisner Nelson | Hat cooling system |
CN111480014B (zh) * | 2017-12-15 | 2022-04-29 | 千住金属工业株式会社 | 滑动构件和轴承 |
JP6844806B2 (ja) * | 2018-11-20 | 2021-03-17 | 積水ポリマテック株式会社 | 熱伝導性シート及びその製造方法 |
JP7363051B2 (ja) * | 2019-02-26 | 2023-10-18 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法 |
US20220300699A1 (en) * | 2019-03-29 | 2022-09-22 | Across Systems Gmbh | Combination therapy to treat cancer and uses thereof |
JP6858437B1 (ja) * | 2019-08-08 | 2021-04-14 | 積水ポリマテック株式会社 | 熱伝導性シート及びその製造方法 |
JP7510265B2 (ja) * | 2020-03-18 | 2024-07-03 | 積水化学工業株式会社 | 熱伝導シート |
JP6980868B1 (ja) * | 2020-08-25 | 2021-12-15 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP6999003B1 (ja) | 2020-09-09 | 2022-01-18 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP7029503B1 (ja) * | 2020-09-14 | 2022-03-03 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
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WO2009110389A1 (ja) | 2008-03-07 | 2009-09-11 | 旭有機材工業株式会社 | 熱硬化性樹脂組成物、繊維強化成形材料及び成形体 |
JP2009215404A (ja) * | 2008-03-10 | 2009-09-24 | Teijin Ltd | シート状熱伝導性成形体 |
EP2343332A4 (en) * | 2008-10-21 | 2017-03-01 | Hitachi Chemical Company, Ltd. | Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same |
CN104962037A (zh) * | 2009-02-25 | 2015-10-07 | 松下电器产业株式会社 | 热传导性组合物和使用它的散热板、散热基板、电路模块、热传导性组合物的制造方法 |
JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
WO2011158942A1 (ja) * | 2010-06-17 | 2011-12-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱伝導性シート及びその製造方法 |
JP5668349B2 (ja) * | 2010-07-22 | 2015-02-12 | 三菱樹脂株式会社 | 放熱性部材及び筐体 |
KR101242812B1 (ko) * | 2010-10-06 | 2013-03-12 | 주식회사 경동원 | 열경화성 수지를 이용한 팽창 퍼라이트 단열재, 이의 제조방법 및 이를 이용한 제품 |
US9057569B2 (en) * | 2010-11-22 | 2015-06-16 | Kabushiki Kaisha Toshiba | Ceramic heat sink material for pressure contact structure and semiconductor module using the same |
JP5798210B2 (ja) * | 2013-07-10 | 2015-10-21 | デクセリアルズ株式会社 | 熱伝導性シート |
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2013
- 2013-07-05 EP EP13816807.5A patent/EP2871205B1/en active Active
- 2013-07-05 TW TW102124311A patent/TWI486387B/zh active
- 2013-07-05 TW TW104106473A patent/TWI589626B/zh active
- 2013-07-05 JP JP2013141259A patent/JP5541400B2/ja active Active
- 2013-07-05 WO PCT/JP2013/068478 patent/WO2014010521A1/ja active Application Filing
- 2013-07-05 US US14/404,741 patent/US10336929B2/en active Active
- 2013-07-05 TW TW109102498A patent/TWI707897B/zh active
- 2013-07-05 CN CN201380002856.6A patent/CN103748146B/zh active Active
- 2013-07-05 EP EP20190473.7A patent/EP3757154A1/en active Pending
- 2013-07-05 TW TW108133353A patent/TW201945450A/zh unknown
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