JP6296195B1 - 樹脂封止用金型の調整方法及び樹脂封止用金型 - Google Patents

樹脂封止用金型の調整方法及び樹脂封止用金型 Download PDF

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Publication number
JP6296195B1
JP6296195B1 JP2017141916A JP2017141916A JP6296195B1 JP 6296195 B1 JP6296195 B1 JP 6296195B1 JP 2017141916 A JP2017141916 A JP 2017141916A JP 2017141916 A JP2017141916 A JP 2017141916A JP 6296195 B1 JP6296195 B1 JP 6296195B1
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JP
Japan
Prior art keywords
mold
resin
resin sealing
cavity
spacer
Prior art date
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Active
Application number
JP2017141916A
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English (en)
Japanese (ja)
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JP2019018530A (ja
Inventor
宏明 宮原
宏明 宮原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I Pex Inc
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Priority to JP2017141916A priority Critical patent/JP6296195B1/ja
Application granted granted Critical
Publication of JP6296195B1 publication Critical patent/JP6296195B1/ja
Priority to CN201880004487.7A priority patent/CN109982821B/zh
Priority to PCT/JP2018/024875 priority patent/WO2019017186A1/ja
Priority to KR1020197014113A priority patent/KR102188767B1/ko
Priority to TW107124002A priority patent/TWI720327B/zh
Publication of JP2019018530A publication Critical patent/JP2019018530A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2017141916A 2017-07-21 2017-07-21 樹脂封止用金型の調整方法及び樹脂封止用金型 Active JP6296195B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017141916A JP6296195B1 (ja) 2017-07-21 2017-07-21 樹脂封止用金型の調整方法及び樹脂封止用金型
CN201880004487.7A CN109982821B (zh) 2017-07-21 2018-06-29 树脂密封用模具的调整方法及树脂密封用模具
PCT/JP2018/024875 WO2019017186A1 (ja) 2017-07-21 2018-06-29 樹脂封止用金型の調整方法及び樹脂封止用金型
KR1020197014113A KR102188767B1 (ko) 2017-07-21 2018-06-29 수지 밀봉 금형의 조정 방법 및 수지 밀봉 금형
TW107124002A TWI720327B (zh) 2017-07-21 2018-07-12 樹脂密封用模具之調整方法以及樹脂密封用模具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017141916A JP6296195B1 (ja) 2017-07-21 2017-07-21 樹脂封止用金型の調整方法及び樹脂封止用金型

Publications (2)

Publication Number Publication Date
JP6296195B1 true JP6296195B1 (ja) 2018-03-20
JP2019018530A JP2019018530A (ja) 2019-02-07

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JP2017141916A Active JP6296195B1 (ja) 2017-07-21 2017-07-21 樹脂封止用金型の調整方法及び樹脂封止用金型

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Country Link
JP (1) JP6296195B1 (zh)
KR (1) KR102188767B1 (zh)
CN (1) CN109982821B (zh)
TW (1) TWI720327B (zh)
WO (1) WO2019017186A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976666B (zh) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 一种应用于压缩成形的模具上的动平衡缓冲机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011011426A (ja) * 2009-07-01 2011-01-20 Apic Yamada Corp 樹脂モールド金型及び樹脂モールド装置
JP2013028087A (ja) * 2011-07-29 2013-02-07 Apic Yamada Corp モールド金型及びこれを用いた樹脂モールド装置
WO2016203779A1 (ja) * 2015-06-19 2016-12-22 第一精工株式会社 電子部品封止金型、トランスファー成形機および電子部品封止方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100196494B1 (ko) * 1996-09-21 1999-06-15 김규현 Bga 반도체패키지용 몰드금형의 pcb 클램프장치
JPH10258445A (ja) * 1997-03-19 1998-09-29 Oki Electric Ind Co Ltd 半導体装置の樹脂封止用金型
JP3859457B2 (ja) * 2001-03-27 2006-12-20 沖電気工業株式会社 半導体装置の製造方法
JP2003053791A (ja) 2001-08-22 2003-02-26 Mitsubishi Electric Corp 半導体製造装置及び該装置により製造された半導体装置
JP4607429B2 (ja) * 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
CN101497221B (zh) * 2008-01-31 2012-06-20 鸿富锦精密工业（深圳）有限公司 模具及其调整方法
KR101139261B1 (ko) * 2010-03-10 2012-05-15 티에스테크놀로지 주식회사 반도체 패키지 제조용 금형 장치
CN201745133U (zh) * 2010-06-30 2011-02-16 四川省宜宾普什模具有限公司 可调节产品局部成型厚度的模具
WO2013047753A1 (ja) 2011-09-29 2013-04-04 Ｓｃｉｖａｘ株式会社 成形装置及び成形方法、インプリント用型、並びに当該インプリント用型を用いたインプリント方法
JP5930394B2 (ja) 2012-07-06 2016-06-08 アピックヤマダ株式会社 樹脂モールド装置
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011011426A (ja) * 2009-07-01 2011-01-20 Apic Yamada Corp 樹脂モールド金型及び樹脂モールド装置
JP2013028087A (ja) * 2011-07-29 2013-02-07 Apic Yamada Corp モールド金型及びこれを用いた樹脂モールド装置
WO2016203779A1 (ja) * 2015-06-19 2016-12-22 第一精工株式会社 電子部品封止金型、トランスファー成形機および電子部品封止方法

Also Published As

Publication number Publication date
KR20190070949A (ko) 2019-06-21
CN109982821A (zh) 2019-07-05
TW201908103A (zh) 2019-03-01
CN109982821B (zh) 2021-01-22
KR102188767B1 (ko) 2020-12-08
JP2019018530A (ja) 2019-02-07
TWI720327B (zh) 2021-03-01
WO2019017186A1 (ja) 2019-01-24

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