TWI585130B - Method for manufacturing thermally conductive sheets - Google Patents
Method for manufacturing thermally conductive sheets Download PDFInfo
- Publication number
- TWI585130B TWI585130B TW102124477A TW102124477A TWI585130B TW I585130 B TWI585130 B TW I585130B TW 102124477 A TW102124477 A TW 102124477A TW 102124477 A TW102124477 A TW 102124477A TW I585130 B TWI585130 B TW I585130B
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- thermally conductive
- conductive sheet
- fibrous filler
- pressing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 20
- 239000012765 fibrous filler Substances 0.000 claims description 76
- 238000003825 pressing Methods 0.000 claims description 62
- 239000000203 mixture Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 239000000945 filler Substances 0.000 claims description 22
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 18
- 239000004917 carbon fiber Substances 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 17
- -1 polysiloxane Polymers 0.000 claims description 13
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 11
- 238000001125 extrusion Methods 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 description 8
- 239000005060 rubber Substances 0.000 description 8
- 229920002725 thermoplastic elastomer Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920002098 polyfluorene Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 229920002675 Polyoxyl Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- JXOOCQBAIRXOGG-UHFFFAOYSA-N [B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[Al] Chemical compound [B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[B].[Al] JXOOCQBAIRXOGG-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229920006235 chlorinated polyethylene elastomer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229920005555 halobutyl Polymers 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0011—Combinations of extrusion moulding with other shaping operations combined with compression moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2793/00—Shaping techniques involving a cutting or machining operation
- B29C2793/0027—Cutting off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/267—Intermediate treatments, e.g. relaxation, annealing or decompression step for the melt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2505/00—Use of metals, their alloys or their compounds, as filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2507/00—Use of elements other than metals as filler
- B29K2507/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
本發明係關於一種導熱性片之製造方法。
為了防止驅動時伴隨發熱之IC晶片等發熱體之故障,而使發熱體介隔導熱性片密接於散熱片等散熱體。近年來,作為提高此種導熱性片之導熱性之努力,提出:使用磁場產生裝置,使於熱硬化性樹脂分散有纖維狀填料之層狀熱硬化性樹脂組成物中的該纖維狀填料於層之厚度方向上配向後,使熱硬化性樹脂硬化而製造導熱性片(專利文獻1)。該導熱性片為如下構成:纖維狀填料之端部露出於片之表面,於應用於發熱體與散熱體之間時,纖維狀填料露出之端部沒入導熱性片內。
[專利文獻1]日本專利第4814550號
然而,專利文獻1之技術中,存在如下問題:為了使纖維狀填料如所意圖般地配向而必須使用高成本之磁產生裝置。又,存在如下問題:為了以磁產生裝置使纖維狀填料配向,而必須降低熱硬化性樹脂組成
物之黏度,故而無法使纖維狀填料之含量大幅增加,從而導熱性片之導熱性變得不足夠。進而,亦存在如下問題:根據導熱性片應用於發熱體與散熱體之間之條件,露出之纖維狀填料之端部並未沒入導熱性片內。相反,亦存在如下問題:為了使露出之纖維狀填料之端部完全沒入導熱性片內,於配置於發熱體與散熱體之間時,存在不得不對該等施加妨礙該等正常動作之負荷之情形。
本發明之目的在於解決以上先前技術之問題,而可製造一種導熱性片,於製造該導熱性片時,無需使用高成本之磁產生裝置,並使熱硬化性樹脂組成物中可大量調配纖維狀填料,配置於發熱體與散熱體之間時,即便不對該等施加妨礙該等正常動作之負荷亦顯示良好之導熱性。
本發明者係於使纖維狀填料於導熱性片之厚度方向配向為引發先前技術之問題之主要原因的假設之下,對纖維狀填料之配向狀態進行研究,結果發現,使黏合劑樹脂相對較大量地含有纖維狀填料而製備導熱性片形成用組成物,而且不使用磁產生裝置有意識地使纖維狀填料配向,而僅利用公知之成形法(較佳為擠出成形法或模具成形法)由導熱性片形成用組成物形成成形體塊,並將其切片而形成片,進而對所形成之片進行壓製處理,藉此,可製造能達成上述目的之導熱性片,以至完成本發明。
即,本發明提供一種製造方法,其係導熱性片之製造方法,具有以下步驟(A)~(D):步驟(A)藉由使纖維狀填料及球狀填料分散於黏合劑樹脂而製備導熱性片形成用組成物之步驟;步驟(B)
由製備而成之導熱性片形成用組成物形成成形體塊之步驟;步驟(C)將所形成之成形體塊切片成所需之厚度而形成片之步驟;及步驟(D)對所形成之片之切片面進行壓製之步驟,並以壓製後之片之熱電阻值低於壓製前之片之熱電阻值之方式進行壓製;上述步驟(A)中之纖維狀填料為具有8~12μm之平均直徑與2~50之縱橫比的碳纖維,上述導熱性片形成用組成物中之纖維狀填料及球狀填料之調配量分別為16~40體積%及30~60體積%,上述步驟(C)中形成之片於壓製前之熱電阻值(K.cm2/W)被調整為0.31~1.00。
又,本發明提供一種藉由上述製造方法所獲得之導熱性片、以及將該導熱性片配置於發熱體與散熱體之間之熱器件(thermal device)。
進而,本發明提供一種導熱性片,其係對由以導熱性片形成用組成物所構成之成形體塊所形成的片進行壓製而成者,上述導熱性片形成用組成物係使纖維狀填料及球狀填料分散於黏合劑樹脂而成,纖維狀填料為具有8~12μm之平均直徑與2~50之縱橫比之碳纖維,纖維狀填料及球狀填料分別以16~40體積%及30~60體積%調配於上述導熱性片形成用組成物中,成形體塊中之纖維狀填料之配向隨機率被調整為55~95%之範圍,藉此由成形體塊所形成之片之壓製前之熱電阻值(K.cm2/W)成為0.31~1.00之範圍。
根據本發明之製造方法,使作為纖維狀填料之碳纖維以及球
狀填料兩者合計相對較大量地含有於黏合劑樹脂而製備導熱性片形成用組成物,另一方面,較佳為以纖維狀填料之配向變得隨機之方式形成成形體塊,並將對該成形體塊進行切片所獲得之片之熱電阻值(K.cm2/W)範圍設定為於該片之壓製處理前為0.31~1.00之範圍之故意較高範圍。
於此種成形體塊及將其切片所獲得之片中,纖維狀填料並未於一定方向配向(換言之隨機地配向),故而藉由後續步驟之步驟(D)時之壓製,而促進纖維狀填料彼此接觸。此係由於若纖維狀填料於一定方向、尤其是與壓製方向水平或垂直地配向,則無法期待纖維狀填料彼此因壓製而接觸,但如本發明般,若有意識地使纖維狀填料隨機配向,則隨著黏合劑樹脂之流動或變形,纖維狀填料於片內部互相接觸,故而可製造事後片內部之導熱性得到改善之導熱性片。而且可使片之表面平滑化,故而可製造如下導熱性片,即與發熱體或散熱體之密接性良好,於配置於發熱體與散熱體之間時,即便不對該等施加妨礙該等正常動作之負荷亦顯示良好之導熱性。
本發明之導熱性片之製造方法具有以下步驟(A)~(D)。對每個步驟詳細進行說明。
<步驟(A)>
首先,藉由使纖維狀填料分散於黏合劑樹脂而製備導熱性片形成用組成物。
構成導熱性片形成用組成物之纖維狀填料係用以使來自發
熱體之熱高效地傳導至散熱體者。作為此種纖維狀填料,若平均直徑過小則其比表面積過大而擔心導熱性片形成用組成物之黏度過高,若平均直徑過大則導熱性片之表面凹凸變大,而擔心對發熱體或散熱體之密接性降低,故而較佳為8~12μm。又,其縱橫比(長度/直徑)若過小則有導熱性片形成用組成物之黏度過高之傾向,若過大則有阻礙導熱性片之壓縮之傾向,故而較佳為2~50,更佳為3~30。
作為纖維狀填料之具體例,較佳例如可列舉:碳纖維、金屬纖維(例如鎳、鐵等)、玻璃纖維、陶瓷纖維(例如氧化物(例如氧化鋁、二氧化矽等)、氮化物(例如氮化硼、氮化鋁等)、硼化物(例如硼化鋁等)、碳化物(例如碳化矽等)等非金屬系無機纖維)。
纖維狀填料係根據對導熱性片所要求之機械性質、熱性質、電性質等特性而進行選擇,尤其可較佳地使用碳纖維。其中,就顯示高彈性率、良好之導熱性、高導電性、電波屏蔽性、低熱膨脹性等方面而言,可較佳地使用瀝青系碳纖維。再者,於以後之段落中,只要無特別預先說明,則“纖維狀填料”之用詞意指碳纖維。
纖維狀填料於導熱性片形成用組成物中之含量若過少則有導熱率變低之傾向,若過多則有黏度變高之傾向,因此,纖維狀填料於導熱性片中之含量係藉由調整各種材料之添加量,而較佳為16~40vol%,並相對於構成導熱片形成用組成物之下述黏合劑樹脂100質量份,較佳為120~300質量份,更佳為130~250質量份。
再者,除纖維狀填料以外,於無損本發明之效果之範圍內,可併用板狀填料、鱗片狀填料、球狀填料等。尤其是,就抑制纖維狀填料於導熱性片形成用組成物中之二次凝集之觀點而言,0.1~5μm直徑之球狀填料(較佳為球狀氧化鋁或球狀氮化鋁)之較佳範圍為30~60體積%,更佳為35~50體積%,並相對於纖維狀填料100質量份,較佳為併用100~900
質量份。
黏合劑樹脂係將纖維狀填料保持於導熱性片內者,根據對導熱性片所要求之機械強度、耐熱性、電性質等特性而進行選擇。作為此種黏合劑樹脂,可自熱塑性樹脂、熱塑性彈性體、熱硬化性樹脂之中選擇。
作為熱塑性樹脂,可列舉:聚乙烯、聚丙烯、乙烯-丙烯共聚物等乙烯-α-烯烴共聚物、聚甲基戊烯、聚氯乙烯、聚偏二氯乙烯、聚乙酸乙烯酯、乙烯-乙酸乙烯酯共聚物、聚乙烯醇、聚乙烯醇縮乙醛、聚偏二氟乙烯及聚四氟乙烯等氟系聚合物、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯、聚苯乙烯、聚丙烯腈、苯乙烯-丙烯腈共聚物、丙烯腈-丁二烯-苯乙烯共聚物(ABS)樹脂、聚苯醚共聚物(PPE)樹脂、改質PPE樹脂、脂肪族聚醯胺類、芳香族聚醯胺類、聚醯亞胺、聚醯胺醯亞胺、聚甲基丙烯酸、聚甲基丙烯酸甲酯等聚甲基丙烯酸酯類、聚丙烯酸類、聚碳酸酯、聚苯硫醚、聚碸、聚醚碸、聚醚腈、聚醚酮、聚酮、液晶聚合物、聚矽氧樹脂、離子聚合物等。
作為熱塑性彈性體,可列舉:苯乙烯-丁二烯嵌段共聚物或其氫化物、苯乙烯-異戊二烯嵌段共聚物或其氫化物、苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、聚酯系熱塑性彈性體、聚胺酯系熱塑性彈性體、聚醯胺系熱塑性彈性體等。
作為熱硬化性樹脂,可列舉:交聯橡膠、環氧樹脂、酚樹脂、聚醯亞胺樹脂、不飽和聚酯樹脂、鄰苯二甲酸二烯丙酯樹脂等。作為交聯橡膠之具體例,可列舉:天然橡膠、丙烯酸系橡膠、丁二烯橡膠、異戊二烯橡膠、苯乙烯-丁二烯共聚橡膠、腈橡膠、氫化腈橡膠、氯丁二烯橡膠、乙烯-丙烯共聚橡膠、氯化聚乙烯橡膠、氯磺化聚乙烯橡膠、丁基橡膠、鹵化丁基橡膠、氟橡膠、胺酯橡膠及聚矽氧橡膠。
導熱性片形成用組成物可藉由利用公知之方法均勻地混合
纖維狀填料、黏合劑樹脂、及視需要調配之各種添加劑或揮發性溶劑而製備。
<步驟(B)>
繼而,利用公知之成形方法,由製備而成之導熱性片形成用組成物形成成形體塊。此時,較佳為採用纖維狀填料不於一定方向配向之成形方法。尤佳為利用擠出成形法或模具成形法形成成形體塊。
作為擠出成形法、模具成形法,並無特別限制,可自公知之各種擠出成形法、模具成形法中,根據導熱性片形成用組成物之黏度或對導熱性片所要求之特性等而適當採用。
於擠出成形法中自模嘴擠出導熱性片形成用組成物時,或者於模具成形法中向模具壓入導熱性片形成用組成物時,黏合劑樹脂流動而一部分纖維狀填料沿其流動方向配向,但多數之配向成為隨機。於該情形時,全部纖維狀填料中配向成為隨機之纖維狀填料的比率(纖維狀填料之配向隨機率)若過少則於下述步驟(D)之壓製後互相接觸之纖維狀填料之比率較少,而有導熱性片之導熱性不足夠之傾向,即便過多亦擔心片之厚度方向之導熱性不足夠,故而較佳為55~95%,更佳為60~90%。纖維狀填料之配向隨機率可藉由電子顯微鏡観察進行計數。
再者,配向隨機率為0%之狀態意指單位立方體(例如0.5mm見方)所包含之全部纖維狀填料於某一定方向(例如,片厚度方向)配向的狀態。隨機率為100%之狀態意指單位立方體(例如0.5mm見方)所包含之纖維狀填料中,不存在於某一定方向(例如,片厚度方向)配向之集合的狀態。配向隨機率為50%之狀態意指單位立方體(例如0.5mm見方)所包含之纖維狀填料中,屬於在某一定方向(例如,片厚度方向)配向之集合的纖維狀填料之比率為50%之狀態。因此,配向隨機率為55%之狀態意指單位立方體(例如0.5mm見方)所包含之纖維狀填料中,屬於在某一定
方向(例如,片厚度方向)配向之集合的纖維狀填料之比率為45%之狀態,配向隨機率為95%之狀態意指單位立方體(例如0.5mm見方)所包含之纖維狀填料中,屬於在某一定方向(例如,片厚度方向)配向之集合的纖維狀填料之比率為5%之狀態。
該配向隨機率可藉由觀察片之一剖面時去除配置於厚度方向且可確認特定長度之纖維狀填料而算出。又,藉由增加觀察之剖面數並採取所獲得之配向隨機率之平均值,可提高其數值精度。
成形體塊之大小、形狀可根據所求之導熱性片之大小而決定。例如可列舉:剖面之縱向大小為0.5~15cm橫向大小為0.5~15cm之長方體。長方體之長度視需要決定即可。
<步驟(C)>
繼而,將所形成之成形體塊切片而形成片。該成形體塊與將其切片所獲得之片中的纖維填料之配向程度可視為大致相同。又,於藉由切片所獲得之片之表面(切片面),露出纖維填料。作為切片之方法並無特別限制,可根據成形體塊之大小或機械強度而自公知之切片裝置(較佳為超音波切片機)中適當選擇。作為成形體塊之切片方向,於成形方法為擠出成形方法之情形時,亦有於擠出方向上配向者,故而為相對於擠出方向為60~120度、更佳為70~100度之方向。尤佳為90度(垂直)之方向。
如上所述,於將成形體塊切片所獲得之片中,維持成形體塊之配向隨機率,而且將使用之纖維狀填料特定為碳纖維,亦規定其形狀及調配量之情形時,可將片之壓製前之熱電阻值限定於特定範圍。具體而言,藉由將纖維狀填料設為具有8~12μm之平均直徑與2~50之縱橫比之碳纖維,並將該纖維狀填料及球狀填料之含量分別設為16~40體積%及30~60體積%,而可使進行下述步驟(D)之壓製之前(壓製前)之熱電阻值為超過0.31未達1.00。再者,於測定熱電阻值時,對片施加1kg/cm2之荷重。
將成形體塊切片之寬度(所形成之片之厚度)並無特別限制,可根據導熱性片之使用目的等而適當選擇。此處,關於與熱電阻值之關係,於以步驟(C)中之成形體塊之切片之寬度(所形成之片之片厚)未達0.65mm之方式將成形體塊切片的情形時,片之熱電阻值(K.cm2/W)較佳為超過0.31未達0.47之範圍。於以成為0.65mm以上3mm以下之方式將成形體塊切片之情形時,片之熱電阻值(K.cm2/W)較佳為超過0.47且未達1.00之範圍。
<步驟(D)>
繼而,對所獲得之片之切片面進行壓製。藉此可獲得導熱性片。作為壓製之方法,可使用由壓盤與表面平坦之壓頭所構成之一對壓製裝置。又,亦可以夾送輥進行壓製。
作為壓製時之壓力,通常,若過低則有與未進行壓製之情形相比熱電阻未發生變化之傾向,若過高則有片延伸之傾向。又,於在壓製時使隔件介入以防止延伸之情形時,可較高地設定壓製壓力。通常,對片施加之壓力為1~100kgf/cm2,於未使用隔件之情形時,較佳為2~8kgf/cm2,更佳為3~7kgf/cm2,於使用隔件之情形時,壓製時之設定壓力為0.1~30MPa,較佳為0.5~20MPa。
於本發明中,作為隔件,可使用由與欲製作之片之厚度相同厚度之硬質材料所構成之框架或平板。例如,作為隔件,可例示在與欲製作之片之厚度相同厚度之正方形(例如25cm見方)不鏽鋼板設置4處正方形(例如10cm見方)孔,而形成如漢字“田”般之形狀之框架者,但並不限定於此。
此種壓製係為了進一步提高壓製之效果並縮短壓製時間,較佳為於黏合劑樹脂之玻璃轉移溫度以上進行。通常於0~180℃之溫度範圍內、較佳為室溫(約25℃)~100℃之溫度範圍內、更佳為30~100℃之溫
度範圍內進行壓製。
於本發明中,壓製後之片厚因壓縮而變薄,但若片之壓縮率[{(壓製前之片厚-壓製後之片厚)/壓製前之片厚}×100]過小則有熱電阻不會變小之傾向,若過大則有片延伸之傾向,故而以壓縮率成為2~15%之方式進行壓製。
又,藉由壓製可使片之表面平滑。平滑之程度可以表面光澤度(光澤值)進行評價。若表面光澤度過低則導熱性降低,故而較佳為以於入射角60度反射角60度利用光澤計測定之表面光澤度(光澤值)成為0.2以上的方式進行壓製。
藉由以上說明之導熱性片之製造方法所獲得之該導熱性片亦為本發明之一態樣,其較佳之態樣係纖維狀填料之配向隨機率為55~95%、厚度為0.1~50mm、利用光澤計測定之表面光澤度(光澤值)為0.2以上者。
此種導熱性片可帶來為了使發熱體中產生之熱向散熱體釋放而配置於該等之間之構造的熱器件。作為發熱體,可列舉IC晶片、IC模組等,作為散熱體,可列舉由不鏽鋼等金屬材料所形成之散熱體(heat sink)等。
如以上說明般,導熱性片之熱特性較大地取決於所含有之纖維狀填料之配向隨機率,但其熱性質亦可藉由纖維狀填料以何種角度之差異排列於片之厚度方向來進行評價。具體而言,以50~300倍之光學顯微鏡拍攝導熱性片之一剖面,於將片之表面方向設為90度時,導入拍攝圖像,並求出纖維狀填料之角度分佈,進而求出其標準偏差即可。標準偏差較佳為10°以上。
再者,由本發明之製造方法所獲得之導熱性片其本身可作為“事物”而表現為如下,形成本發明之一態樣。
即,本發明之導熱性片係:“一種導熱性片,係對由以導熱性片形成用組成物所構成之成形體塊所形成的片進行壓製而成者,上述導熱性片形成用組成物係使纖維狀填料及球狀填料分散於黏合劑樹脂而成,纖維狀填料為具有8~12μm之平均直徑與2~50之縱橫比之碳纖維,纖維狀填料及球狀填料分別以16~40體積%及30~60體積%調配於上述導熱性片形成用組成物中,成形體塊中之纖維狀填料之配向隨機率被調整為55~95%之範圍,藉此由成形體塊所形成之片之壓製前之熱電阻值(K.cm2/W)成為0.31~1.00之範圍。”
該導熱性片中之發明之構成具有與本發明之製造方法中說明之內容相同之意義,又,發明之效果亦與由本發明之製造方法製造而成之導熱性片之效果相同。
將聚矽氧A液(具有乙烯基之有機聚矽氧烷)17體積%、聚矽氧B液(具有氫矽烷基之有機聚矽氧烷)16體積%、氧化鋁粒子(平均粒徑3μm)22體積%、球狀之氮化鋁(平均粒徑1μm)22體積%、及瀝青系碳纖維(平均長軸長150μm,平均軸徑8μm)23體積%均勻地混合,藉此製備導熱性片形成用聚矽氧樹脂組成物。若以質量份換算,則相對於聚矽氧樹脂100質量份混合瀝青系碳纖維153質量份,從而製備導熱性片形成用聚矽氧樹脂組成物。
將該導熱性片形成用聚矽氧樹脂組成物流入具有長方體狀內部空間之模具中,於100℃之烘箱中使其加熱硬化6小時,藉此,製作成形體塊。再者,於模具之內面,以剝離處理面成為內側之方式貼附剝離聚對苯二甲酸乙二酯膜。
以超音波切片機將所獲得之成形體塊切片成0.2mm厚而獲得片。於該片之表面,因切片時之剪切力而纖維狀填料之一部分露出於表面,於片表面形成微小凹凸。對該片施加1kgf/cm2之荷重,同時使用依據ASTM-D5470之熱電阻測定裝置測定熱電阻[(K/W)以及(K.cm2/W)]。將所獲得之結果示於表1。該熱電阻值為0.41K.cm2/W。
將以此種方式所獲得之片載置於不鏽鋼壓盤上,以對片施加2kgf/cm2之荷重之方式,於常溫(25℃)以表面經鏡面拋光之平坦之不鏽鋼壓頭壓製30分鐘,藉此,獲得表面平滑之導熱性片。將壓製前、壓製後之片厚與壓縮率示於表1。
再者,以100倍之光學顯微鏡拍攝導熱性片之平面,於將片之表面方向設為90度時,導入拍攝圖像,並求出纖維狀填料之角度分佈,進而求出其標準偏差。角度分佈之平均值為-12.9°,標準偏差為15.6°。
將實施例之成形體塊之切片厚、壓製條件(壓力、溫度)如表1所示般進行變更,除此以外,以與實施例1同樣之操作獲得導熱性片。又,將壓製前、壓製後之片厚與壓縮率示於表1。
未進行壓製,除此以外,以與實施例1同樣之操作獲得導熱性片。
將實施例之成形體塊之切片厚、壓製條件(壓力、溫度)、瀝青系碳纖維之平均長軸長(μm)與平均軸徑(μm)如表1所示般進行變更,又,於壓製時使用隔件(於具有與欲製作之片之厚度相同之厚度的25cm見方之不鏽鋼板中設置有4處10cm見方之孔者),進而,針對實施例46、47於聚矽氧樹脂100質量份混合碳纖維240質量份,針對實施例48~51於聚矽氧樹脂100質量份混合碳纖維150質量份,除此以外,以與實施例1同樣之操
作獲得導熱性片。將壓製前、壓製後之片厚與壓縮率示於表1。
<評價>
對所獲得之導熱性片施加1kgf/cm2之荷重,同時使用依據ASTM-D5470之熱電阻測定裝置測定各自之熱電阻[(K/W)以及(K.cm2/W)]。將所獲得之結果示於表1。實用上,期待熱電阻於壓製前之片厚為0.1mm以上未達0.2mm時為0.4K/W(1.256(K.cm2/W))以下,於片厚為0.2mm以上未達0.6mm時為0.130K/W(0.41(K.cm2/W))以下,於片厚為0.6mm以上未達1.0mm時為0.140K/W(0.44(K.cm2/W))以下,於片厚為1.0mm以上未達3.0mm時為0.5K/W(1.57(K.cm2/W))以下。
再者,於壓製前之片厚為0.1mm以上未達0.2mm時,實用上較理想之熱電阻之上限被設定為高於片厚為0.2mm以上未達0.6mm時之實用上較理想之熱電阻之上限。其原因在於,若片厚過薄,則存在於片中之填料對片表面之影響變大,而片表面之平滑性容易受損。
又,關於實施例6、10、21、25、46~51及比較例1,使用光澤度計(入射角60度、反射角60度)測定表面光澤度(光澤值)。將所獲得之結果示於表1。
表1之實施例1~45之導熱性片係壓製後各片厚分別顯示良好之較低熱電阻。又,已測定表面光澤度之實施例6、10、21、25之導熱性
片之表面光澤度(光澤值)為0.2以上。
又,可知,隨著壓製壓力上升而有熱電阻降低之傾向,隨著壓製溫度上升而有熱電阻上升之傾向,隨著片厚變厚而有熱電阻上升之傾向。
另一方面,於未實施壓製之比較例1之導熱性片之情形時,熱電阻超過0.41K.cm2/W,而且光澤值為0.1,表面光澤度較低。
又,於實施例46之導熱性片之情形時,於壓製時使用隔件,故而將壓製溫度設定較高為100℃,而且碳纖維之平均長軸長相對較短為100μm,故而片之壓縮率非常高為67%。因此,壓製前0.10mm之片厚顯示良好之較低熱電阻。又,表面光澤度(光澤值)為0.1以上。
於實施例47之導熱性片之情形時,將壓製溫度設定為70℃,除此以外,反覆進行與實施例46同樣之操作。因此,壓縮率與實施例46之情形相比變低為約43%,但壓製前0.10mm之片厚顯示良好之較低熱電阻。又,表面光澤度(光澤值)為0.1以上。
於實施例48~51之導熱性片之情形時,於壓製時使用隔件,而且片厚相對較厚,但將壓製壓力設定相對較高為1.2~20MPa,故而壓製前1.55~2.54mm之片厚顯示良好之較低熱電阻。又,表面光澤度(光澤值)為0.2以上。
再者,於如此顯示良好之導熱性之導熱性片,壓製前之熱電阻值顯示0.1~0.32。
根據本發明之製造方法,大部分纖維狀填料係於成形時隨機地配向,但藉由切片後之壓製而片被壓縮,纖維狀填料於片內部互相接觸,故而可製造片內部之導熱性得到改善之導熱性片。而且可使片之表面平滑化,故而可製造如下導熱性片,即與發熱體或散熱體之密接性良好,於配
置於發熱體與散熱體之間時,即便不對該等施加妨礙該等正常動作之負荷亦顯示良好之導熱性。因此,本發明對用以配置於IC晶片或IC模組等發熱體與散熱體之間的導熱性片之製造有用。
Claims (14)
- 一種製造方法,其係導熱性片之製造方法,具有以下步驟(A)~(D):步驟(A)藉由使纖維狀填料及球狀填料分散於黏合劑樹脂而製備導熱性片形成用組成物之步驟;步驟(B)由製備而成之導熱性片形成用組成物形成成形體塊之步驟;步驟(C)將所形成之成形體塊切片成所需之厚度而形成片之步驟;及步驟(D)對所形成之片之切片面進行壓製之步驟,並以壓製後之片之熱電阻值低於壓製前之片之熱電阻值之方式進行壓製;上述步驟(A)中之纖維狀填料為具有8~12μm之平均直徑與2~50之縱橫比的碳纖維,上述導熱性片形成用組成物中之纖維狀填料及球狀填料之調配量分別為16~40體積%及30~60體積%,上述步驟(C)中形成之片之壓製前之熱電阻值(K.cm2/W)被調整為0.31~1.00。
- 如申請專利範圍第1項之製造方法,其中於步驟(B)中,利用擠出成形法或模具成形法形成成形體塊。
- 如申請專利範圍第1或2項之製造方法,其中步驟(A)中之黏合劑樹脂為聚矽氧樹脂。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(C)中形成之片之厚度未達0.65mm之情形時,該片之壓製前之熱電阻值(K.cm2/W)被調整為超過0.31未達0.47之範圍。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(C)中形成之片之厚度為0.65mm以上3mm以下之情形時,該片之壓製前之熱電阻值(K.cm2/W)被調整為超過0.47未達1.00之範圍。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(D)中,以對片施加之壓力為1~8kgf/cm2之壓力進行壓製。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(D)中,於使用隔件之情形時,以0.1~30MPa之設定壓力進行壓製。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(D)中,一面加熱至黏合劑樹脂之玻璃轉移溫度以上一面進行壓製。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(D)中,以片之壓縮率成為2~15%之方式進行壓製。
- 如申請專利範圍第1或2項之製造方法,其中於步驟(D)中,以壓製後片之表面光澤度(光澤值)成為0.1以上之方式進行壓製。
- 一種導熱性片,其係藉由申請專利範圍第1至10項中任一項之製造方法所獲得。
- 如申請專利範圍第11項之導熱性片,其中步驟(B)中成形而成之成形體塊中之纖維狀填料之配向隨機率為55~95%。
- 一種熱器件,其係由發熱體與散熱體、及配置於該等之間之申請專利範圍第11或12項之導熱性片所構成。
- 一種導熱性片,其係對由以導熱性片形成用組成物所構成之成形體塊所形成的片進行壓製而成者,上述導熱性片形成用組成物係使纖維狀填料及球狀填料分散於黏合劑樹脂而成,纖維狀填料為具有8~12μm之平均直徑與2~50之縱橫比之碳纖維,纖維狀填料及球狀填料分別以16~40體積%及30~60體積%調配於上述導熱性片形成用組成物中, 成形體塊中之纖維狀填料之配向隨機率被調整為55~95%之範圍,藉此由成形體塊所形成之片之壓製前之熱電阻值(K.cm2/W)成為0.31~1.00之範圍。
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Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6295238B2 (ja) * | 2014-10-31 | 2018-03-14 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
WO2016068157A1 (ja) * | 2014-10-31 | 2016-05-06 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
JP6178389B2 (ja) * | 2014-12-25 | 2017-08-09 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び半導体装置 |
CN104918468B (zh) * | 2015-06-29 | 2018-06-19 | 华为技术有限公司 | 导热片和电子设备 |
CN105427950A (zh) * | 2015-12-29 | 2016-03-23 | 四川省众能新材料技术开发有限公司 | 一种用于融冰型导线的碳纤维芯棒及其制造方法 |
CN106928725A (zh) * | 2015-12-31 | 2017-07-07 | 蓝星有机硅(上海)有限公司 | 导电的可固化的有机硅橡胶 |
US11296007B2 (en) | 2016-01-14 | 2022-04-05 | Dexerials Corporation | Thermal conducting sheet, method for manufacturing thermal conducting sheet, heat dissipation member, and semiconductor device |
JP6259064B2 (ja) * | 2016-01-14 | 2018-01-10 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
CN107022196A (zh) * | 2016-02-02 | 2017-08-08 | 中兴通讯股份有限公司 | 导热材料、其制备方法及导热件 |
WO2017145954A1 (ja) * | 2016-02-25 | 2017-08-31 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法、ならびに放熱装置 |
JP6930523B2 (ja) * | 2016-02-25 | 2021-09-01 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法、ならびに放熱装置 |
WO2017187940A1 (ja) | 2016-04-28 | 2017-11-02 | ポリマテック・ジャパン株式会社 | 熱伝導性組成物、熱伝導性シート、および熱伝導性シートの製造方法 |
JP6866610B2 (ja) * | 2016-10-21 | 2021-04-28 | 日本ゼオン株式会社 | 熱伝導シートの製造方法 |
JP6900693B2 (ja) * | 2017-02-07 | 2021-07-07 | 日本ゼオン株式会社 | 熱伝導シート |
US20190037949A1 (en) * | 2017-08-04 | 2019-02-07 | Frisner Nelson | Hat cooling system |
CN111480014B (zh) * | 2017-12-15 | 2022-04-29 | 千住金属工业株式会社 | 滑动构件和轴承 |
JP6844806B2 (ja) * | 2018-11-20 | 2021-03-17 | 積水ポリマテック株式会社 | 熱伝導性シート及びその製造方法 |
JP7363051B2 (ja) * | 2019-02-26 | 2023-10-18 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法 |
US20220300699A1 (en) * | 2019-03-29 | 2022-09-22 | Across Systems Gmbh | Combination therapy to treat cancer and uses thereof |
CN114096619B (zh) * | 2019-08-08 | 2023-05-26 | 积水保力马科技株式会社 | 导热片及其制造方法 |
JP6980868B1 (ja) * | 2020-08-25 | 2021-12-15 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP6999003B1 (ja) | 2020-09-09 | 2022-01-18 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP7029503B1 (ja) | 2020-09-14 | 2022-03-03 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP6960554B1 (ja) * | 2021-06-16 | 2021-11-05 | デクセリアルズ株式会社 | 熱伝導シート及び熱伝導シートの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011158942A1 (ja) * | 2010-06-17 | 2011-12-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱伝導性シート及びその製造方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4814550B1 (zh) | 1969-09-17 | 1973-05-08 | ||
JPS5265892A (en) * | 1975-11-26 | 1977-05-31 | Shinetsu Polymer Co | Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof |
JPS5482699A (en) * | 1977-12-15 | 1979-07-02 | Shinetsu Polymer Co | Pressure sensitive resistance element |
US4252391A (en) * | 1979-06-19 | 1981-02-24 | Shin-Etsu Polymer Co., Ltd. | Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof |
JPS56166019A (en) * | 1980-05-26 | 1981-12-19 | Matsushita Electric Works Ltd | Manufacture of resin board |
US4449774A (en) * | 1981-02-05 | 1984-05-22 | Shin-Etsu Polymer Co., Ltd. | Electroconductive rubbery member and elastic connector therewith |
JPS59166019A (ja) * | 1983-03-12 | 1984-09-19 | カワサキ機工株式会社 | 貯蔵茶生葉の管理方法 |
JP2000281802A (ja) | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | 熱伝導性成形体およびその製造方法ならびに半導体装置 |
JP2002088171A (ja) * | 2000-09-13 | 2002-03-27 | Polymatech Co Ltd | 熱伝導性シートおよびその製造方法ならびに放熱装置 |
JP2005347616A (ja) | 2004-06-04 | 2005-12-15 | Fujitsu Ltd | ヒートスプレッダ、電子装置、およびヒートスプレッダ製造方法 |
JP4517341B2 (ja) * | 2004-06-04 | 2010-08-04 | 株式会社ニコン | 露光装置、ノズル部材、及びデバイス製造方法 |
JP4814550B2 (ja) | 2005-06-03 | 2011-11-16 | ポリマテック株式会社 | 熱伝導性成形体の製造方法 |
JP2007084649A (ja) * | 2005-09-21 | 2007-04-05 | Teijin Ltd | 炭素繊維複合シート及びその製造方法 |
US7297399B2 (en) * | 2005-10-11 | 2007-11-20 | General Electric Company | Thermal transport structure and associated method |
JP4897360B2 (ja) * | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
JP5381102B2 (ja) * | 2006-11-01 | 2014-01-08 | 日立化成株式会社 | 熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置 |
WO2008085999A1 (en) * | 2007-01-10 | 2008-07-17 | Momentive Performance Materials Inc. | Thermal interface materials and methods for making thereof |
JP2008211021A (ja) * | 2007-02-27 | 2008-09-11 | Nec Corp | 熱伝導性シート |
WO2008150647A1 (en) * | 2007-05-30 | 2008-12-11 | Georgia-Pacific Chemicals, Llc | Binder compositions for fiber mats, and fiber mats and articles comprising them |
WO2009110389A1 (ja) | 2008-03-07 | 2009-09-11 | 旭有機材工業株式会社 | 熱硬化性樹脂組成物、繊維強化成形材料及び成形体 |
JP2009215404A (ja) * | 2008-03-10 | 2009-09-24 | Teijin Ltd | シート状熱伝導性成形体 |
KR20110085991A (ko) * | 2008-10-21 | 2011-07-27 | 히다치 가세고교 가부시끼가이샤 | 열전도 시트, 그 제조방법 및 이것을 이용한 방열 장치 |
JP5423783B2 (ja) * | 2009-02-25 | 2014-02-19 | パナソニック株式会社 | 熱伝導性組成物とこれを用いた放熱板、放熱基板、回路モジュール、熱伝導性組成物の製造方法 |
JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
JP5668349B2 (ja) * | 2010-07-22 | 2015-02-12 | 三菱樹脂株式会社 | 放熱性部材及び筐体 |
KR101242812B1 (ko) * | 2010-10-06 | 2013-03-12 | 주식회사 경동원 | 열경화성 수지를 이용한 팽창 퍼라이트 단열재, 이의 제조방법 및 이를 이용한 제품 |
KR101472234B1 (ko) * | 2010-11-22 | 2014-12-11 | 가부시끼가이샤 도시바 | 압접 구조용 세라믹 히트 싱크재, 그를 이용한 반도체 모듈 및 반도체 모듈의 제조 방법 |
JP5798210B2 (ja) * | 2013-07-10 | 2015-10-21 | デクセリアルズ株式会社 | 熱伝導性シート |
-
2013
- 2013-07-05 WO PCT/JP2013/068478 patent/WO2014010521A1/ja active Application Filing
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-
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011158942A1 (ja) * | 2010-06-17 | 2011-12-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱伝導性シート及びその製造方法 |
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