JP5660039B2 - 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 - Google Patents
熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 Download PDFInfo
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- JP5660039B2 JP5660039B2 JP2011520835A JP2011520835A JP5660039B2 JP 5660039 B2 JP5660039 B2 JP 5660039B2 JP 2011520835 A JP2011520835 A JP 2011520835A JP 2011520835 A JP2011520835 A JP 2011520835A JP 5660039 B2 JP5660039 B2 JP 5660039B2
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- sensitive adhesive
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- monomer
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- 210000004754 hybrid cell Anatomy 0.000 description 1
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- 238000000691 measurement method Methods 0.000 description 1
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- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
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- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
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- OQZCJRJRGMMSGK-UHFFFAOYSA-M potassium metaphosphate Chemical compound [K+].[O-]P(=O)=O OQZCJRJRGMMSGK-UHFFFAOYSA-M 0.000 description 1
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- MQOCIYICOGDBSG-UHFFFAOYSA-M potassium;hexadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCC([O-])=O MQOCIYICOGDBSG-UHFFFAOYSA-M 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
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- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000000941 radioactive substance Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- 229960001755 resorcinol Drugs 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
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- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 description 1
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- GGXKEBACDBNFAF-UHFFFAOYSA-M sodium;hexadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCC([O-])=O GGXKEBACDBNFAF-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- 239000003784 tall oil Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- GTRSAMFYSUBAGN-UHFFFAOYSA-N tris(2-chloropropyl) phosphate Chemical compound CC(Cl)COP(=O)(OCC(C)Cl)OCC(C)Cl GTRSAMFYSUBAGN-UHFFFAOYSA-N 0.000 description 1
- BHYQWBKCXBXPKM-UHFFFAOYSA-N tris[3-bromo-2,2-bis(bromomethyl)propyl] phosphate Chemical compound BrCC(CBr)(CBr)COP(=O)(OCC(CBr)(CBr)CBr)OCC(CBr)(CBr)CBr BHYQWBKCXBXPKM-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- 229940012185 zinc palmitate Drugs 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
- GJAPSKMAVXDBIU-UHFFFAOYSA-L zinc;hexadecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O GJAPSKMAVXDBIU-UHFFFAOYSA-L 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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Description
本発明の熱伝導性感圧接着剤組成物(E)は、ゴム、エラストマー及び樹脂よりなる群から選ばれる少なくとも一種の重合体(S)と、膨張化黒鉛粉(B)及び所定の条件を満たした縮合リン酸エステル(C)とを所定量の含有している。また、所定量のリン酸塩(D)を含有していることが好ましい。以下にこれらの各物質について詳細に説明する。
本発明に用いることができる縮合リン酸エステル(C)は、25℃における粘度が7000mPa・s以上のものである。縮合リン酸エステル(C)の粘度が低すぎる場合は、熱伝導性感圧接着剤組成物(E)を熱伝導性感圧接着性シート(F)にする際の成形性が悪くなる。なお、本発明において縮合リン酸エステル(C)及び後述する非縮合リン酸エステルの「粘度」とは、以下に説明する方法によって測定した粘度を意味する。
縮合リン酸エステル(C)及び非縮合リン酸エステルの粘度測定には、B型粘度計(東京計器株式会社製)を用いて、以下に示す手順で行った。
(1)常温の環境で縮合リン酸エステル(C)又は非縮合リン酸エステルを300ml計量し、500mlの容器に入れる。
(2)攪拌用ロータNo.1、2、3、4、5、6、7から、いずれかを選択し、粘度計に取り付ける。
(3)縮合リン酸エステル(C)又は非縮合リン酸エステルが入った容器を粘度計の上に置き、ロータを該容器内の縮合リン酸エステル(C)又は非縮合リン酸エステルに沈める。このとき、ロータの目印となる凹みが丁度、縮合リン酸エステル(C)又は非縮合リン酸エステルの液状界面にくるように沈める。
(4)回転数を20、10、4、2の中から選択する。
(5)攪拌スイッチを入れ、1分後の数値を読み取る。
(6)読み取った数値に、係数Aを掛け算した値が粘度[mPa・s]となる。
なお、係数Aは、下記表1に示すように、選択したロータNoと回転数とから決まる。
本発明に用いることができる膨張化黒鉛粉(B)の例としては、酸処理した黒鉛を500℃〜1200℃にて熱処理して100ml/g〜300ml/gに膨張させ、次いで、粉砕することを含む工程を経て得られたものを挙げることができる。より好ましくは、黒鉛を強酸で処理した後アルカリ中で焼結し、その後再度強酸で処理したものを500℃〜1200℃にて熱処理して、酸を除去すると共に100ml/g〜300ml/gに膨張させ、次いで、粉砕することを含む工程を経て得られたものを挙げることができる。上記熱処理の温度は、特に好ましくは800℃〜1000℃である。
本発明の熱伝導性感圧接着剤組成物(E)には、重合体(S)が含有されている。重合体(S)を構成するものとしては、ゴム、エラストマー及び樹脂の中から任意に選んだ少なくとも一種を挙げることができる。そして、本発明の熱伝導性感圧接着剤組成物(E)をシート状に成形して熱伝導性感圧接着性シート(F)として用いるためには、重合体(S)に接着性又は粘着性を備えさせることが好ましい。重合体(S)に、接着性又は粘着性を備えさせるためには、ゴム、エラストマー及び樹脂は、接着性又は粘着性を有するものの中から選ぶことが好ましい。しかしながら、接着性又は粘着性を有しないゴム、エラストマー及び樹脂に、粘接着性付与剤を組み合わせて用いることもできる。
熱伝導性感圧接着剤組成物(E)を熱伝導性感圧接着性シート(F)として用いる際に、該熱伝導性感圧接着性シート(F)に接着性・柔軟性を付与させやすいという観点からは、重合体(S)が(メタ)アクリル酸エステル重合体(A)であることが好ましい。
以下、(メタ)アクリル酸エステル重合体(A1)について詳細に説明する。
を挙げることができる。
熱伝導性感圧接着剤組成物(E)を熱伝導性感圧接着性シート(F)とする際に、該熱伝導性感圧接着性シート(F)の成形性を向上させるという観点からは、(メタ)アクリル酸エステル重合体(A)が、(メタ)アクリル酸エステル重合体(A1)の存在下に(メタ)アクリル酸エステル単量体(A2m)を重合することにより得られるものであることが特に好ましい。本発明の熱伝導性感圧接着剤組成物(E)を成形して、熱伝導性感圧接着性シート(F)とする際に、熱伝導性感圧接着剤組成物(E)中の(メタ)アクリル酸エステル単量体(A2m)は、重合して(メタ)アクリル酸エステル重合体に変換する。
熱伝導性感圧接着剤組成物(E)にリン酸塩(D)を所定量含有させれば、熱伝導性感圧接着剤組成物(E)から得られる熱伝導性感圧接着性シート(F)の難燃性をさらに向上させることができる。熱伝導性感圧接着剤組成物(E)にリン酸塩(D)を含有させる場合、含有量は重合体(S)を100質量部として、250質量部以下であることが好ましい。リン酸塩(D)の含有量が多すぎれば、熱伝導性感圧接着剤組成物(E)をシート化することが困難になる。
また、リン酸塩(D)は、窒素含有化合物、硫酸マンガンや酢酸マンガンなどの有機酸マンガン塩、硫酸亜鉛や酢酸亜鉛などの有機酸亜鉛塩、酸化亜鉛、などと併用することが好ましい。
リン酸塩(D)の形態としては、特に限定されないが、粉末状や微粒子状のものが、分散性が高いため好ましい。
本発明の熱伝導性感圧接着剤組成物(E)には、さらに、必要により、非縮合リン酸エステル(縮合されていないリン酸エステル)、発泡剤、外部架橋剤、顔料、その他の充填材、老化防止剤、増粘剤、などの公知の各種添加剤を、本発明の効果を損なわない範囲で含有することができる。
本発明の効果を損なわない範囲において、非縮合リン酸エステルを併用しても良い。ここでいう「非縮合リン酸エステル」とは、縮合されていないリン酸エステルのことを意味する。具体例としては、トリフェニルホスフェート、トリクレジルホスフェート、トリキシレニルホスフェート、クレジルジフェニルホスフェート、クレジル−2,6−キシレニルホスフェート、2−エチルヘキシルジフェニルホスフェートなどの芳香族非縮合リン酸エステル;トリス(β−クロロプロピル)ホスフェート、トリスジクロロプロピルホスフェート、トリス(トリブロモネオペンチル)ホスフェートなどの含ハロゲン系非縮合リン酸エステル;などが挙げられる。この中でも、有害物質(ハロゲンなど)が発生しないことなどから、芳香族非縮合リン酸エステルが好ましい。
非縮合リン酸エステルを使用する際の使用量は、使用する縮合リン酸エステルの量100質量部に対して、30質量部以下が好ましく、10質量部以下がより好ましく、5質量部以下がさらに好ましい。
本発明の熱伝導性感圧接着剤組成物(E)には、それから得られる熱伝導性感圧接着性シート(F)を発泡させるために、発泡剤を添加することもできる。発泡剤としては、熱分解性有機発泡剤が好ましい。さらに、熱分解性有機発泡剤としては、80℃以上かつ200℃以下の分解開始温度を有するものが好ましい。
また、本発明の熱伝導性感圧接着剤組成物(E)には、感圧接着剤としての凝集力を高め、耐熱性などを向上させるために、外部架橋剤を添加して、(メタ)アクリル酸エステル重合体(A1)の存在下に(メタ)アクリル酸エステル単量体(A2m)を重合してなる(メタ)アクリル酸エステル重合体(A)に架橋構造を導入することができる。
顔料としては、カーボンブラックや、二酸化チタンなど、有機系、無機系を問わず使用できる。その他の充填材としては、クレーなどの無機化合物などが挙げられる。フラーレンやカーボンナノチューブなどのナノ粒子を添加してもよい。老化防止剤としては、ラジカル重合を阻害する可能性が高いため通常は使用しないが、必要に応じてポリフェノール系、ハイドロキノン系、ヒンダードアミン系などの酸化防止剤を使用することができる。増粘剤としては、アクリル系ポリマー粒子、微粒シリカなどの無機化合物微粒子、酸化マグネシウムなどのような反応性無機化合物を使用することできる。
本発明の熱伝導性感圧接着性シート(F)は、熱伝導性感圧接着剤組成物(E)のシート状の形態物である。熱伝導性感圧接着剤組成物(E)をシート状に成形して、熱伝導性感圧接着性シート(F)とすることができる。熱伝導性感接着剤組成物(E)をシート状に成形する際には、加熱することが好ましい。
上記した本発明の熱伝導性感圧接着性シート(F)は、電子部品の一部として用いることができる。その際、放熱体のような基材上に直接的に形成して、電子部品の一部として提供することもできる。当該電子部品の具体例としては、エレクトロルミネッセンス(EL)、発行ダイオード(LED)光源を有する機器における発熱部周囲の部品、自動車等のパワーデバイス周囲の部品、太陽電池、バッテリー、携帯電話、携帯情報端末(PDA)、ノートパソコン、液晶、表面伝導型電子放出素子ディスプレイ(SED)、プラズマディスプレイパネル(PDP)、集積回路(IC)などの発熱部を有する機器や部品を挙げることができる。
熱伝導性感圧接着性シート(F)を幅10mm×長さ150mmの大きさに裁断した試験片を5本用意した。ブンゼンバーナーの空気およびガスの流量を調整して高さ20mm程度の青色炎をつくり、垂直に支持した試験片の下端にバーナーの炎をあてて(炎と約10mm交わるように)10秒間保った後、試験片とバーナー炎を離した。その後、試験片の炎が消えれば直ちにバーナー炎を試験片にあて、更に10秒間保持した後、試験片とバーナー炎を離した。この試験によって、UL−94(難燃性規格)の判定を行った。すなわち、1回目と2回目の接炎終了後の有炎燃焼持続時間、2回目の接炎終了後の有炎燃焼持続時間及び無炎燃焼持続時間の合計、5本の試験片の有炎及び無炎燃焼時間の合計、並びに燃焼滴下物(ドリップ)の有無で、V−0に該当するかどうかを判定した。1回目、2回目ともに10秒以内に有炎燃焼を終え、2回目の有炎燃焼持続時間と無炎燃焼時間の合計が30秒以内であって、更に5本の試験片の有炎及び無炎燃焼時間の合計が50秒以内であり、燃焼落下物がないものをV−0とした。すべて燃えたものは、規格外とした。その結果を表2に示す。また、1回目と2回目の接炎終了後の有炎及び無炎燃焼持続時間の合計時間もあわせて示す。
幅25mm×長さ120mm×厚み0.5mmの大きさに裁断した試験片の上に、接触面積が25mm×25mmとなる平板状のセラミックヒータを載せた。このとき、試験片の短辺側の一端とセラミックヒータの一端面とを揃えるようにして載せた。その後、23℃雰囲気下で、セラミックヒータに20Vの電圧を付加し、60分後にセラミックヒータと試験片とを上面側からサーモビジョンで撮影した。セラミックヒータの最も温度が高い部分を確認し、その温度から、セラミックヒータに試験片を接触させてない場合のセラミックヒータの温度を引いた値を熱特性の評価結果とした。熱特性の値が小さいほど、放熱性能が高い。その結果を表2に示す。
後述するように熱伝導性感圧接着性シート(F)を作製して、熱伝導性感圧接着性シート(F)から離型PETを剥がした後、シート状を維持できた場合を「○」、シートが脆く、離型PETを剥離した後シートの形状を維持することができなかった場合を「×」として評価した。その結果を表2に示す。
反応器に、アクリル酸2−エチルヘキシル94%とアクリル酸6%とからなる単量体混合物100部、2,2’−アゾビスイソブチロニトリル0.03部及び酢酸エチル700部を入れて均一に溶解し、窒素置換後、80℃で6時間重合反応を行った。重合転化率は97%であった。得られた重合体を減圧乾燥して酢酸エチルを蒸発させ、粘性のある固体状の(メタ)アクリル酸エステル重合体(A1)を得た。(メタ)アクリル酸エステル重合体(A1)の重量平均分子量(Mw)は270,000、重量平均分子量(Mw)/数平均分子量(Mn)は3.1であった。重量平均分子量(Mw)及び数平均分子量(Mn)は、テトラヒドロフランを溶離液とするゲルパーミエーションクロマトグラフィーにより、標準ポリスチレン換算で求めた。
混合条件:
恒温槽(商品名「ビスコメイト 150III」、東機産業株式会社製)を用いて、ホバート容器の温調を40℃に設定。
1.回転数メモリ3×10分で混合
2.回転数メモリ5×20分で混合
3.回転数メモリ3×10分、−0.1MPaで真空脱泡しながら混合
この熱伝導性感圧接着性シート(F1)について各特性を評価した。その結果を表2に示す。
表2に示すように、各配合物種及びその量を変更した以外は実施例1と同様にして、熱伝導性感圧接着剤組成物(E2)〜(E7)及び(EC1)〜(EC5)、並びに、熱伝導性感圧接着性シート(F2)〜(F7)、及び(FC3)を得た。なお、比較例1〜2及び比較例4〜5の熱伝導性感圧接着剤組成物(EC1)〜(EC2)、(EC4)〜(EC5)については、熱重合後、シートの形状を維持することができなかった。上記熱伝導性感圧接着性シート(F2)〜(F7)、及び(FC3)について、それぞれ、各特性を評価した。その結果を表2に示す。
但し、実施例1で使用していないものについては、下記に示すものを用いた。
実施例6で用いた縮合リン酸エステル(C):商品名「CR−733s」、大八化学工業株式会社製、粘度:7800mPa・s(25℃)、大気圧下での15℃〜100℃の温度領域において常に液体、化合物名「1,3−フェニレンビス(ジフェニルホスフェート)」。
比較例5で用いた縮合リン酸エステル:商品名「PX−200」、大八化学工業株式会社製、常温(25℃)で固体。
比較例1で用いたリン酸エステル:商品名「レオフォス65」、味の素ファインテック株式会社製、粘度:5800mPa・s(25℃)、大気圧下での15℃〜100℃の温度領域において常に液体。
実施例2〜7及び比較例3〜5で用いたリン酸塩(D):商品名「FP−2200」、株式会社ADEKA製。
比較例2で用いたリンペン状黒鉛:伊藤黒鉛工業株式会社製、商品名「W−5」、平均粒径:5μm。
(実施例A)
市販のLED照明(日立ライティング株式会社製、LES7L/K6N−A)を分解し、LEDチップを搭載した基板の裏側に、実施例1の熱伝導性感圧接着性シート(F1)を60cm×60cmの大きさに切って貼り付け、再度組み立てた後、点灯させた。LED照明を60分間点灯したときのLEDチップ上の拡散板の表面温度をサーモビジョンで測定した。結果を表3に示す。
実施例1の熱伝導性感圧接着性シート(F1)にかえて実施例7の熱伝導性感圧接着性シート(F7)を使用した以外は、実施例Aと同様にして評価を行った。結果を表3に示す。
市販のLED照明(日立ライティング株式会社製/LES7L/K6N−A)を60分間点灯したときのLEDチップ上の拡散板の表面温度をサーモビジョンで測定した。結果を表3に示す。
実施例1の熱伝導性感圧接着性シート(F1)にかえて市販の0.5W/m・Kの熱伝導性感圧接着性シートを使用した以外は、実施例Aと同様にして評価を行った。結果を表3に示す。
実施例1の熱伝導性感圧接着性シート(F1)にかえて比較例1で作製したシート状粉体(比較例1の熱伝導性感圧接着剤組成物(EC1)は、重合後にシート形状を維持できなかったため、「シート状粉体」と呼ぶ。)を使用した以外は、実施例Aと同様にして評価を行った。結果を表3に示す。
Claims (5)
- (メタ)アクリル酸エステル重合体(A1)の存在下に、(メタ)アクリル酸エステル単量体(A2m)を重合することにより得られる(メタ)アクリル酸エステル重合体(A)100質量部と、
150質量部以上2000質量部以下の膨張化黒鉛粉(B)と、
75質量部以上850質量部以下の縮合リン酸エステル(C)と、を含み、
前記縮合リン酸エステル(C)は、25℃における粘度が7000mPa・s以上であり、かつ、大気圧下、15℃以上100℃以下の温度領域において常に液体である、
熱伝導性感圧接着剤組成物(E)。 - さらに250質量部以下のリン酸塩(D)を含む、請求項1に記載の熱伝導性感圧接着剤組成物(E)。
- 請求項1又は2に記載の熱伝導性感圧接着剤組成物(E)のシート状の形態物である、熱伝導性感圧接着性シート(F)。
- (メタ)アクリル酸エステル重合体(A1)及び(メタ)アクリル酸エステル単量体(A2m)の合計100質量部と、
膨張化黒鉛粉(B)150質量部以上2000質量部以下と、
25℃における粘度が7000mPa・s以上であり、かつ、大気圧下、15℃以上100℃以下の温度領域において常に液体である縮合リン酸エステル(C)75質量部以上850質量部以下と、
を含んでなる熱伝導性感圧接着剤組成物(E)をシート状に成形しながら、又はシート状に成形した後、該熱伝導性感圧接着剤組成物(E)中の(メタ)アクリル酸エステル重合体(A1)の存在下に該熱伝導性感圧接着剤組成物(E)中の(メタ)アクリル酸エステル単量体(A2m)を重合することにより得られる該熱伝導性感圧接着剤組成物(E)の固化物(E’)のシート状の形態物である、熱伝導性感圧接着性シート(F)。 - 請求項3又は4に記載の熱伝導性感圧接着性シート(F)を備えた電子部品。
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