JP5381102B2 - 熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置 - Google Patents
熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置 Download PDFInfo
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- JP5381102B2 JP5381102B2 JP2008542104A JP2008542104A JP5381102B2 JP 5381102 B2 JP5381102 B2 JP 5381102B2 JP 2008542104 A JP2008542104 A JP 2008542104A JP 2008542104 A JP2008542104 A JP 2008542104A JP 5381102 B2 JP5381102 B2 JP 5381102B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 172
- 239000002245 particle Substances 0.000 claims description 171
- 229910002804 graphite Inorganic materials 0.000 claims description 154
- 239000010439 graphite Substances 0.000 claims description 154
- 239000000203 mixture Substances 0.000 claims description 50
- 150000001875 compounds Chemical class 0.000 claims description 46
- 229920000620 organic polymer Polymers 0.000 claims description 34
- 239000013078 crystal Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 description 32
- 238000000034 method Methods 0.000 description 28
- 239000003063 flame retardant Substances 0.000 description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 22
- -1 ester compound Chemical class 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 16
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- 230000000694 effects Effects 0.000 description 14
- 229910019142 PO4 Inorganic materials 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- 239000010452 phosphate Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000009826 distribution Methods 0.000 description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 10
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- 230000005484 gravity Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000009835 boiling Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 6
- 238000007710 freezing Methods 0.000 description 6
- 230000008014 freezing Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 241000234587 Canna Species 0.000 description 4
- 235000005273 Canna coccinea Nutrition 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 235000011089 carbon dioxide Nutrition 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 229910021383 artificial graphite Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- AHVOFPQVUVXHNL-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate Chemical compound COC(=O)C(C)=C.CCCCOC(=O)C=C AHVOFPQVUVXHNL-UHFFFAOYSA-N 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 2
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 2
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 2
- TUEZGWWPBHLZTM-UHFFFAOYSA-N (1,2-dimethylcyclohexa-2,4-dien-1-yl) dihydrogen phosphate Chemical compound P(=O)(O)(O)OC1(CC=CC=C1C)C TUEZGWWPBHLZTM-UHFFFAOYSA-N 0.000 description 1
- MFFNRVNPBJQZFO-UHFFFAOYSA-N (2,6-dimethylphenyl) dihydrogen phosphate Chemical compound CC1=CC=CC(C)=C1OP(O)(O)=O MFFNRVNPBJQZFO-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910001410 inorganic ion Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- LMHHRCOWPQNFTF-UHFFFAOYSA-N s-propan-2-yl azepane-1-carbothioate Chemical compound CC(C)SC(=O)N1CCCCCC1 LMHHRCOWPQNFTF-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
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Description
前記黒鉛粒子(A)の鱗片の面方向、楕球の長軸方向又は棒の長軸方向が熱伝導シートの厚み方向に配向しており、熱伝導シートの表面に露出している黒鉛粒子(A)の面積が25%以上80%以下であり、70℃におけるアスカーC硬度が60以下であることを特徴とする熱伝導シートに関する。
前記一次シートを積層して成形体を得、
前記成形体を一次シート面から出る法線に対し0度〜30度の角度でスライスすることを特徴とする熱伝導シートの製造方法に関する。
前記一次シートを黒鉛粒子(A)の配向方向を軸にして捲回して成形体を得、
前記成形体を一次シート面から出る法線に対し0度〜30度の角度でスライスすることを特徴とする熱伝導シートの製造方法に関する。
前記刃部は、前記熱伝導シートの所望の厚みに応じて、前記スリット部からの突出長さが調節可能である前記(13)〜(15)のいずれか一つに記載の熱伝導シートの製造方法に関する。
(Aw/Ad)/((Aw/Ad)+(Bw/Bd)+(Cw/Cd)+・・・)×100
Aw:黒鉛粒子(A)の質量組成(重量%)
Bw:高分子化合物(B)の質量組成(重量%)
Cw:その他の任意成分(C)の質量組成(重量%)
Ad:黒鉛粒子(A)の比重(本発明においてAdは2.25で計算する。)
Bd:高分子化合物(B)の比重
Cd:その他の任意成分(C)の比重
本発明におれる有機高分子化合物(B)は、Tg(ガラス転移温度)が50℃以下、好ましくは−70〜20℃、より好ましくは−60〜0℃である。前記Tgが50℃を超える場合は、柔軟性に劣り、発熱体及び放熱体に対する密着性が不良となる傾向がある。
縦1cm×横1.5cmの熱伝導シートをトランジスタ(2SC2233)とアルミニウム放熱ブロックとの間に挟み、トランジスタを押しつけながら、電流を通じた。トランジスタの温度:T1(℃)と、放熱ブロックの温度:T2(℃)を測定し、測定値と印可電力:W1(W)から、次式によって熱抵抗:X(℃/W)を算出した。
上記の式の熱抵抗:X(℃/W)と熱伝導シートの厚さ:d(μm)、熱伝導率既知試料による補正係数:Cから、次式により熱伝導率:Tc(W/mK)を見積もった。
実施例1
有機高分子化合物(B)としてアクリル酸エステル共重合樹脂(アクリル酸ブチル/アクリロニトリル/アクリル酸共重合体、ナガセケムテックス製、商品名:HTR−280DR、重量平均分子量:90万、Tg−30.9℃、15質量%トルエン溶液、アクリル酸ブチルの共重合量:86質量%)40g、黒鉛粒子(A)として鱗片状の膨張黒鉛粉末(日立化成工業株式会社製、商品名:HGF−L、平均粒子径250μm)12g、難燃剤としてクレジルジ2,6−キシレニルホスフェート(りん酸エステル系難燃剤、大八化学工業株式会社製、商品名:PX−110、凝固点:−14℃、沸点200℃以上)8gを、ステンレス匙で良くかき混ぜた。
有機高分子化合物(B)としてアクリル酸ブチル−メタクリル酸メチルブロック共重合体(株式会社クラレ製、商品名:LA2140、Tg−22℃、アクリル酸ブチルの共重合量:77質量%)40g、アクリル酸ブチル−メタクリル酸メチルブロック共重合体(株式会社クラレ製、商品名:LA1114、Tg−40℃、アクリル酸ブチルの共重合量:93質量%)120g、黒鉛粒子(A)として鱗片状の膨張黒鉛粉末(日立化成工業株式会社製、商品名:HGF−L、平均粒子径250μm)360g、難燃剤として赤燐(燐化学工業株式会社製、商品名:ノーバレッド120)20g及びクレジルジ2,6−キシレニルホスフェート(りん酸エステル系難燃剤、大八化学工業株式会社製、商品名:PX−110、凝固点:−14℃、沸点200℃以上)50g、アクリル酸ブチル−メタクリル酸メチルブロック共重合体・水酸化アルミニウム混合ペレット(株式会社クラレ製、商品名:LA FK010、ポリマ分Tg−22℃、ポリマ分のアクリル酸ブチルの共重合量:77質量%、ポリマ:水酸化アルミニウム(容量比)=55:45)280gをかき混ぜた上、100℃の2本ロール(関西ロール社製、試験用ロール機(8×20Tロール))で混練し、組成物を混練シートの形態で得た。
実施例1と同様にして得た一次シートを2mm×2cmに切りとったものを複数枚積層して2mm角×2cmの角棒を得た。別に実施例1と同様にして得た1次シートを2cm×5cmに切りとったものを多数枚準備し、その1枚を前記角棒に2cmの1辺を付け、ここを中心に巻きつけた。一次シート層間を接着させるため手で押さえながら行った。次の1枚をこの外側に更に巻き付け、以下同様の操作を直径が2cmを超えるまで繰り返した。
有機高分子化合物(B)としてアクリル酸ブチル−アクリル酸エチル−ヒドロキシエチルメタクリレート共重合体(ナガセケムテックス製、商品名:HTR−811DR、重量平均分子量:42万、Tg−43℃、アクリル酸ブチルの共重合量:76質量%)251.9g、黒鉛粒子(A)として鱗片状の膨張黒鉛粉末(日立化成工業株式会社製、商品名:HGF−L、420μm〜1000μm分級品、平均粒子径430μm)542.5g、難燃剤として芳香族縮合りん酸エステル系難燃剤である大八化学工業株式会社製、商品名:CR-741(凝固点:4〜5℃、沸点:200℃以上)213.1gをかき混ぜた上、80℃の2本ロール(関西ロール社製、試験用ロール機(8×20Tロール))で混練し、組成物を混練シートの形態で得た。
実施例4と同じ配合材料にポリイソシアネート(日本ポリウレタン工業(株)製 コロネートHL、NCO含量12.3-13.3%、75%酢酸エチル溶液)8.3gを追加し、以下同様にして組成物を混練シートの形態で得た。
実施例1において作製した一次シートをそのまま熱伝導シート(VI)として評価した。
膨張黒鉛プレスシート(日立化成工業株式会社製、商品名:カーボフィット、厚さ0.1mm、密度1.15g/cm3)を2cm角に切断し、エポキシ系接着剤(コニシ株式会社製、商品名:ボンド クイック5)で張り合わせて100枚積層して厚さ1.1cmの成形体を得た。次いでこの成形体の1.1cm×2cmの積層断面をカッターでスライスして、縦1.1cm×横2cm×厚さ1.5mmの熱伝導シート(VII)を得た。
有機高分子化合物(B)としてアクリル酸エステル共重合樹脂(アクリル酸ブチル/アクリロニトリル/アクリル酸共重合体、ナガセケムテックス製、商品名:HTR−280DR、重量平均分子量:90万、Tg−30.9℃、15質量%トルエン溶液)40gの代わりにメタクリル酸メチルポリマー(和光純薬工業株式会社製、商品名:メタクリル酸メチルポリマー、Tg100℃)14gを用い、難燃剤としてのクレジルジ2,6−キシレニルホスフェートを用いなかったこと以外は実施例1と同様操作にして、縦1.1cm×横2cm×厚さ0.56mmの熱伝導シート(VIII)を得た。
黒鉛粒子(A)として鱗片状の膨張黒鉛粉末(日立化成工業株式会社製、商品名:HGF−L、平均粒子径250μm)の代わりに球状の天然黒鉛(平均粒子径20μm)を用いたこと以外は実施例1と同様に操作にして、縦1.1cm×横2cm×厚さ0.56mmの熱伝導シート(IX)を得た。
Claims (6)
- 鱗片状、楕球状又は棒状であり、結晶中の6員環面が鱗片の面方向、楕球の長軸方向又は棒の長軸方向に配向している黒鉛粒子(A)と、Tgが50℃以下である有機高分子化合物(B)とを含有する組成物を、前記黒鉛粒子(A)の長径の平均値の20倍以下の厚みに圧延成形、プレス成形、押出成形又は塗工し、主たる面に関してほぼ平行な方向に黒鉛粒子(A)が配向した一次シートを作製し、
前記一次シートを積層して成形体を得、
前記成形体を一次シート面から出る法線に対し0度〜30度の角度でスライスすることを特徴とする熱伝導シートの製造方法。 - 鱗片状、楕球状又は棒状であり、結晶中の6員環面が鱗片の面方向、楕球の長軸方向又は棒の長軸方向に配向している黒鉛粒子(A)と、Tgが50℃以下である有機高分子化合物(B)とを含有する組成物を、前記黒鉛粒子(A)の長径の平均値の20倍以下の厚みに圧延成形、プレス成形、押出成形又は塗工し、主たる面に関してほぼ平行な方向に黒鉛粒子(A)が配向した一次シートを作製し、
前記一次シートを黒鉛粒子(A)の配向方向を軸にして捲回して成形体を得、
前記成形体を一次シート面から出る法線に対し0度〜30度の角度でスライスすることを特徴とする熱伝導シートの製造方法。 - 前記成形体を、前記有機高分子化合物(B)のTg+30℃〜Tg−40℃の温度範囲でスライスする請求項1又は2に記載の熱伝導シートの製造方法。
- 前記成形体のスライスは、スリットを有する平滑な盤面と、該スリット部より突出した刃部と、を有するスライス部材を用いて行い、
前記刃部は、前記熱伝導シートの所望の厚みに応じて、前記スリット部からの突出長さが調節可能である請求項1〜3のいずれか一項に記載の熱伝導シートの製造方法。 - 前記平滑な盤面及び/又は前記刃部を温度−80℃〜5℃に冷却してスライスを行う請求項4に記載の熱伝導シートの製造方法。
- 前記成形体のスライスにより、前記黒鉛粒子(A)の分級により求めた重量平均粒子径の2倍以下の厚みの熱伝導シートを得る請求項1〜5のいずれか一項に記載の熱伝導シートの製造方法。
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Also Published As
Publication number | Publication date |
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JP2014001388A (ja) | 2014-01-09 |
US20140293626A1 (en) | 2014-10-02 |
TWI470010B (zh) | 2015-01-21 |
CN102433105B (zh) | 2014-07-30 |
JP2015156490A (ja) | 2015-08-27 |
KR20090074772A (ko) | 2009-07-07 |
US20100073882A1 (en) | 2010-03-25 |
CN101535383A (zh) | 2009-09-16 |
JP6341303B2 (ja) | 2018-06-13 |
CN102433105A (zh) | 2012-05-02 |
CN101535383B (zh) | 2012-02-22 |
TW200829633A (en) | 2008-07-16 |
JP2017141443A (ja) | 2017-08-17 |
JPWO2008053843A1 (ja) | 2010-02-25 |
KR101449075B1 (ko) | 2014-10-08 |
WO2008053843A1 (en) | 2008-05-08 |
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